US5063475A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multileveled electronic assembly with cooling means
Assignee: International Business Machines Corp
•
Filing: 1990-03-19
•
Granted: 1991-11-05
•
Expires: 2010-03-19
Abstract
Abstract An electronic assembly (e.g., a supercomputer) wherein different levels of substrates, each having a plurality of heat-generating electronic components (e.g., resistors, capacitors, power supplies, VLSI modules) thereon, is described. The assembly includes a cooling structure centrally disposed therein for providing cooling fluid to each of the heat generating components to cool same. In a preferred embodiment, the cooling structure comprises a plurality of concentrically disposed duct members (e.g., of thermoplastic), which each in turn include a longitudinal chamber portion and a flared end portion. The flared end portion is particularly designed to direct the cooling fluid in a plurality of directions, depending on the requirements of the assembly. Diffusing structure (e.g., an apertured plate) may also be used to assure passage of turbulent, even fluid flow through each duct member.
Inventors
- 👤 Albert L. Balan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 14:45
CPC Classifications
G; G06; G06F; G06F1/00; G06F1/16; G06F1/20; H; H05; H05K; H05K7/00; H05K7/20; H05K7/20709; H05K7/20718; H05K7/20736
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
83 words
In an multileveled electronic assembly including a plurality of spacedly positioned substrates located at different levels within said assembly and each including thereon a plurality of heat generating electronic components, said assembly including means to provide cooling of said electronic components, the improvement wherein said cooling means comprises a plurality of individual duct members centrally oriented within said assembly, each of said duct members directing cooling fluid onto said electronic components on a respective one of said substrates to cool said electronic components.
Claim 2
Dependent Claim
83 words
In an multileveled electronic assembly including a plurality of spacedly positioned substrates located at different levels within said assembly and each including thereon a plurality of heat generating electronic components, said assembly including means to provide cooling of said electronic components, the improvement wherein said cooling means comprises a plurality of individual duct members centrally oriented within said assembly, each of said duct members directing cooling fluid onto said electronic components on a respective one of said substrates to cool said electronic components.
Claim 3
Dependent Claim
19 words
The improvement according to claim 1 wherein said plurality of duct members of said cooling means are coaxially oriented.
Claim 4
Dependent Claim
18 words
The improvement according to claim 2 wherein said levels of said substrates surround said centrally oriented cooling means.
Claim 5
Dependent Claim
13 words
The improvement according to claim 3 wherein said electronic assembly is a supercomputer.
Claim 6
Dependent Claim
44 words
The improvement according to claim 1 wherein each of said duct members comprises a longitudinal chamber portion and a flared end portion, each of said flared end portions being located within said assembly adjacent each of said respective substrates having said electronic components thereon
Claim 7
Dependent Claim
22 words
The improvement according to claim 5 wherein each of said flared end portions of said cooling means is substantially annular in shape.
Claim 8
Dependent Claim
36 words
The improvement according to claim 5 wherein each of said flared end portions of said cooling means is of polygonal shape to thereby direct cooling fluid passing through said duct means in a plurality of directions.
Claim 9
Dependent Claim
31 words
The improvement according to claim 7 wherein the shape of each of said flare portions of said cooling means is rectangular, the number of directions said fluid is directed being four.
Claim 10
Dependent Claim
31 words
The improvement according to claim 7 wherein the shape of each of said flare portions of said cooling means is octagonal, the number of directions said fluid is directed being eight.
Claim 11
Dependent Claim
24 words
The improvement according to claim 1 wherein the number of said duct members is within the range of from about two to about ten.
Claim 12
Dependent Claim
30 words
The improvement according to claim 1 wherein each of said duct members is joined to a common plenum member, said plenum including means for generating flow of said fluid therein.
Claim 13
Dependent Claim
22 words
The improvement according to claim 11 wherein said means for generating said flow of said fluid within said plenum comprises a fan.
Claim 14
Dependent Claim
46 words
The improvement according to claim 12 further including means for diffusing said fluid generated by said generating means prior to said fluid entering at least one of said duct members to thereby provide turbulent, even flow of said fluid to said duct member receiving said fluid.
Claim 15
Dependent Claim
35 words
The improvement according to claim 13 wherein said means for diffusing said fluid comprises an apertured plate member located substantially across said duct member, said plate member including a plurality of spacedly oriented apertures therein.
Claim 16
Dependent Claim
56 words
The improvement according to claim 1 wherein the number of said duct members directing fluid onto at least one of said levels of said substrates is at least two, said two duct members directing fluid to said one level thereby providing differential fluid flow across said electronic components located on said substrates on said one level.
Claim 17
Dependent Claim
17 words
The improvement according to claim 1 wherein said individual duct members are each comprised of plastic material.
Claim 18
Dependent Claim
13 words
The improvement according to claim 16 wherein said plastic material is a thermoplastic.
Claim 19
Dependent Claim
42 words
The improvement according to claim 1 further including wall members located adjacent each of said levels of substrates along the outer periphery thereof to assist in directing said fluid directed over said electronic components after said fluid has passed over said components.
Claim 20
Dependent Claim
27 words
The improvement according to claim 18 wherein each of said walls includes a plurality of openings therein for having said fluid passing over said components pass therethrough.
References Cited (Backward Citations)
US3434014A
Cited
US4417295A
Cited
US4335781A
Cited
US4590538A
Cited
US4502100A
Cited
US4633371A
Cited
US4733293A
Cited
US4894749A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-04 | 1995-05-06 | 1995-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-04 | 1999-05-06 | 1999-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-04 | 2003-05-06 | 2003-11-05 | $7700.00 | Window Closed / Lapsed |