Ceramic multilayer interconnection substrate

Abstract

Abstract PURPOSE:To prevent a ceramic member from cracking, to reduce resistance of a conductor, and to increase a wiring density, by employing alumina, molybdenum, and tungsten for respective materials if an insulating layer, a conductive layer filling a through hole, and a wiring layer. CONSTITUTION:Insulating layers 1, 5 are made of alumina. A conductive layer 3 which fills a through hole 2 is made of molybdenum. And a wiring layer 4 is made of tungsten. Then, the through hole 2 is so filled with a conductive layer 3 of molybdenum whose thermal expansion coefficient is closer to that of alumina rather than that of tungsten that cracks are difficult to be generated in the part A. Accordingly, generation of warpage resulting from mismatch of the coefficient of contraction between the green sheet and the wiring layer 4 is reduced effectively. Therefore, the resistance of a conductor is reduced, and the wiring density is increased.

Inventors

• 👤 Yoshiya Kudou

Bibliographic Details