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US5087314A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroconductive adhesive

Assignee: Harris Corp
•
Filing: 1989-07-31
•
Granted: 1992-02-11
•
Expires: 2009-07-31
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Abstract

Abstract An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polyglycidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family, and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.

Inventors

  • 👤 James A. Sandborn
  • 👤 Bobby J. Boan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 22:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H01; H01R; H01R4/00; H01R4/04; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0242; H05K2201/0245; H05K2201/0263; H05K2201/0272

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 118 words
A process of bonding two materials so as to provide an electrically conductive medium therebetween, wherein said process includes the steps of: (a) mixing an epoxy including a resin from the modified epoxy family including a polygylcidylaminophenyl resin and a polyglycidylether of polyformaldehyde novolac resin and a catalyst from the amine family; (b) adding a mixture of electrically conductive particles of various shapes to said catalyst; (c) interposing the mixture of step (b) between the two materials to be bonded, wherein said resin has a percent by weight of greater than 10%, and wherein said catalyst has a percent by weight greater than 4% and wherein said electrically conductive filler has a percent by weight greater than 63%.
Claim 2
Dependent Claim 118 words
A process of bonding two materials so as to provide an electrically conductive medium therebetween, wherein said process includes the steps of: (a) mixing an epoxy including a resin from the modified epoxy family including a polygylcidylaminophenyl resin and a polyglycidylether of polyformaldehyde novolac resin and a catalyst from the amine family; (b) adding a mixture of electrically conductive particles of various shapes to said catalyst; (c) interposing the mixture of step (b) between the two materials to be bonded, wherein said resin has a percent by weight of greater than 10%, and wherein said catalyst has a percent by weight greater than 4% and wherein said electrically conductive filler has a percent by weight greater than 63%.
Claim 3
Dependent Claim 14 words
The process of claim 1, wherein the electrically conductive particles include silver flake particles.

References Cited (Backward Citations)

US3359145A Cited
US3983075A Cited
US3932311A Cited
US4054714A Cited
US4147669A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-02-10 1995-08-12 1996-02-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-02-10 1999-08-12 2000-02-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-02-10 2003-08-12 2004-02-11 $7700.00 Window Closed / Lapsed

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