Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
263 words
A semiconductor memory device including a plurality of semiconductor memory cells formed in a surface of a semiconductor substrate and arranged in rows and columns, each of said memory cells being connected with first and second address signal conductors for writing/reading information in the memory cell, said each memory cell comprising: first and second insulated gate field effect transistor (IG FET) inverters cross-coupled to each other through first and second interconnecting conductors to constitute a bistable circuit; a first IG FET transfer gate connected between said address signal conductors and said first inverter, said first IG FET transfer gate being connected with said first inverter through said second interconnecting conductor; and a second IG FET transfer gate connected between said address signal conductors and said second inverter, said second IG FET transfer gate being connected with said second inverter through said first interconnecting conductor, in which said first and second interconnecting conductors are arranged substantially point-symmetrically and have at least portions substantially parallel with each other on said surface of said substrate, and IG FETs constituting said first and second inverters have their gate electrodes arranged substantially parallel with one another and extending in a direction substantially perpendicular to said parallel portions of said first and second interconnecting conductors for said cross-coupling on said surface of said substrate, and IG FETs constituting said first and second transfer gates have their gate electrodes arranged substantially parallel with those of said IG FETs constituting said first and second inverters and forming part of one of said address signal conductors on said surface of said substrate.
Claim 2
Dependent Claim
263 words
A semiconductor memory device including a plurality of semiconductor memory cells formed in a surface of a semiconductor substrate and arranged in rows and columns, each of said memory cells being connected with first and second address signal conductors for writing/reading information in the memory cell, said each memory cell comprising: first and second insulated gate field effect transistor (IG FET) inverters cross-coupled to each other through first and second interconnecting conductors to constitute a bistable circuit; a first IG FET transfer gate connected between said address signal conductors and said first inverter, said first IG FET transfer gate being connected with said first inverter through said second interconnecting conductor; and a second IG FET transfer gate connected between said address signal conductors and said second inverter, said second IG FET transfer gate being connected with said second inverter through said first interconnecting conductor, in which said first and second interconnecting conductors are arranged substantially point-symmetrically and have at least portions substantially parallel with each other on said surface of said substrate, and IG FETs constituting said first and second inverters have their gate electrodes arranged substantially parallel with one another and extending in a direction substantially perpendicular to said parallel portions of said first and second interconnecting conductors for said cross-coupling on said surface of said substrate, and IG FETs constituting said first and second transfer gates have their gate electrodes arranged substantially parallel with those of said IG FETs constituting said first and second inverters and forming part of one of said address signal conductors on said surface of said substrate.
Claim 3
Dependent Claim
20 words
A semiconductor memory device according to claim 1, in which said first and second interconnecting conductors generally extend substantially rectilinearly.
Claim 4
Dependent Claim
36 words
A semiconductor memory device according to claim 2, in which said IG FETs constituting said first and second inverters and said first and second transfer gates have their source/drain regions and gate electrodes arranged substantially point-symmetrically.
Claim 5
Dependent Claim
35 words
A semiconductor memory device according to claim 1, in which IG FETs constituting said first and second inverters and said first and second transfer gates have their source/drain regions and gate electrodes arranged substantially point-symmetrically.
Claim 6
Dependent Claim
24 words
A semiconductor memory device according to claim 1, in which said first and second interconnecting conductors are substantially U-shaped and interdigitated with each other.
Claim 7
Dependent Claim
36 words
A semiconductor memory device according to claim 5, in which said IG FETs constituting said first and second inverters and said first and second transfer gates have their source/drain regions and gate electrodes arranged substantially line-symmetrically.
Claim 8
Dependent Claim
184 words
A semiconductor memory device including a plurality of memory cells formed in a suface of a semiconductor substrate, each memory cel comprising a first inverter circuit including a series connection of a fist load IG FET (insulated gate FET) of a first conductivity type with a first driver IG FET of a second conductivity type, a second inverter circuit including a series connection of a second load IG FET of said first conductivity type with a second driver IG FET of said second conductivity type, and fist and second transfer IG FETs of said second conductivity type for controlling said fist and second inverter circuits, respectively, said first and second load IG FETs having their source/drain regions and gate electrodes arranged substantially symmetrically; said fist driver FET having its source/drain regions and gate electrodes arranged substantially symmetric with those of said second driver FET, and said fist transfer IG FET having their source/drian regions a nd gate electrodes arranged substantial symmetrically with those of said second transfer FET, wherein the gate electrodes of said six IG FETs ae arranged substantially parallel with each other.
Claim 9
Dependent Claim
184 words
A semiconductor memory device including a plurality of memory cells formed in a suface of a semiconductor substrate, each memory cel comprising a first inverter circuit including a series connection of a fist load IG FET (insulated gate FET) of a first conductivity type with a first driver IG FET of a second conductivity type, a second inverter circuit including a series connection of a second load IG FET of said first conductivity type with a second driver IG FET of said second conductivity type, and fist and second transfer IG FETs of said second conductivity type for controlling said fist and second inverter circuits, respectively, said first and second load IG FETs having their source/drain regions and gate electrodes arranged substantially symmetrically; said fist driver FET having its source/drain regions and gate electrodes arranged substantially symmetric with those of said second driver FET, and said fist transfer IG FET having their source/drian regions a nd gate electrodes arranged substantial symmetrically with those of said second transfer FET, wherein the gate electrodes of said six IG FETs ae arranged substantially parallel with each other.
Claim 10
Dependent Claim
186 words
A semiconductor memory device according to claim 7, further including: a first interconnecting conductor formed over a suface of said semiconductor substrate for connecting a gate electrode of said first load IG FET of said first conductivity type, a gate electrode of the first driver IG FET of said second conductivity type, a source/drain region of the second load IG FET of said first conductivity type, a source/drain region of the second driver IG FET of said second conductivity type, and a source/drain region of the second transfer IG FET of said second conductivity type, with each other; and a second interconnecting conductor formed over the surface of said semiconductor substrate of connecting a gate electrode of said second load IG FET of said first conductivity type, a gate electrode of said second driver IG FET of said second conductivity type, a source/drain region of said first load IG FET of one conductivity type, a source/drain region of said first die IG FET f said second conductivity type, and a source/drain region of said first transfer IG FET of said first conductivity type, with each other.
Claim 11
Dependent Claim
30 words
A semiconductor memory device according to claim 8, win which said first and second interconnecting conductors are substantially rectilinear and are arranged in a substantially parallel relationship with each other.
Claim 12
Dependent Claim
123 words
A semiconductor memory device according to claim 7 in which said first and second load IG FETs have their source/drain regions and gate electrodes arranged in a substantially point-symmetrical relationship with respect to one point, said first driver IG FET has its source/drain regions and its gate electrode arranged substantially point-symmetrical with those of said second driver IG FET with respect to said point and arranged so as to be across said two load IG FETs from the latter, said first transfer IG FET has its source/drain regions and its gate electrode arranged substantially point-symmetrical with those of said second transfer IG FET with respect to said point and arranged so as to be across said two load IG FETs from the latter.
Claim 13
Dependent Claim
60 words
A semiconductor memory device according to claim 10, in which said first transfer IG FET has its source/drain regions and its gate electrode arranged substantially point-symmetrical with those of said second transfer IG FET with respect to said point and arranged so as to be across said two load IG FETs and said two driver IG FETs from the latter.
Claim 14
Dependent Claim
31 words
A semiconductor memory device according to claim 7, in which lead electrodes for source/drain regions of said IG FETs are formed by a self-alignment using field insulating layers as a mask.
Claim 15
Dependent Claim
67 words
A semiconductor memory device according to claim 7, in which each memory cell has first and second memory sections, and said fist memory section is comprised of said first load IG FET, said first driver IG FET and said second transfer IG FET, while said second memory section is comprised of said second load IG FET, said second driver IG FET and said first transfer IG FET.