Patent US466194A successfully refreshed from Google Patents.
Patent US5067008A successfully refreshed from Google Patents.
US5067008A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ic package and ic card incorporating the same thereinto
Assignee: Maxell Ltd
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Filing: 1990-08-07
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Granted: 1991-11-19
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Expires: 2010-08-07
Abstract
Abstract An IC package comprising an integrated substrate which includes a cavity, in which an IC chip is mounted, formed by a wall surrounding the IC chip, and a groove formed in the surrounding wall extending to surround and communicate with the cavity and method for fabricating the IC package, wherein an excessive amount of resin is filled in the cavity of the integrated substrate, and the composite structure pressed by a plate whereby the excess of the resin overflows from the cavity pressure to be received in the groove such that, the exposed surface of the filled resin is formed into a predetermined shape without requiring grinding.
Inventors
- 👤 Yoshimi Yanaka
- 👤 Keiji Miyamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:45
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/07747; H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W76/00; H10W76/01; H10W76/05; H10W76/40; H10W76/42; H10W76/47; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
63 words
An IC package comprising: an integrated circuit chip; a substrate on which said integrated circuit chip is mounted; a wall for surrounding said integrated circuit chip provided on said substrate to define therebetween a cavity; recess means provided in said surrounding wall for communicating with said cavity; and resin for filling said cavity and said recess means for sealing said integrated circuit chip.
Claim 2
Dependent Claim
63 words
An IC package comprising: an integrated circuit chip; a substrate on which said integrated circuit chip is mounted; a wall for surrounding said integrated circuit chip provided on said substrate to define therebetween a cavity; recess means provided in said surrounding wall for communicating with said cavity; and resin for filling said cavity and said recess means for sealing said integrated circuit chip.
Claim 3
Dependent Claim
45 words
An IC package according to claim 1, wherein a difference between a volume of resin to be filled into said cavity and a maximum desire volume of resin to be filled is less than 10% of said maximum desired volume of resin to be filled.
Claim 4
Dependent Claim
40 words
An IC package according to claim 1, wherein an effective capacity of said recess means is substantially equal to a volume corresponding to a difference between a maximum volume of filled resin and a volume of resin to be potted.
Claim 5
Dependent Claim
32 words
An IC package according to any one of claims 1, 2 and 3, wherein said recess means includes either one continuous groove or a multiplicity of grooves surrounding said integrated circuit chip.
Claim 6
Dependent Claim
22 words
An IC package according to any one of claims 1, 2 and 3, wherein said recess means includes a plurality of dimples.
Claim 7
Dependent Claim
90 words
An IC card comprising: an IC card body provided with a recess portion; and and IC package fixed into said recess portion of said IC card body, said IC package including, an integrated circuit chip; a substrate on which said integrated circuit chip is mounted; a wall for surrounding said integrated circuit chip provided on said substrate to define therebetween a cavity; recess means provided in said surrounding wall for communicating with said cavity; and resin for filling said cavity and said recess means for sealing said integrated circuit chip.
Claim 8
Dependent Claim
90 words
An IC card comprising: an IC card body provided with a recess portion; and and IC package fixed into said recess portion of said IC card body, said IC package including, an integrated circuit chip; a substrate on which said integrated circuit chip is mounted; a wall for surrounding said integrated circuit chip provided on said substrate to define therebetween a cavity; recess means provided in said surrounding wall for communicating with said cavity; and resin for filling said cavity and said recess means for sealing said integrated circuit chip.
Claim 9
Dependent Claim
45 words
An IC card according to claim 6, wherein a difference between a volume of resin to be filled into said cavity and a maximum desired volume of resin to be filled is less than 10% of said maximum desired volume of resin to be filled.
Claim 10
Dependent Claim
40 words
An IC card according to claim 6, wherein an effective capacity of said recess means is substantially equal to a volume corresponding to a difference between a maximum volume of filled resin and a volume of resin to be potted.
Claim 11
Dependent Claim
32 words
An IC card, according to any one of claims 6, 7 and 8, wherein said recess means includes either one continuous groove or a multiplicity of grooves surrounding said integrated circuit chip.
Claim 12
Dependent Claim
22 words
An IC card according to any one of claims 6, 7 and 8, wherein said recess means includes a plurality of dimples.
Claim 13
Dependent Claim
22 words
An IC card according to claim 6, wherein said IC package is fixed to said IC card body by an adhesive layer.
Claim 14
Dependent Claim
29 words
An IC package according to claim 1, wherein said recess means includes a groove in said wall surrounding said integrated circuit chip and passages for communicating with said cavity.
Claim 15
Dependent Claim
33 words
An IC card according to claim 6, wherein said recess means of said IC package includes a groove in said wall surrounding said integrated circuit chip and passages for communicating with said cavity.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-18 | 1995-05-20 | 1995-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-18 | 1999-05-20 | 1999-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-18 | 2003-05-20 | 2003-11-19 | $7700.00 | Window Closed / Lapsed |