Copper filled conductive epoxy

Claim 2

An electrically conductive resinous composition consisting essentially of a copper flake the surface of which has been cleaned by removing therefrom impurities and/or oxides, a resinous binder of epoxy resin, an amount of copper flake in said resinous composition being from 25 to 70 percent, the total impurities in said copper flake being less than 7000 ppm, said resinous composition being cured with a curative comprising a polyamide or an anhydride, or mixtures thereof in an amount of about 20 parts to 50 parts of curative to about 80 parts to 50 parts of resin,

Claim 3

An electrically conductive resinous composition consisting essentially of a copper flake the surface of which has been cleaned by removing therefrom impurities and/or oxides, a resinous binder of epoxy resin and as a conductivity improver for said copper flake, a finely divided conductive carbon black, an amount of copper flake in said resinous composition being from 25 to 70 percent and the amount of finely divided carbon black being from 0.8 percent to 10 percent by weight; the impurities in said copper flake being less than 7000 ppm, said resinous composition being cured with a curative comprising a) a polyamide or an anhydride, or mixture thereof in an amount of about 20 parts to 50 parts of curative to about 80 parts to 50 parts of resin, respectively, or b) an amine from 2 parts to 50 parts of curative per 100 parts of epoxy resin.

Claim 4

An electrically conductive resinous composition consisting essentially of a copper flake the surface of which has been cleaned by removing therefrom impurities and/or oxides, a resinous binder of epoxy resin and as a conductivity improver for said copper flake, a finely divided conductive carbon black, an amount of copper flake in said resinous composition being from 25 to 70 percent and the amount of finely divided carbon black being from 0.8 percent to 10 percent by weight; the impurities in said copper flake being less than 7000 ppm, said resinous composition being cured with a curative comprising a) a polyamide or an anhydride, or mixture thereof in an amount of about 20 parts to 50 parts of curative to about 80 parts to 50 parts of resin, respectively, or b) an amine from 2 parts to 50 parts of curative per 100 parts of epoxy resin.

Claim 5

An electrically conductive cured epoxy resin composition consisting essentially of: as a cured resin component thereof, a bisphenol A epoxy resin, as a curative therefor a) an anhydride, or polyamide curing agent in an amount of about 20 parts to 50 parts of curative to about 80 parts to 50 parts of resin, respectively, or b) an amine from 2 parts to 50 parts of curative per 100 parts of epoxy resin; said epoxy resin comprising up to 75 percent by weight of the composite, and having as a conductive medium for said resin from 25 to 70 percent of a copper in a flake form; said copper flake having been cleaned by removing from the surface thereof oxides and surface deposits, the impurities of said copper being less than 7000 parts per million, said copper flake being incorporated in said resin substantially without exposure of said copper flakes to oxidizing conditions, and said resin being cured substantially shortly thereafter, said composition optionally including from 0.8 to 10 percent by weight of a conductive carbon black particulate as an electrical contact improver between said copper flakes, the volume resistivity of said electrically conductive resin being greater than 0.001 ohm-cm and said resistivity being substantially constant for a period of

Claim 6

An electrically conductive cured epoxy resin composition consisting essentially of: as a cured resin component thereof, a bisphenol A epoxy resin, as a curative therefor a) an anhydride, or polyamide curing agent in an amount of about 20 parts to 50 parts of curative to about 80 parts to 50 parts of resin, respectively, or b) an amine from 2 parts to 50 parts of curative per 100 parts of epoxy resin; said epoxy resin comprising up to 75 percent by weight of the composite, and having as a conductive medium for said resin from 25 to 70 percent of a copper in a flake form; said copper flake having been cleaned by removing from the surface thereof oxides and surface deposits, the impurities of said copper being less than 7000 parts per million, said copper flake being incorporated in said resin substantially without exposure of said copper flakes to oxidizing conditions, and said resin being cured substantially shortly thereafter, said composition optionally including from 0.8 to 10 percent by weight of a conductive carbon black particulate as an electrical contact improver between said copper flakes, the volume resistivity of said electrically conductive resin being greater than 0.001 ohm-cm and said resistivity being substantially constant for a period of

Claim 7

In a method for improving the electrical conductivity of epoxy resinous compositions having copper flakes therein, the improvement comprising the steps of: washing copper flakes having a particle size of 30 microns to 200 microns and having total impurities of less than 7000 ppm with at least one solvent selected from the group consisting of trichloroethylene, perchloroethylene, chlorinated alkenes of 1 to 3 carbon atoms, ethers, ketones, benzene or toluene for at least 2 times; rinsing said washed copper flakes with a rinsing solvent selected from the group consisting of denaturated alcohol, methyl alcohol, ethyl alcohol; and washing said copper flakes with an aliphatic acid of at least 2 carboxylic groups for at least 1 time; or dilute nitric acid; rinsing said copper flakes with said rinsing solvent; drying of said copper flake and admixing said copper flake substantially immediately after drying thereof with an epoxy resin and curative therefor, said copper flake being 70 percent to 25 percent by weight of said composition; and immediately curing said epoxy resin-flake

Claim 8

In a method for improving the electrical conductivity of epoxy resinous compositions having copper flakes therein, the improvement comprising the steps of: washing copper flakes having a particle size of 30 microns to 200 microns and having total impurities of less than 7000 ppm with at least one solvent selected from the group consisting of trichloroethylene, perchloroethylene, chlorinated alkenes of 1 to 3 carbon atoms, ethers, ketones, benzene or toluene for at least 2 times; rinsing said washed copper flakes with a rinsing solvent selected from the group consisting of denaturated alcohol, methyl alcohol, ethyl alcohol; and washing said copper flakes with an aliphatic acid of at least 2 carboxylic groups for at least 1 time; or dilute nitric acid; rinsing said copper flakes with said rinsing solvent; drying of said copper flake and admixing said copper flake substantially immediately after drying thereof with an epoxy resin and curative therefor, said copper flake being 70 percent to 25 percent by weight of said composition; and immediately curing said epoxy resin-flake

Claim 9

The process as defined in claim 4 whereby an amount of carbon black from 0.8 percent to 10 percent based on weight of the flake-epoxy composite is incorporated in the same to improve the conductivity of the electrically

Claim 10

The process as defined in claim 4 and wherein the aliphatic acid is

Claim 11

The process as defined in claim 4 and wherein the aliphatic acid is a dicarboxylic acid having at least 1 hydroxy moiety.