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US5047359A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of implanting into the sidewall of a trench by rotating the wafer

Assignee: Mitsubishi Electric Corp
•
Filing: 1989-04-26
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Granted: 1991-09-10
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Expires: 2009-04-26
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Abstract

Abstract The present invention relates to a method of manufacturing a semiconductor device. In order to controllably introduce impurities into the side wall of a trench 2a by ion implantation impurity ions are directed at a predetermined angle into the side wall of the trench 2a provided in a wafer 2a and, for implantation thereof, at the same time, the wafer 2 is rotated around an ion implantation axis at a rotational speed related to the ion implantation current.

Inventors

  • 👤 Masao Nagatomo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 07:08
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/222; H10P30/22; H10P30/221

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 186 words
A method of manufacturing a semiconductor device having portions at which impurity ions are implanted, comprising the steps of: forming a trench of a predetermined depth and width in a substrate surface of a wafer, for forming an impurity ion implantation region therein at a surface of a side wall of the trench; forming an ion implantation mask of a predetermined thickness on said substrate surface of said wafer except for said trench; mounting said wafer for rotation thereof about a rotation axis, such that an acute angle (90-θ), where θ is within the range 45° to 90°, formed between side wall surface of said trench and a direction of impurity ion implantation is determined according to the relationship tan (90-θ) (said width of said trench)/(sum of said ion implantation mask thickness+said depth of said trench); forming said thin ion implantation region, by rotating said mounted wafer about said rotation axis at an angular velocity depending on an implantation current of said impurity ions and implanting the impurity ions to said inner surface of said side wall of said trench while said wafer is being rotated.
Claim 2
Independent Claim 186 words
A method of manufacturing a semiconductor device having portions at which impurity ions are implanted, comprising the steps of: forming a trench of a predetermined depth and width in a substrate surface of a wafer, for forming an impurity ion implantation region therein at a surface of a side wall of the trench; forming an ion implantation mask of a predetermined thickness on said substrate surface of said wafer except for said trench; mounting said wafer for rotation thereof about a rotation axis, such that an acute angle (90-θ), where θ is within the range 45° to 90°, formed between side wall surface of said trench and a direction of impurity ion implantation is determined according to the relationship tan (90-θ) (said width of said trench)/(sum of said ion implantation mask thickness+said depth of said trench); forming said thin ion implantation region, by rotating said mounted wafer about said rotation axis at an angular velocity depending on an implantation current of said impurity ions and implanting the impurity ions to said inner surface of said side wall of said trench while said wafer is being rotated.
Claim 3
Dependent Claim 39 words
A method of manufacturing a semiconductor device in accordance with claim 1, wherein: the wafer is mounted to be inclined with respect to said rotation axis at an angle greater than the acute angle (90-θ) by a predetermined amount.
Claim 4
Dependent Claim 19 words
A method of manufacturing a semiconductor device in accordance with claim 2, wherein: said predetermined amount is approximately 7°.

References Cited (Backward Citations)

US3388009A Cited
US3388009B1 Cited
JPS5384553A Cited
JPS53119671A Cited
JPS5575235A Cited
JPS55165341A Cited
US4404233A Cited
JPS58105324A Cited
US4532696A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-09-09 1995-03-11 1995-09-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-09-09 1999-03-11 1999-09-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-09-09 2003-03-11 2003-09-10 $7700.00 Window Closed / Lapsed

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