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US5093186A Expired / Lapsed US ⏱️ 0.0 years remaining

Multilayer ceramic wiring board

Assignee: Niterra Co Ltd
•
Filing: 1990-09-19
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Granted: 1992-03-03
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Expires: 2010-09-19
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Abstract

Abstract A multilayer ceramic wiring board including a ceramic board having a plurality of through-holes and formed by laminating three or more green sheets of a ceramic material and burning a laminate of the green sheets, and a plurality of conductors provided in the through-holes. Each of the conductors is formed of a ceramic material and a conductive material in combination. The ceramic board is composed of a pair of upper and lower layer portions each having at least an outermost surface layer and an inner layer portion disposed between the upper and lower portions. The conductors are composed of an outer conductor portion formed in the upper and lower layer portions and an inner conductor portion formed in the inner layer portion. The outer conductor portion has a content ratio of the ceramic material higher than that of the inner conductor portion. Accordingly, the generation of cracks in the outer conductor portion disposed at the upper and lower layer portions of the ceramic board can be prevented, and an electric resistance can be reduced.

Inventors

  • 👤 Yukihiro Kimura
  • 👤 Nobuhiko Miyawaki
  • 👤 Sumihito Tominaga
  • 👤 Rokuro Kanbe

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 07:09
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4061; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0269; H05K2201/06; H05K2201/068; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 185 words
A multilayer ceramic wiring board comprising: a ceramic board having a plurality of through holes formed by laminating three or more green sheets of a ceramic material and burning a laminate of the green sheets, the ceramic board including a pair of upper and lower layer portions each having at least an outermost surface layer, and an inner layer portion disposed between the upper and lower layer portions; and a plurality of conductors provided in the through holes, each of the conductors including a combination of ceramic material and conductive material, the conductors including an outer conductor portion formed in the upper and lower layer portions, and an inner conductor portion formed in the inner layer portion, the conductors comprising ceramic material and conductive material wherein the outer conductor portion has a greater ratio by weight of ceramic material to conductive material than that ratio for the inner conductor portion wherein the difference between the ratio of the weight of the ceramic material to the weight of the conductive material between the outer conductor portion and inner conductor portion is in the range of 0.08-0.30.
Claim 2
Dependent Claim 185 words
A multilayer ceramic wiring board comprising: a ceramic board having a plurality of through holes formed by laminating three or more green sheets of a ceramic material and burning a laminate of the green sheets, the ceramic board including a pair of upper and lower layer portions each having at least an outermost surface layer, and an inner layer portion disposed between the upper and lower layer portions; and a plurality of conductors provided in the through holes, each of the conductors including a combination of ceramic material and conductive material, the conductors including an outer conductor portion formed in the upper and lower layer portions, and an inner conductor portion formed in the inner layer portion, the conductors comprising ceramic material and conductive material wherein the outer conductor portion has a greater ratio by weight of ceramic material to conductive material than that ratio for the inner conductor portion wherein the difference between the ratio of the weight of the ceramic material to the weight of the conductive material between the outer conductor portion and inner conductor portion is in the range of 0.08-0.30.
Claim 3
Dependent Claim 55 words
The multilayer ceramic wiring board as claimed in claim 1 wherein the ceramic board comprises a material selected from alumina and aluminum nitride, and wherein the ceramic material of the conductors includes a material selected from alumina and aluminum nitride, and the conductive material of the conductors includes a material selected from tungsten and molybdenum.
Claim 4
Dependent Claim 49 words
The multilayer ceramic wiring board as claimed in claim 1, wherein the content of ceramic material in the outer conductor portion is in the range of 20-30 wt % and the content of the ceramic material in the inner conductor portion is in the range of 10-15 wt %.
Claim 5
Dependent Claim 31 words
The multilayer ceramic wiring board as claimed in claim 1 wherein each of said upper and lower layer portions has a thickness at least 0.6 times the diameter of the conductors.
Claim 6
Dependent Claim 84 words
The multilayer ceramic wiring board as claimed in claim 1 wherein the ceramic board and the ceramic material of the conductors consists essentially of alumina, and the conductive material of the conductors consists essentially of a mixture of tungsten and molybdenum, and wherein the difference between the ratio of the weight of the ceramic material to the conductive material in the outer conductor portion and the ratio by weight of the ceramic material to the conductive material in the inner conductor portion is 0.12-0.24.
Claim 7
Dependent Claim 42 words
The multilayer ceramic wiring board as claimed in claim 5 wherein the conductor has a diameter of 0.17-0.25 mm, and the conductors are arranged having a distance between centers of adjoining conductors of 2 to 4 times the diameter of the conductors.

References Cited (Backward Citations)

US4465727A Cited
JPS59172295A Cited
JPS6053098A Cited
JPS60257196A Cited
JPS6123393A Cited
US4835039A Cited
JPS645097A Cited
JPS645098A Cited
JPH0260889A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-03-03 1995-09-02 1996-03-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-03-03 1999-09-02 2000-03-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-03-03 2003-09-02 2004-03-03 $7700.00 Window Closed / Lapsed

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