Patent US5068602A successfully refreshed from Google Patents.
US5068602A
Expired / Lapsed
US
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DUT board for a semiconductor device tester having a reconfigurable coaxial interconnect grid and method of using same
Assignee: Credence Systems Corp
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Filing: 1990-09-07
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Granted: 1991-11-26
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Expires: 2010-09-07
Abstract
Abstract An easily reconfigurable DUT board interconnection grid is electrically and mechanically reliable, has low noise and cross-talk, and permits high density mixed digital and analog devices to be tested. This DUT board includes a grounding block of conductive material that has an inner and outer array of holes and is in electrical contact with the circuit board ground. The arrays of holes correspond in shape and size to, and are in electrical contact with, underlying inner and outer array of conductive members in the circuit board. Each conductive member provides a pin in the center of the corresponding hole to make each hole a coaxial contact receptacle. The inner array of conductive members connects to the sockets or pads that receive the device-under-test on the DUT side of the circuit board to the other side of the circuit board where the grounding block resides. The coaxial contact receptacles of the inner array therefore present an interface to the DUT. The individual conductive members in the outer array are connected to each of the tester signals that the operator may wish to connect to a DUT. The coaxial contact receptacles of the outer array therefore present an interface to the signals of the tester. Coaxial jumper wires are then used to connect selected locations in the inner and outer arrays.
Inventors
- 👤 Joseph A. Mielke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:52
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07392
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
222 words
A device-under-test board for a semiconductor device tester comprising: a circuit board containing a plurality of conductive paths comprising signal paths and a ground path; an inner array of conductive members disposed within the circuit board, with a first end of the conductive members oriented toward a first surface of the circuit board and arranged to engage the contacts of a semiconductor device, and with a second end of the conductive members oriented toward a second surface of the circuit board; an outer array of conductive members disposed within the circuit board around the outside of the inner array of conductive members, with a first end of the conductive members oriented toward the first surface of the circuit board, and with the second end of the conductive members oriented toward the second surface of the circuit board, and with each of the conductive members of the outer array being in electrical contact with one of the plurality of conductive paths; a grounding block of conductive material defining inner and outer arrays of holes corresponding in location to the inner and outer arrays of conductive members, the grounding block being adjacent to the second surface of the circuit board such that the holes each align with one of the conductive members; and means for electrically connecting the grounding block to the ground path.
Claim 2
Independent Claim
222 words
A device-under-test board for a semiconductor device tester comprising: a circuit board containing a plurality of conductive paths comprising signal paths and a ground path; an inner array of conductive members disposed within the circuit board, with a first end of the conductive members oriented toward a first surface of the circuit board and arranged to engage the contacts of a semiconductor device, and with a second end of the conductive members oriented toward a second surface of the circuit board; an outer array of conductive members disposed within the circuit board around the outside of the inner array of conductive members, with a first end of the conductive members oriented toward the first surface of the circuit board, and with the second end of the conductive members oriented toward the second surface of the circuit board, and with each of the conductive members of the outer array being in electrical contact with one of the plurality of conductive paths; a grounding block of conductive material defining inner and outer arrays of holes corresponding in location to the inner and outer arrays of conductive members, the grounding block being adjacent to the second surface of the circuit board such that the holes each align with one of the conductive members; and means for electrically connecting the grounding block to the ground path.
Claim 3
Dependent Claim
27 words
A device-under-test board according to claim 1 wherein the conductive members comprise pin/sockets with a socket comprising the first end and a pin comprising the second end.
Claim 4
Dependent Claim
61 words
A device-under-test board according to claim 2 further comprising: a plurality of jumper wires having a contact at each end, the contacts having a size compatible with the holes of the grounding block and the pins of the pin/sockets, for connecting between a selected location in the outer array of holes and a selected location in the inner array of holes.
Claim 5
Dependent Claim
38 words
A device-under-test board according to claim 3 further comprising: a plurality of grounding pieces having a size compatible with the holes of the grounding block and the pins of the pin/sockets, for shorting together said pins and holes.
Claim 6
Dependent Claim
12 words
A device-under-test board according to claim 3 further comprising a power jumper.
Claim 7
Dependent Claim
56 words
A device-under-test board according to claim 5 wherein the power jumper comprises: a contact having a size compatible with the holes of the grounding block and the pins of the pin/sockets; a large power wire coupled to a center conductor of the contact; and a small sense wire coupled to the center conductor of the contact.
Claim 8
Dependent Claim
77 words
A device-under-test board according to claim 3 further comprising: a configuration plate defining inner and outer arrays of contact passages corresponding in location to the inner and outer arrays of holes defined by the grounding block so that the contacts of the jumper wires pass through the contact passages when the jumper wires are used for connecting between the selected location in the outer array of holes and the selected location in the inner array of holes.
Claim 9
Dependent Claim
17 words
A device-under-test board according to claim 1 wherein the conductive members comprise through-hole/pads at the first end.
Claim 10
Dependent Claim
17 words
A device-under-test board according to claim 1 wherein the holes defined by the grounding block are round.
Claim 11
Dependent Claim
17 words
A device-under-test board according to claim 1 wherein the holes defined by the grounding block are square.
Claim 12
Dependent Claim
30 words
A device-under-test board according to claim 1 wherein the means for electrically connecting comprises runs within the circuit board connecting a set of the conductive paths to the ground path.
Claim 13
Independent Claim
221 words
A method for making a reconfigurable device-under-test board for a semiconductor device tester comprising the steps of: obtaining a circuit board containing a plurality of conductive paths comprising signal paths and a ground path; disposing within the circuit board an inner array of conductive members, with a first end of the conductive members oriented toward a first surface of the circuit board and arranged to engage the contacts of a semiconductor device, and with a second end of the conductive members oriented toward a second surface of the circuit board; also disposing an outer array of conductive members around the outside of the inner array of conductive members, with a first end of the conductive members oriented toward the first surface of the circuit board, and with the second end of the conductive members oriented toward the second surface of the circuit board, and with each of the conductive members of the outer array being in electrical contact with one of the plurality of conductive paths; affixing to the second surface of the circuit board a grounding block of conductive material defining inner and outer arrays of holes corresponding in location to the inner and outer arrays of conductive members, such that the holes each align with one of the conductive members; and connecting the grounding block to the ground path.
Claim 14
Independent Claim
221 words
A method for making a reconfigurable device-under-test board for a semiconductor device tester comprising the steps of: obtaining a circuit board containing a plurality of conductive paths comprising signal paths and a ground path; disposing within the circuit board an inner array of conductive members, with a first end of the conductive members oriented toward a first surface of the circuit board and arranged to engage the contacts of a semiconductor device, and with a second end of the conductive members oriented toward a second surface of the circuit board; also disposing an outer array of conductive members around the outside of the inner array of conductive members, with a first end of the conductive members oriented toward the first surface of the circuit board, and with the second end of the conductive members oriented toward the second surface of the circuit board, and with each of the conductive members of the outer array being in electrical contact with one of the plurality of conductive paths; affixing to the second surface of the circuit board a grounding block of conductive material defining inner and outer arrays of holes corresponding in location to the inner and outer arrays of conductive members, such that the holes each align with one of the conductive members; and connecting the grounding block to the ground path.
Claim 15
Dependent Claim
26 words
A method according to claim 12 wherein the conductive members comprise pin/sockets with a socket comprising the first end and a pin comprising the second end.
Claim 16
Dependent Claim
63 words
A method according to claim 13 further comprising the step of: connecting a plurality of jumper wires, each having a contact at each end, the contacts having a size compatible with the holes of the grounding block and the pins of the pin/sockets, between a selected location in the outer array of holes and a selected location in the inner array of holes.
Claim 17
Dependent Claim
49 words
A method according to claim 14 further comprising the step of: placing a plurality of grounding pieces having a size compatible with the holes of the grounding block and the pins of the pin/sockets and shorting together said pins and holes in unused coaxial receptacles in the inner array.
Claim 18
Dependent Claim
26 words
A method according to claim 14 further comprising the step of using a power jumper to supply power to an appropriate hole of the inner array.
Claim 19
Dependent Claim
55 words
A method according to claim 16 wherein the power jumper comprises: a contact having a size compatible with the holes of the grounding block and the pins of the pin/sockets; a large power wire coupled to a center conductor of the contact; and a small sense wire coupled to the center conductor of the contact.
Claim 20
Dependent Claim
44 words
A method according to claim 14 further comprising the step of: preserving a particular configuration by using a configuration plate defining inner and outer arrays of contact passages corresponding in location to the inner and outer arrays of holes defined by the grounding block.
Claim 21
Dependent Claim
16 words
A method according to claim 12 wherein the conductive members comprise through-hole/pads at the first end.
Claim 22
Dependent Claim
16 words
A method according to claim 12 wherein the holes defined by the grounding block are round.
Claim 23
Dependent Claim
16 words
A method according to claim 12 wherein the holes defined by the grounding block are square.
Claim 24
Dependent Claim
28 words
A method according to claim 12 wherein the connecting step comprises the step of making electrical contact between a set of the conductive paths and the ground path.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-25 | 1995-05-27 | 1995-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-25 | 1999-05-27 | 1999-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-25 | 2003-05-27 | 2003-11-26 | $7700.00 | Window Closed / Lapsed |