Heat sink device for electronics modules packaged in cylindrical casings

Claim 2

A heat sink device for electronics modules packaged in a cylindrical outer case comprising: a slotted, heat conducting ring capable of radial expansion within the cylindrical case, wherein said ring is in contact with the cylindrical case; a heat transfer disk in wedged position inside said ring wherein said heat transfer disk has a truncated portion on one side whereby a space is formed between the truncated portion of the disk and said slotted ring to allow passage of a wiring harness; and an electronics module in heat transfer contact with a planar surface of said heat transfer disk.

Claim 3

A heat sink according to claim 1 wherein said slotted ring and said heat transfer disk are comprised of aluminum alloy.

Claim 4

A heat sink device according to claim 1 wherein said slotted ring and said heat transfer disk are formed of copper alloy.

Claim 5

A heat sink device according to claim 1 wherein said slotted ring and said heat transfer disk are formed of brass.

Claim 6

A heat sink device for electronics modules packaged in in a cylindrical case comprising: a cylindrical thermally conductive ring having an outer surface pressingly engaging the inner surface of the cylindrical case and an inner surface longitudinally tapered; a substantially circular heat transfer disk wedged inside the inner surface of said cylindrical thermally conductive ring, wherein two planar surfaces of said heat transfer disk face in opposite axial directions of the cylindrical case; a substantially circular electronics module with heat generating electronic components on a first side and a planar heat dissipating surface on a second side with said second side fixed in heat transfer union to one planar surface of said heat transfer disk; and a circular cover plate having an outside diameter substantially the same size as the outside diameter of said thermally conductive ring and containing fastener access holes whereby fasteners extend therethrough and engage said heat transfer disk at its other planar surface and urge said heat transfer disk into pressed engagement with said cylindrical thermally conductive ring.

Claim 7

A heat sink device for electronics modules packaged in in a cylindrical case comprising: a cylindrical thermally conductive ring having an outer surface pressingly engaging the inner surface of the cylindrical case and an inner surface longitudinally tapered; a substantially circular heat transfer disk wedged inside the inner surface of said cylindrical thermally conductive ring, wherein two planar surfaces of said heat transfer disk face in opposite axial directions of the cylindrical case; a substantially circular electronics module with heat generating electronic components on a first side and a planar heat dissipating surface on a second side with said second side fixed in heat transfer union to one planar surface of said heat transfer disk; and a circular cover plate having an outside diameter substantially the same size as the outside diameter of said thermally conductive ring and containing fastener access holes whereby fasteners extend therethrough and engage said heat transfer disk at its other planar surface and urge said heat transfer disk into pressed engagement with said cylindrical thermally conductive ring.

Claim 8

A heat sink according to claim 5, wherein said cylindrical thermally conductive ring has a slot machined axially through the circumference of said ring allowing expansion with said circular heat transfer disk urgingly pressed inside said ring.

Claim 9

A heat sink device according to claim 5 wherein said cylindrical thermally conductive ring, said circular heat transfer disk, and said circular cover plate are formed of aluminum alloy.

Claim 10

A heat sink device according to claim 5 wherein said substantially circular electronics module is affixed to said heat transfer disk with machine screws.

Claim 11

A heat sink apparatus for cooling cylindrically packaged electronics modules comprising: a thermally conductive cylindrical housing having an inside and outside surface for containing substantially cylindrical electronic modules; a cylindrical thermally conductive ring having an inside and outside surface with said outside surface pressingly engaging said inside surface of said thermally conductive cylindrical housing whereby heat is transferred from said cylindrical thermally conductive ring to said thermally conductive cylindrical housing and said inside surface of said cylindrical thermally conductive ring is longitudinally tapered along its axis; a circular heat transfer disk having a first and second planar sides and an outside circumference axially tapered and frictionally engaging said inside tapered surface of said cylindrical thermally conductive ring; a cylindrical cover plate having an outside diameter substantially equal to the outside surface of said cylindrical thermally conductive ring and containing a plurality of fastener access holes extending therethrough; a plurality of fastener means extending through said fastener access holes to engage said first planar side of said circular transfer disk, thereby pulling said transfer disk into pressed cooperation with said thermally conductive ring; and a substantially cylindrical electronics module having a first and second planar side whereby said first planar side contains electronics components and said second planar side is conductively affixed to said second planar side of said circular transfer disk.

Claim 12

A heat sink apparatus for cooling cylindrically packaged electronics modules comprising: a thermally conductive cylindrical housing having an inside and outside surface for containing substantially cylindrical electronic modules; a cylindrical thermally conductive ring having an inside and outside surface with said outside surface pressingly engaging said inside surface of said thermally conductive cylindrical housing whereby heat is transferred from said cylindrical thermally conductive ring to said thermally conductive cylindrical housing and said inside surface of said cylindrical thermally conductive ring is longitudinally tapered along its axis; a circular heat transfer disk having a first and second planar sides and an outside circumference axially tapered and frictionally engaging said inside tapered surface of said cylindrical thermally conductive ring; a cylindrical cover plate having an outside diameter substantially equal to the outside surface of said cylindrical thermally conductive ring and containing a plurality of fastener access holes extending therethrough; a plurality of fastener means extending through said fastener access holes to engage said first planar side of said circular transfer disk, thereby pulling said transfer disk into pressed cooperation with said thermally conductive ring; and a substantially cylindrical electronics module having a first and second planar side whereby said first planar side contains electronics components and said second planar side is conductively affixed to said second planar side of said circular transfer disk.

Claim 13

A heat sink according to claim 9 wherein said cylindrical thermally conductive ring is slotted to allow expansion of said ring against the inside surface of said thermally conductive cylindrical housing.

Claim 14

A heat sink device according to claim 5 wherein said circular heat transfer disk, said substantially circular electronics module, and said cover plate are all truncated forming a flattened side whereby a wiring harness can pass unimposed when said elements are assembled.