US5091048A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ion milling to obtain planarization
Assignee: National Semiconductor Corp
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Filing: 1990-09-17
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Granted: 1992-02-25
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Expires: 2010-09-17
Abstract
Abstract The surface of a semiconductor wafer is planarized by disposing the wafer in a wafer plane and rotating the wafer within the wafer plane wherein the rotation is around an axis perpendicular to the plane. A stream of particles is transported to the surface of the wafer while the wafer is rotating wherein the angle between the stream of particles and the wafer plane is small. The stream of particles mills the surface of the wafer thereby planarizing the surface of the wafer. The angle between the stream of particles and the wafer plane is preferably less than thirty degrees. The particles may be argon ions and may be chemically active particles or physical particles.
Inventors
- 👤 Michael E. Thomas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 12:50
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/06; H10P95/062; H10P95/064; H10P50/00; H10P50/20; H10P50/28; H10P50/282; Y; Y10; Y10S; Y10S438/00; Y10S438/961
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
99 words
A method for planarizing a topographical semiconductor device formed of semiconductor device material disposed in a semiconductor device plane and having elevated topographical features extending beyond the surface of said semiconductor device, comprising the steps of: providing particles from a particle source, and transporting said particles to said semiconductor device at an angle of incidence of said transported particles with respect to said semiconductor device plane less than approximately thirty degrees thereby removing said material from said elevated topographical features at a faster rate than from said surface to mill said semiconductor device by means of said transported particles.
Claim 2
Independent Claim
99 words
A method for planarizing a topographical semiconductor device formed of semiconductor device material disposed in a semiconductor device plane and having elevated topographical features extending beyond the surface of said semiconductor device, comprising the steps of: providing particles from a particle source, and transporting said particles to said semiconductor device at an angle of incidence of said transported particles with respect to said semiconductor device plane less than approximately thirty degrees thereby removing said material from said elevated topographical features at a faster rate than from said surface to mill said semiconductor device by means of said transported particles.
Claim 3
Dependent Claim
35 words
The method for planarizing a topographical semiconductor device of claim 1, wherein said angle of incidence of said transported particles with respect to said device plane is between approximately ten degrees and approximately thirty degrees.
Claim 4
Dependent Claim
32 words
The method for planarizing a topographical semiconductor device of claim 1, wherein said particles are transported substantially evenly over said topographical semiconductor device to average the particle flux over said semiconductor device.
Claim 5
Dependent Claim
29 words
The method for planarizing the surface of a topographical semiconductor device of claim 1, comprising the further step of moving said semiconductor device with respect to said particle source.
Claim 6
Dependent Claim
46 words
The method for planarizing a topographical semiconductor device of claim 4, wherein the step of moving said semiconductor device with respect to said particle source comprises rotating said semiconductor device within said device plane while transporting said particles from said particle source to said semiconductor device.
Claim 7
Dependent Claim
34 words
The method for planarizing a topographical semiconductor device of claim 4, wherein the stop of moving said semiconductor device with respect to said particle source comprises rotating said particle source over said semiconductor device.
Claim 8
Dependent Claim
30 words
The method for planarizing the surface of a topographical semiconductor device of claim 1, comprising the further step of providing particles from a plurality of circularly symmetrically arranged particle sources.
Claim 9
Dependent Claim
32 words
The method for planarizing the surface of a topographical semiconductor device of claim 1, wherein said transporting of said particles from said particle source comprises transporting ionic particles in an ion beam.
Claim 10
Dependent Claim
21 words
The method for planarizing the surface of a topographical semiconductor device of claim 8, wherein said ionic particles comprise argon ions.
Claim 11
Dependent Claim
23 words
The method for planarizing a topographical semiconductor device of claim 1, wherein said transporting of said particles comprises transporting a chemically active species.
Claim 12
Dependent Claim
24 words
The method for planarizing a topographical semiconductor device of claim 10, wherein said transporting of said chemically particles comprises transporting chemically active ionic particles.
Claim 13
Dependent Claim
23 words
The method for planarizing a topographical semiconductor device of claim 10, wherein said transporting of said chemically active particles comprises transporting a fluorocarbon.
Claim 14
Dependent Claim
34 words
The method for planarizing a topographical semiconductor device of claim 12, wherein said transported fluorocarbon is selected from the group consisting of CF 4 , CHF 3 , and C 2 F 6 .
Claim 15
Dependent Claim
29 words
The method for planarizing a topographical semiconductor device of claim 10, wherein said chemically reactive species is electrically biased and accelerated towards said semiconductor device by an electrical field.
Claim 16
Dependent Claim
108 words
A semiconductor integrated circuit fabrication device for planarizing a topographical semiconductor device formed of semiconductor device material, said semiconductor device disposed in a device plane and having elevated topographical features extending beyond the surface of said semiconductor device, comprising: particle source means for providing a supply of particles, and means for transporting said particles to said semiconductor device at an angle of incidence of said transported particles with respect to said semiconductor device plane less than approximately thirty degrees thereby removing said material from said elevated topographical features at a faster rate than from said surface to mill said said semiconductor device by means of said transported particles.
Claim 17
Dependent Claim
108 words
A semiconductor integrated circuit fabrication device for planarizing a topographical semiconductor device formed of semiconductor device material, said semiconductor device disposed in a device plane and having elevated topographical features extending beyond the surface of said semiconductor device, comprising: particle source means for providing a supply of particles, and means for transporting said particles to said semiconductor device at an angle of incidence of said transported particles with respect to said semiconductor device plane less than approximately thirty degrees thereby removing said material from said elevated topographical features at a faster rate than from said surface to mill said said semiconductor device by means of said transported particles.
Claim 18
Dependent Claim
47 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, wherein said means for transporting said particles comprises means for transporting particles at an angle of incidence of said transported particles with respect to said wafer plane between approximately ten degrees and approximately thirty degrees.
Claim 19
Dependent Claim
37 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, wherein particles from said particle source means are transported substantially evenly over said topographical semiconductor device to average the particle flux over said semiconductor device.
Claim 20
Dependent Claim
27 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, further comprising means for moving said semiconductor device with respect to said particle source means.
Claim 21
Dependent Claim
51 words
The fabrication device for planarizing a topographical semiconductor device of claim 18, wherein said means for moving said semiconductor device with respect to said particle source means comprises means for rotating said semiconductor device within said wafer plane while transporting said particles from said particle source means to said semiconductor device.
Claim 22
Dependent Claim
39 words
The fabrication device for planarizing a topographical semiconductor device of claim 18, wherein said means for moving said semiconductor device with respect to said particle source means comprises means for rotating said particle source means over said semiconductor device.
Claim 23
Dependent Claim
32 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, wherein said particle source means for providing a supply of particles comprises a plurality of circularly symmetrically arranged particle sources.
Claim 24
Dependent Claim
29 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, wherein said transported particles from said particle source means comprise ionic particles transported in an ion beam.
Claim 25
Dependent Claim
25 words
The fabrication device for planarizing a topographical semiconductor device of claim 22, wherein said transported ionic particles from said particle source means comprise argon ions.
Claim 26
Dependent Claim
26 words
The fabrication device for planarizing a topographical semiconductor device of claim 15, wherein said transported particles from said particle source means comprise a chemically active species.
Claim 27
Dependent Claim
23 words
The fabrication device for planarizing a topographical semiconductor device of claim 24, wherein said transported chemically active species comprise ionic chemically active species.
Claim 28
Dependent Claim
20 words
The fabrication device for planarizing a topographical semiconductor device of claim 24, wherein said chemically active species comprise a fluorocarbon.
Claim 29
Dependent Claim
34 words
The fabrication device for planarizing a topographical semiconductor device of claim 26, wherein said fluorocarbon is selected from the group consisting of CF 4 , CHF 3 , and C 2 F 6 .
Claim 30
Dependent Claim
30 words
The fabrication device for planarizing a topographical semiconductor device of claim 24, wherein said chemically reactive species is electronically biased and accelerated towards said semiconductor device by an electrical field.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-02-24 | 1995-08-26 | 1996-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-24 | 1999-08-26 | 2000-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-24 | 2003-08-26 | 2004-02-25 | $7700.00 | Window Closed / Lapsed |