US5055378A
Expired / Lapsed
US
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Solder resist composition
Assignee: Toshiba Corp
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Filing: 1988-11-10
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Granted: 1991-10-08
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Expires: 2008-11-10
Abstract
Abstract A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.
Inventors
- 👤 Masataka Miyamura
- 👤 Yusuke Wada
- 👤 Toshiharu Nakagawa
- 👤 Yuji Nakaizumi
- 👤 Kazuhiro Takeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0388; C; C08; C08F; C08F299/00; C08F299/02; C08F299/022; C08F299/026; C08G; C08G59/00; C08G59/14; C08G59/1433; C08G59/1438; C08G59/1455; C08G59/1461; C08G59/1466; C08L; C08L63/00; C08L63/10; H05K3/285; H05K3/287; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
131 words
A solder resist composition, comprising: (a) a partially acrylated and/or methacrylated bisphenol A novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to bisphenol A novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (b) a partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to cresol novolak and/or phenol novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (c) a photopolymerization initiator in an amount sufficient to photopolymerize said components (a) and (b); (d) a thermosetting agent in an amount sufficient to thermally cure said components (a) and (b); (e) an inorganic filler; and (f) an organic solvent.
Claim 2
Dependent Claim
131 words
A solder resist composition, comprising: (a) a partially acrylated and/or methacrylated bisphenol A novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to bisphenol A novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (b) a partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to cresol novolak and/or phenol novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (c) a photopolymerization initiator in an amount sufficient to photopolymerize said components (a) and (b); (d) a thermosetting agent in an amount sufficient to thermally cure said components (a) and (b); (e) an inorganic filler; and (f) an organic solvent.
Claim 3
Dependent Claim
31 words
The composition according to claim 1, wherein said component (b) is present in an amount of 50 to 150 parts by weight based on 100 parts by weight of component (a).
Claim 4
Dependent Claim
32 words
The composition according to claim 1, wherein said component (b) is present in an amount of 60 to 100 parts by weight based on 100 parts by weight of said component (a).
Claim 5
Dependent Claim
31 words
The composition according to claim 1, wherein said component (c) is present in an amount of 1 to 25 parts by weight based on 100 parts by weight of component (a).
Claim 6
Dependent Claim
32 words
The composition according to claim 1, wherein said component (c) is present in an amount of 3 to 20 parts by weight based on 100 parts by weight of said component (a).
Claim 7
Dependent Claim
32 words
The composition according to claim 1, wherein said component (d) is present in an amount of 0.5 to 15 parts by weight based on 100 parts by weight of said component (a).
Claim 8
Dependent Claim
32 words
The composition according to claim 1, wherein said component (d) is present in an amount of 1 to 10 parts by weight based on 100 parts by weight of said component (a).
Claim 9
Dependent Claim
32 words
The composition according to claim 1, wherein said component (e) is present in an amount of 10 to 200 parts by weight based on 100 parts by weight of said component (a).
Claim 10
Dependent Claim
32 words
The composition according to claim 1, wherein said component (f) is present in an amount of 30 to 200 parts by weight based on 100 parts by weight of said component (a).
Claim 11
Dependent Claim
27 words
The composition according to claim 1, wherein said thermosetting agent (d) includes at least one of a guanidine compound and an imidazole compound having a diaminotriazine skeleton.
Claim 12
Dependent Claim
118 words
A solder resist composition, comprising: (a) a partially acrylated and/or methacrylated bisphenol A novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to bisphenol A novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (b) a partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to cresol novolak and/or phenol novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (c) a photopolymerization initiator; (d) a thermosetting agent; (e) an inorganic filler; (f) an organic solvent; and (g) a silane coupling agent or a titanate coupling agent.
Claim 13
Dependent Claim
118 words
A solder resist composition, comprising: (a) a partially acrylated and/or methacrylated bisphenol A novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to bisphenol A novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (b) a partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin in which 0.1 to 0.9 equivalents of acrylic acid and/or methacrylic acid are adducted to cresol novolak and/or phenol novolak epoxy resin per equivalent of the epoxy group of the epoxy resin; (c) a photopolymerization initiator; (d) a thermosetting agent; (e) an inorganic filler; (f) an organic solvent; and (g) a silane coupling agent or a titanate coupling agent.
Claim 14
Dependent Claim
32 words
The composition according to claim 11, wherein said component (b) is present in an amount of 50 to 50 parts by weight based on 100 parts by weight of said component (a).
Claim 15
Dependent Claim
32 words
The composition according to claim 11, wherein said component (b) is present in an amount of 60 to 100 parts by weight based on 100 parts by weight of said component (a).
Claim 16
Dependent Claim
32 words
The composition according to claim 11, wherein said component (c) is present in an amount of 1 to 25 parts by weight based on 100 parts by weight of said component (a).
Claim 17
Dependent Claim
32 words
The composition according to claim 11, wherein said component (c) is present in an amount of 3 to 20 parts by weight based on 100 parts by weight of said component (a).
Claim 18
Dependent Claim
32 words
The composition according to claim 11, wherein said component (d) is present in an amount of 0.5 to 15 parts by weight based on 100 parts by weight of said component (a).
Claim 19
Dependent Claim
32 words
The composition according to claim 11, wherein said component (d) is present in an amount of 1 to 10 parts by weight based on 100 parts by weight of said component (a).
Claim 20
Dependent Claim
32 words
The composition according to claim 11, wherein said component (e) is present in an amount of 10 to 200 parts by weight based on 100 parts by weight of said component (a).
Claim 21
Dependent Claim
32 words
The composition according to claim 11, wherein said component (f) is present in an amount of 30 to 200 parts by weight based on 100 parts by weight of said component (a).
Claim 22
Dependent Claim
27 words
The composition according to claim 11, wherein said thermosetting agent (d) includes at least one of a guanidine compound and an imidazole compound having a diaminotriazine skeleton.
Claim 23
Dependent Claim
32 words
The composition according to claim 11, wherein said component (g) is present in an amount of 0.1 to 4 parts by weight based on 100 parts by weight of said component (a).
Claim 24
Dependent Claim
32 words
The composition according to claim 11, wherein said component (g) is present in an amount of 0.2 to 2 parts by weight based on 100 parts by weight of said component (a).
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |