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US5075171A
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Conductive film and method for preparing same
Assignee: Fujifilm Corp
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Filing: 1991-03-26
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Granted: 1991-12-24
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Expires: 2011-03-26
Abstract
Abstract There is provided a conductive film and a method for preparing same. The conductive film is prepared by forming a prime-coating layer of a three-dimensional network structure on a base and by applying a semiconductive compound-containing solution onto the prime-coating layer to form a conductive layer. The conductive film is excellent in conductivity and transparency as well as adhesion of the conductive layer.
Inventors
- 👤 Syunichi Kondo
- 👤 Syu Watarai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 18:24
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; C; C09; C09D; C09D5/00; C09D5/24; G; G03; G03C; G03C1/00; G03C1/76; G03C1/91; G03C1/93; G03G; G03G5/00; G03G5/10; G03G5/104; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31721; Y10T428/31725; Y10T428/31786; Y10T428/31794; Y10T428/31855; Y10T428/31909
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
88 words
A conductive film prepared by forming a prime-coating layer of a three-dimensional polymeric network structure on a base and by applying a semiconductive compound-containing solution onto the prime-coating layer to form a conductive layer, wherein the prime-coating layer is one of which degree of swelling T 1 /T 0 is within the range of 1.05 to 2.5, wherein T 0 is the thickness of resin before immersion and T 1 is the thickness of resin after immersion into the solvent of the semiconductive compound solution for five minutes.
Claim 2
Dependent Claim
88 words
A conductive film prepared by forming a prime-coating layer of a three-dimensional polymeric network structure on a base and by applying a semiconductive compound-containing solution onto the prime-coating layer to form a conductive layer, wherein the prime-coating layer is one of which degree of swelling T 1 /T 0 is within the range of 1.05 to 2.5, wherein T 0 is the thickness of resin before immersion and T 1 is the thickness of resin after immersion into the solvent of the semiconductive compound solution for five minutes.
Claim 3
Dependent Claim
40 words
The conductive film as claimed in claim 1, wherein the base is selected from the groups consisting of polyesters, polyolefins, celluloses, polymethyl methacrylates, polyamides, polyimides, polycarbonates, polyvinyl alcohols, vinyl chloride-vinyl acetate copolymers, glass and papers coated with polyolefins or polyesters.
Claim 4
Dependent Claim
35 words
The conductive film as claimed in claim 1, wherein the prime-coating layer is one which does not substantially dissolve in a solvent of the semiconductive compound-containing solution, although it swells during application of the solution.
Claim 5
Dependent Claim
61 words
The conductive film as claimed in claim 1, wherein the prime-coating layer is one of which degree of swelling T 1 /T 0 is within the range of 1.05 to 1.7, wherein T 0 is the thickness of resin before immersion, T 1 is the thickness of resin after immersion into the solvent of the semiconductive compound solution for five minutes.
Claim 6
Dependent Claim
24 words
The conductive film as claimed in claim 1, wherein the thickness of the prime-coating layer is in the range of 0.01 to 100 μm.
Claim 7
Dependent Claim
34 words
The conductive film as claimed in claim 1, wherein the semiconductive compound is present in the prime-coating layer near an opposite surface of a base at the highest concentration to form the conductive layer.
Claim 8
Dependent Claim
22 words
The conductive film as claimed in claim 1, wherein the amount of semiconductive compound applied is 40 to 2000 mg/m 2 .
Claim 9
Dependent Claim
47 words
The conductive film as claimed in claim 1, wherein the semiconductive compound is selected from the group consisting of cuprous halide; silver halide; halides of bismuth, gold, indium, iridium, lead, nickel, palladium, rhenium, tin, tellurium and tungsten; cuprous thiocyanate, copper thiocyanate and silver thiocyanate; and mercury iodide.
Claim 10
Dependent Claim
24 words
The conductive film as claimed in claim 1, wherein the semiconductive compound is selected from the group consisting of cuprous iodide and silver iodide.
References Cited (Backward Citations)
US3501301A
Cited
US3597272A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-23 | 1995-06-24 | 1995-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-23 | 1999-06-24 | 1999-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-23 | 2003-06-24 | 2003-12-24 | $7700.00 | Window Closed / Lapsed |