Patent US5049628A successfully refreshed from Google Patents.
US5049628A
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Unsaturated group-containing polycarboxlic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof
Assignee: Nippon Kayaku Co Ltd
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Filing: 1989-09-27
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Granted: 1991-09-17
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Expires: 2009-09-27
Abstract
Abstract The present invention relates to an unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof; a composition comprising the resin and a cured product of the resin or the composition. The composition according to the present invention is developable with an aqueous alkaline solution and suitable for a solder resist composition which is excellent in heat resistance, solvent resistance, adhesion, electric insulation property and storage stability.
Inventors
- 👤 Kazuyoshi Nawata
- 👤 Tetsuo Ohkubo
- 👤 Minoru Yokoshima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:09
CPC Classifications
C; C08; C08L; C08L63/00; C08L63/10; C08F; C08F299/00; C08F299/02; C08F299/026; C08G; C08G59/00; C08G59/02; C08G59/04; C08G59/06; C08G59/08; C08G59/14; C08G59/1433; C08G59/1438; C08G59/1455; C08G59/1461; C08G59/1466; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08G59/40; C08G59/42; C08G59/4292; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
45 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 2
Dependent Claim
45 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 3
Dependent Claim
55 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting a compound represented by the following formula [I]: ##STR3## wherein R represents H or CH 3 , and n represents 0 or an integer of not less than 1, with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 4
Dependent Claim
55 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting a compound represented by the following formula [I]: ##STR3## wherein R represents H or CH 3 , and n represents 0 or an integer of not less than 1, with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 5
Dependent Claim
56 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting a compound represented by the following formula [II]: ##STR4## wherein R each represents H or CH 3 , and n represents 0 or an integer of not less than 1, with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 6
Dependent Claim
56 words
An unsaturated group-containing polycarboxylic acid resin produced by reacting a compound represented by the following formula [II]: ##STR4## wherein R each represents H or CH 3 , and n represents 0 or an integer of not less than 1, with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof.
Claim 7
Dependent Claim
55 words
The resin according to any one of claims 1, 2 and 3, wherein the polybasic carboxylic acid or an anhydride thereof is at least one member selected from the group consisting of maleic acid, succinic acid, phthalic acid, tetrachlorophthalic acid, tetrabromophthalic acid, endomethylenetetrahydrophthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, trimellitic acid, pyromellitic acid and anhydrides thereof.
Claim 8
Dependent Claim
20 words
A resin composition comprising the unsaturated group-containing polycarboxylic acid resin according to any one of claims 1, 2 and 3.
Claim 9
Dependent Claim
63 words
A resin composition comprising (A) the unsaturated group-containing polycarboxylic acid resin according to any one of claims 1, 2 and 3, and (B) at least one selected from the group consisting of epoxy compounds, epoxy acrylates which are reaction products of the epoxy compound with (meth)acrylic acid, carbitol (meth)acrylate, phenoxyethyl (meth)acrylate, pentaerythritol tri(meth)acrylate, tris(hydroxyethyl)isocyanurate di(meth)acrylate, tri(hydroxyethyl)isocyanurate tri(meth)acrylate, acryloylmorpholine, trimethylolpropane tri(meth)acrylate and dipentaerythritol poly(meth)acrylate.
Claim 10
Dependent Claim
62 words
The resin composition according to claim 6, wherein said ingredient (A) is an unsaturated group-containing polycarboxylic acid resin produced by using at least one selected from the group consisting of maleic acid, succinic acid, phthalic acid, tetrachlorophthalic acid, tetrabromophthalic acid, endomethylenetetrahydrophthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, trimellitic acid, pyromellitic acid and anhydrides thereof as a polybasic carboxylic acid or an anhydride thereof.
Claim 11
Dependent Claim
21 words
The resin composition according to claim 6, wherein the weight ratio of (A) and (B) is 10 to 100:0 to 90.
Claim 12
Dependent Claim
20 words
The resin composition according to claim 6, wherein the weight of (A) and (B) is 20 to 90:10 to 80.
Claim 13
Dependent Claim
14 words
The resin composition according to claim 5 which is used for a solder resist.
Claim 14
Dependent Claim
14 words
The resin composition according to claim 6 which is used for a solder resist.
Claim 15
Dependent Claim
14 words
The resin composition according to claim 7 which is used for a solder resist.
Claim 16
Dependent Claim
14 words
The resin composition according to claim 8 which is used for a solder resist.
Claim 17
Dependent Claim
14 words
The resin composition according to claim 9 which is used for a solder resist.
Claim 18
Dependent Claim
18 words
A cured product produced by curing the resin according to any one of claims 1, 2 and 3.
Claim 19
Dependent Claim
12 words
A cured product produced by curing the resin according to claim 4.
Claim 20
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 5.
Claim 21
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 6.
Claim 22
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 7.
Claim 23
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 8.
Claim 24
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 9.
Claim 25
Dependent Claim
21 words
The resin composition according to claim 7, wherein the weight ratio of (A) to (B) is 10 to 100:0 to 90.
Claim 26
Dependent Claim
21 words
The resin composition according to claim 7, wherein the weight ratio of (A) to (B) is 20 to 90:10 to 80.
Claim 27
Dependent Claim
14 words
The resin composition according to claim 22 which is used for a solder resist.
Claim 28
Dependent Claim
14 words
The resin composition according to claim 23 which is used for a solder resist.
Claim 29
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 22.
Claim 30
Dependent Claim
13 words
A cured product produced by curing the resin composition according to claim 23.
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