Patent US5059379A successfully refreshed from Google Patents.
US5059379A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of resin sealing semiconductor devices
Assignee: Mitsubishi Electric Corp
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Filing: 1989-12-08
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Granted: 1991-10-22
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Expires: 2009-12-08
Abstract
Abstract A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.
Inventors
- 👤 Yasutsugu Tsutsumi
- 👤 Sueyoshi Tanaka
- 👤 Tatsuro Takahashi
- 👤 Yutaka Morita
- 👤 Hideaki Seuzaki
- 👤 Hiromichi Yamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:03
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/17; B29C45/1742; B29C45/1744; B29C45/02; B30; B30B; B30B15/00; B30B15/06
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
179 words
A method of resin sealing semiconductor devices comprising: placing semiconductor devices in cavities provided in a pair of chase blocks; clamping the pair of chase blocks together in a press having two opposed press surfaces, two bases, one of the bases being disposed on each of the press surfaces, two retention boards, each retention board supporting one of the chase blocks, spacer blocks disposed between the respective bases and retention boards, a plurality of support members disposed between and contacting the respective bases and retention boards for transmitting forces to the chase blocks from the press, the support members being longer between the respective bases and retention boards than the spacer blocks; actuating the press and thereby applying a compressive force to urge the chase blocks together, the compressive force being transmitted from the press to the chase blocks through the support members, elastically compressing the support members, while maintaining clearance between the respective retention boards and spacer blocks; and injection plastic into the cavities while clamping the pair of chase blocks together to resin seal said semiconductor devices.
Claim 2
Independent Claim
179 words
A method of resin sealing semiconductor devices comprising: placing semiconductor devices in cavities provided in a pair of chase blocks; clamping the pair of chase blocks together in a press having two opposed press surfaces, two bases, one of the bases being disposed on each of the press surfaces, two retention boards, each retention board supporting one of the chase blocks, spacer blocks disposed between the respective bases and retention boards, a plurality of support members disposed between and contacting the respective bases and retention boards for transmitting forces to the chase blocks from the press, the support members being longer between the respective bases and retention boards than the spacer blocks; actuating the press and thereby applying a compressive force to urge the chase blocks together, the compressive force being transmitted from the press to the chase blocks through the support members, elastically compressing the support members, while maintaining clearance between the respective retention boards and spacer blocks; and injection plastic into the cavities while clamping the pair of chase blocks together to resin seal said semiconductor devices.
Claim 3
Independent Claim
230 words
A method of resin sealing semiconductor devices comprising: placing semiconductor devices in cavities provided in a pair of chase blocks; clamping the pair of chase blocks together in a press having two opposed press surfaces, two bases, one of the bases being disposed on each of the press surfaces, two retention boards, each retention board being fixedly mounted to one of the bases, spacer blocks disposed between the respective bases and retention boards for supporting the retention boards, a plurality of support pins disposed between and contacting the respective bases and retention boards and chase blocks for transmitting forces to the chase blocks from the press, the chase blocks having recesses facing the respective retention boards, the support pins being disposed within the recesses in the chase blocks and having lengths between the respective retention boards and chase blocks sufficient to maintain a separation between the respective retention boards and the chase blocks when the chase blocks are clamped together in the press; actuating the press and thereby applying a compressive force to urge the chase blocks together, the compressive force being transmitted from the press to the chase blocks through the support pins, elastically compressing the support pins while maintaining clearance between the respective retention boards and chase blocks; and injecting plastic into the cavities while clamping the pair of chase blocks together to resin seal said semiconductor devices.
Claim 4
Independent Claim
230 words
A method of resin sealing semiconductor devices comprising: placing semiconductor devices in cavities provided in a pair of chase blocks; clamping the pair of chase blocks together in a press having two opposed press surfaces, two bases, one of the bases being disposed on each of the press surfaces, two retention boards, each retention board being fixedly mounted to one of the bases, spacer blocks disposed between the respective bases and retention boards for supporting the retention boards, a plurality of support pins disposed between and contacting the respective bases and retention boards and chase blocks for transmitting forces to the chase blocks from the press, the chase blocks having recesses facing the respective retention boards, the support pins being disposed within the recesses in the chase blocks and having lengths between the respective retention boards and chase blocks sufficient to maintain a separation between the respective retention boards and the chase blocks when the chase blocks are clamped together in the press; actuating the press and thereby applying a compressive force to urge the chase blocks together, the compressive force being transmitted from the press to the chase blocks through the support pins, elastically compressing the support pins while maintaining clearance between the respective retention boards and chase blocks; and injecting plastic into the cavities while clamping the pair of chase blocks together to resin seal said semiconductor devices.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-21 | 1995-04-22 | 1995-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-21 | 1999-04-22 | 1999-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-21 | 2003-04-22 | 2003-10-22 | $7700.00 | Window Closed / Lapsed |