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US5086558A
Expired / Lapsed
US
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Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
Assignee: International Business Machines Corp
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Filing: 1990-09-13
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Granted: 1992-02-11
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Expires: 2010-09-13
Abstract
Abstract A method for the direct attachment of semiconductor chips to a substrate or module with a polymer interposer. Initially, an interposer sheet is fabricated, which is to be positioned between the chips and the substrate, with via patterns conforming to the contact patterns of the chips. The interposer sheet comprises a sheet of dielectric thermoplastic material selected from an elastomer, a filled elastomer, a polymer, or a copolymer. The chips are then placed on the interposer sheet with each chip being positioned on a conforming via pattern, and the chips are attached to the interposer sheet, as with a suitable adhesive. The vias are then filled with a conductive attachment material comprising a solution of a themoplastic polymer, preferably a copolymer of polyimide and siloxane, and a fine metal, preferably gold, forming a paste. The interposer sheet with the attached chips is then diced into individual chips, with each chip having a section of the interposer sheet attached thereto. The chips with attached interposer are then directly attached to a substrate or module, with the interposer therebetween, by applying heat and pressure, and the substrate provides a controlled joint height and encapsulated joints.
Inventors
- 👤 Gary W. Grube
- 👤 Igor Y. Khandros
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 11:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/60; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/013; H10W72/01331; H10W72/01336; H10W72/01351; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07331; H10W72/07337; H10W72/076; H10W72/07631; H10W72/07636; H10W72/20; H10W72/241; H10W72/30; H10W72/331; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
116 words
A method of direct attachment of at least one semiconductor chip to a substrate or module, comprising: a. fabricating a thermoplastic and dielectric interposer, which is to be positioned between a chip and the substrate, with a via pattern matching the contact pattern of the chip; b. placing the chip on the interposer with the contact pattern of the chip being positioned on the matching via pattern, and attaching the chip to the interposer; c. filling the vias of the interposer with a conductive attachment material; and d. directly attaching the chip with attached interposer to a substrate or module, with the interposer therebetween, with the interposer providing a controlled join height and providing encapsulated joints.
Claim 2
Independent Claim
116 words
A method of direct attachment of at least one semiconductor chip to a substrate or module, comprising: a. fabricating a thermoplastic and dielectric interposer, which is to be positioned between a chip and the substrate, with a via pattern matching the contact pattern of the chip; b. placing the chip on the interposer with the contact pattern of the chip being positioned on the matching via pattern, and attaching the chip to the interposer; c. filling the vias of the interposer with a conductive attachment material; and d. directly attaching the chip with attached interposer to a substrate or module, with the interposer therebetween, with the interposer providing a controlled join height and providing encapsulated joints.
Claim 3
Dependent Claim
138 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 1, wherein: a. said step of fabricating comprises fabricating a thermoplastic and dielectric interposer sheet, which is to be positioned between a plurality of chips and the substrate, with via patterns matching the contact patterns of the chips; b. said step of placing comprises placing the plurality of chips on the interposer sheet with each chip being positioned on a matching via pattern, and attaching the plurality of chips to the interposer sheet; c. said step of filling comprises filling the vias on the interposer sheet with a conductive attachment material; and d. dicing the interposer sheet with the attached plurality of chips into individual chips, with each chip having a section of the interposer sheet attached hereto.
Claim 4
Dependent Claim
46 words
A method of direct attachment of at least one semiconductor chip to a ;substrate or module as claimed in claim 2, wherein the vias are filled with a conductive attachment material comprising a solution of a thermoplastic polymer and a conductive fine metal forming a paste.
Claim 5
Dependent Claim
33 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 3, wherein the conductive attachment material comprises a copolymer of polymide and siloxane.
Claim 6
Dependent Claim
28 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 4, wherein the conductive fine metal comprises gold.
Claim 7
Dependent Claim
44 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 2, wherein the interposer sheet is formed of a material selected from an elastomer, a filled elastomer, a thermoplastic polymer, and a thermoplastic copolymer.
Claim 8
Dependent Claim
41 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 6, wherein the interposer sheet and conductive attachment materials are similar materials having matching properties and matching coefficients of thermal expansion.
Claim 9
Dependent Claim
80 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 2, wherein said step of fabricating the interposer sheet includes fabricating the interposer sheet with a layer of relatively weak adhesive on one side for attaching the interposer to a substrate or module, covered by a peel off sheet, and with a layer of relatively strong adhesive on a second side for attaching the plurality of chips to the interposer.
Claim 10
Dependent Claim
48 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 8, wherein said step of fabricating the interposer sheet includes laser ablating the interposer sheet to create via patterns matching the contact patters of the plurality of chips.
Claim 11
Dependent Claim
46 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 1, wherein the vias are filled with a conductive attachment material comprising a solution of a thermoplastic polymer and a conductive fine metal forming a paste.
Claim 12
Dependent Claim
33 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 10, wherein the conductive attachment material comprises a copolymer of polyimide and siloxane.
Claim 13
Dependent Claim
28 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 11, wherein the conductive fine metal comprises gold.
Claim 14
Dependent Claim
43 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 1, wherein the interposer is formed of a material selected from an elastomer, a filled elastomer, a thermoplastic polymer, and a thermoplastic copolymer.
Claim 15
Dependent Claim
40 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 11, wherein the interposer and conductive attachment materials are similar materials having matching properties and matching coefficients of thermal expansion.
Claim 16
Dependent Claim
33 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 1, wherein the chip is attached to the interposer with a first adhesive.
Claim 17
Dependent Claim
73 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 15, wherein the chip is attached to the substrate or module with a second adhesive which is not as strong in bonding strength as the first adhesive, to provide for rework in which the second adhesive is ruptured to detach the chip from the substrate or module while the first adhesive remains intact.
Claim 18
Dependent Claim
38 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 16, wherein following rupture, a pattern of conductive attachment material is applied locally onto the substrate or module.
Claim 19
Dependent Claim
35 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 1, wherein following the filling step, the chip is burned-in by contacting a burn-in module.
Claim 20
Dependent Claim
70 words
A method of direct attachment of at least one semiconductor chip to a substrate or module as claimed in claim 18, wherein the burn-in module is provided with a bump each via, and the radius of each bump on the burn-in module is larger than the radius of bumps of conductive attachment material provided on the substrated or module to ensure adequate composite flow during the step of directly attaching.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-10 | 1995-08-12 | 1996-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-10 | 1999-08-12 | 2000-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-10 | 2003-08-12 | 2004-02-11 | $7700.00 | Window Closed / Lapsed |