Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards

Claim 2

A printed circuit wiring board comprising a conductive film laminated to a prepreg layer comprising glass cloth impregnated with a polycycloolefin copolymer comprising silane-substituted repeating units derived by ring-opening polymerization from monomers of the formula ##STR6## wherein R 1 and R 6 are each independently selected from H, halogen, CH 3 , C 2 -C 10 alkyl; R 3 and R 5 are each independently selected from H, halogen CH 3 , C 2 -C 10 alkyl, alkene, C 6 -C 12 cycloalkyl, C 6 -C 12 cycloalkene, C 6 -C 12 aryl, or C 6 -C 12 aryl substituted by C 1 -C 10 alkyl or a silane group, or R 3 and R 5 together form a saturated or unsaturated cyclic alkylene group of from 2-10 carbon atoms, with the proviso that when R 3 and R 5 together form a saturated or unsaturated alkylene group, said saturated or unsaturated alkylene group is further substituted by a silane group; R 2 and R 4 are each independently selected from H or a silane group, with the proviso that when R 3 and R 4 do not together form an alkylene group, at least one of R 2 and R 4 is a silane group and with the further proviso that at least said alkylene group formed by R 3 and R 5 is substituted by a silane group or one of R 2 and R 4 is a silane group.

Claim 3

A printed circuit wiring board of claim 1 wherein said silane group is a substuent of the formula --SiR 9 R 10 R 11 wherein each of R 9 , R 10 , R 11 is selected independently from the group which includes H; halogen; C 1 -C 12 alkyl; C 6 -C 12 aryl; and C 6 -C 12 aryl substituted by C 1 -C 12 alkyl; C 1 14 C 12 alkoxy; and hydroxyl.

Claim 4

A printed circuit wiring board of claim 2 wherein said silane group is a trialkoxysilane.

Claim 5

A printed circuit wiring board of claim 3 wherein said trialkoxysilane is triethoxysilane.

Claim 6

A printed circuit wiring board of claim 2 wherein said silane group is an alkylalkoxy silane.

Claim 7

A printed circuit wiring board of claim 1 wherein the ratio of silane-substituted monomer to non silane-substituted monomer is from about 95:5 to about 1:99.

Claim 8

A printed circuit wiring board of claim 1 wherein the ratio of polycycloolefin copolymer to glass cloth is from about 75:25 to about 30:70.

Claim 9

A printed circuit wiring board of claim 1 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has a bronze coating.

Claim 10

A printed circuit wiring board of claim 1 wherein at least one monomer of the polycycloolefin is derived from a cycloolefin monomer selected from methylnorbornene, methyltetracyclododecene, tetracyclododecene, vinyl-norbornene or dicyclopentadiene.

Claim 11

A printed circuit wiring board of claim 1 wherein said polycyclic copolymer is derived from silane-substituted and non silane-substituted monomers selected from the group consisting of dicyclopentadiene, 2-norbornene, 5-methyl-2norbornene, 5,6-dimethyl-2-norbornene, 5-ethyl-2-norbornene, 5-ethylidenyl-2-norbornene (or 5-ethylidenenorbornene), 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-octyl-2-norbornene, 5-phenyl-2-norbornene, 5-dodecyl-2-norbornene, 5-isobutyl-2-norbornene, 5-octadecyl-2-norbornene, 5-phenyl-2-norbornene, 5-p-toluyl-2-norbornene, 5-α-naphthyl-2-norbornene, 5-cyclohexyl-2-norbornene, 5-isopropenyl-norbornene, 5-vinyl-norbornene, 5,5-dimethyl-2-norbornene, tricyclopentadiene (or cyclopentadiene trimer), tetracyclopentadiene (or cyclopentadiene tetramer), dihydrodicyclopentadiene (or cyclopentene-cyclopentadiene co-dimer), methyl-cyclopentadiene dimer, ethyl-cyclopentadiene dimer, tetracyclododecene, 9-methyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, (or methyl-tetracyclododecene) 9-ethyl--tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, (or ethyl-tetracyclododecene) 9-propyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-hexyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-decyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9,10-dimethyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-methyl,10-ethyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-cyclohexyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-chloro-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-bromo-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9-isobutyl-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4, 9,10-dichloro-tetracyclo[6,2,1,1 3 ,6,0 2 ,7 ]dodecene-4 or mixtures thereof.

Claim 12

A printed circuit wiring board of claim 1 wherein the polycycloolefin copolymer further comprises an amount of from about 1 wt. % to about 10 wt. %, based on the total weight of monomeric units present in the polymeric composition, of units derived from monomers of the formula ##STR7## wherein X is selected from ##STR8## --C 6 H 4 --CH 2 -- or alkylene of from 1-4 carbon atoms; Z is selected from --O--, --NH--, --O--CH 2 --CH 2 --O--, or --NH--CH 2 --CH 2 --NH--; Y is selected from alkylene of from 1-4 carbon atoms; and R 9 , R 10 and R 11 are each independently selected from hydrogen, hydroxyl, C 1 -C 12 alkyl; C 6 -C 12 aryl; C 6 -C 12 substituted by alkyl; halogen; or C 1 -C 12 alkoxy.

Claim 13

A printed circuit wiring board comprising a conductive film laminated to a prepreg layer comprising a glass cloth impregnated with a polycyclic copolymer comprising silane-substituted repeating units derived from monomers of the formulas ##STR9## wherein n=1-4 and R 7 and R 8 are independently selected from hydrogen, halogen, C 1 -C 12 alkyl groups, C 2 -C 12 alkylene groups, C 6 -C 12 cycloalkyl groups, C 6 -C 12 cycloalkylene groups and C 6 -C 12 aryl groups, silane or R 7 and R 8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R 7 and R 8 do not together form said cyclic group, at least one of R 7 and R 8 is a silane group.

Claim 14

A printed circuit wiring board comprising a conductive film laminated to a prepreg layer comprising a glass cloth impregnated with a polycyclic copolymer comprising silane-substituted repeating units derived from monomers of the formulas ##STR9## wherein n=1-4 and R 7 and R 8 are independently selected from hydrogen, halogen, C 1 -C 12 alkyl groups, C 2 -C 12 alkylene groups, C 6 -C 12 cycloalkyl groups, C 6 -C 12 cycloalkylene groups and C 6 -C 12 aryl groups, silane or R 7 and R 8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of and contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R 7 and R 8 do not together form said cyclic group, at least one of R 7 and R 8 is a silane group.

Claim 15

A printed circuit wiring board of claim 12 wherein said silane group is a substituent of the formula --SiR 9 R 10 R 11 wherein each of R 9 , R 10 , R 11 is selected independently from the group which includes H; halogen; C 1 -C 12 alkyl; C 6 -C 12 aryl; and C 6 -C 12 aryl substituted by C 1 -C 12 alkyl; C 1 -C 12 alkoxy; and hydroxyl.

Claim 16

A printed circuit wiring board of claim 13 wherein said silane group is a trialkoxy silane.

Claim 17

A printed circuit wiring board of claim 14 wherein said silane group is triethoxysilane.

Claim 18

A printed circuit wiring board of claim 13 wherein said silane group is an alkylalkoxy silane.

Claim 19

A printed circuit wiring board of claim 12 wherein the ratio of silane-substituted monomers to non silane-substituted monomers is from about 95:5 to about 1:99.

Claim 20

A printed circuit wiring board of claim 12 wherein the ratio of polycycloolefin copolymer to glass cloth is from about 75:25 to about 30:70.

Claim 21

A printed circuit wiring board of claim 12 wherein the conductive film is copper and the surface of the copper film which is laminated to the prepreg layer has been pretreated with a bronze coating.

Claim 22

A printed circuit wiring board of claim 11 wherein X is alkylene of from 1-2 carbon atoms.

Claim 23

A printed circuit wiring board of claim 20 wherein X is CH 2 or --C 6 H 4 --CH 2 --.

Claim 24

A printed circuit wiring board of claim 11 wherein X is ##STR10##

Claim 25

A printed circuit wiring board of claim 11 wherein Z is --O--.

Claim 26

A printed circuit wiring board of claim 11 wherein Z is --NH--.

Claim 27

A printed circuit wiring board of claim 11 wherein Z is --O--CH 2 CH 2 --O--.

Claim 28

A printed circuit wiring board of claim 11 wherein Z is --NH--CH 2 --CH 2 --NH--.

Claim 29

A printed circuit wiring board of claim 11 wherein Y is alkylene of from 1-3 carbon atoms.

Claim 30

A printed circuit wiring board of claim 27 wherein Y is alkylene of 3 carbon atoms

Claim 31

A printed circuit wiring board of claim 11 wherein at least one of R 9 , R 10 and R 11 is C 1 -C 4 alkyl.

Claim 32

A printed circuit wiring board of claim 29 wherein at least one of R 9 , R 10 and R 11 is C 1 -C 2 alkyl.

Claim 33

A printed circuit wiring board of claim 11 wherein at least one of R 9 , R 10 and R 11 is aryl substituted by C 1 -C 4 alkoxy.

Claim 34

A printed circuit wiring board of claim 31 wherein at least one of R 9 , R 10 and R 11 C 1 -C 2 alkoxy.

Claim 35

A printed circuit wiring board of claim 31 wherein at least one of R 9 , R 10 and R 11 hydroxyl.

Claim 36

A printed circuit wiring board produced by a process comprising the steps of: (a) providing a dipping solution comprising polynorbornene polymers dissolved within a solvent wherein the polynorbornene polymers comprise a polycyclic copolymer comprising silane-substituted repeating units derived from monomers of the formulas ##STR11## wherein n=1-4 and R 7 and R 8 are independently selected from hydrogen, halogen, C 1 -C 12 alkyl groups, C 2 -C 12 alkylene groups, C 6 -C 12 cycloalkyl groups, C 6 -C 12 cycloalkylene groups and C 6 -C 12 aryl groups, silane or R 7 and R 8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of an contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R 1 and R 8 and do not together form said cyclic group, at least one of R 7 and R 8 is a silane group; (b) impregnating a glass cloth with the dipping solution and drying the impregnated cloth to remove a substantial portion of the solvent to form a prepreg to function as a substrate layer; (c) pretreating the surface of a conductive film with a solution of a silane compound suitable for increasing the bond strength between the substrate layer and conductive film layer; and (d) laminating and curing the prepreg layer to the treated surface of the conductive film layer.

Claim 37

A printed circuit wiring board produced by a process comprising the steps of: (a) providing a dipping solution comprising polynorbornene polymers dissolved within a solvent wherein the polynorbornene polymers comprise a polycyclic copolymer comprising silane-substituted repeating units derived from monomers of the formulas ##STR11## wherein n=1-4 and R 7 and R 8 are independently selected from hydrogen, halogen, C 1 -C 12 alkyl groups, C 2 -C 12 alkylene groups, C 6 -C 12 cycloalkyl groups, C 6 -C 12 cycloalkylene groups and C 6 -C 12 aryl groups, silane or R 7 and R 8 together from a saturated or unsaturated silane substituted cyclic group of from 4 to 12 carbon atoms with the two ring carbon atoms connected thereto, said ring carbon atoms forming part of an contributing to the 4 to 12 carbon atoms in the cyclic group with the proviso that, when R 1 and R 8 and do not together form said cyclic group, at least one of R 7 and R 8 is a silane group; (b) impregnating a glass cloth with the dipping solution and drying the impregnated cloth to remove a substantial portion of the solvent to form a prepreg to function as a substrate layer; (c) pretreating the surface of a conductive film with a solution of a silane compound suitable for increasing the bond strength between the substrate layer and conductive film layer; and (d) laminating and curing the prepreg layer to the treated surface of the conductive film layer.