Semiconductor laser assembly

Claim 2

A semiconductor laser assembly comprising: a heatsink having first and second orthogonal surfaces; a first semiconductor photodetector mounted on said first surface of said heatsink; first and second conductive blocks mounted on said first surface of said heatsink, said conductive blocks being electrically isolated from each other and said first photodetector, each of said conductive blocks having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, each of said first and second surfaces of said first and second conductive blocks being of sufficient size to act as a wire bonding pad; a semiconductor chip mounted on said second surface of said heatsink, including a second semiconductor photodetector and a conductive region having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, said first surface of said conductive region being of sufficient size to act as a wire bonding pad; a semiconductor laser coupled to said second surface of said conductive region; a first wire connected between the semiconductor laser and the second surface of the first conductive block; a second wire connected between the second photodetector and the second surface of the second conductive block; a third wire connected between the first surface of the conductive region and a first pin; a fourth wire connected between the first surface of the first conductive block and a second pin; and a fifth wire connected between the first surface of the second conductive block and a third pin.

Claim 3

A semiconductor laser assembly comprising: a heatsink having first and second orthogonal surfaces; a first semiconductor photodetector mounted on said first surface of said heatsink; first and second conductive blocks mounted on said first surface of said heatsink, said conductive blocks being electrically isolated from each other and said first photodetector, each of said conductive blocks having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, each of said first and second surfaces of said first and second conductive blocks being wire bonding pads; a semiconductor chip mounted on said second surface of said heatsink, including a second semiconductor photodetector and a conductive region having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, said first surface of said conductive region being of sufficient size to act as a wire bonding pad; a semiconductor laser coupled to said second surface of said conductive region; and a reverse surge current diode on the semiconductor chip electrically coupled to the semiconductor laser.

Claim 4

A semiconductor laser assembly comprising: a heatsink having first and second orthogonal surfaces; a first semiconductor photodetector mounted on said first surface of said heatsink; first and second conductive blocks mounted on said first surface of said heatsink, said conductive blocks being electrically isolated from each other and said first photodetector, each of said conductive blocks having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, each of said first and second surfaces of said first and second conductive blocks being wire bonding pads; a semiconductor chip mounted on said second surface of said heatsink, including a second semiconductor photodetector and a conductive region having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, said first surface of said conductive region being of sufficient size to act as a wire bonding pad; a semiconductor laser coupled to said second surface of said conductive region; and a reverse surge current diode on the semiconductor chip electrically coupled to the semiconductor laser.

Claim 5

The semiconductor laser assembly of claim 2 wherein the reverse surge current diode is a photosensitive diode and covered with metal.

Claim 6

The semiconductor laser assembly of claim 2 further comprising a wire connected between the semiconductor laser and the reverse surge current diode.

Claim 7

A semiconductor laser assembly comprising: a heatsink having first and second orthogonal surfaces; a first semiconductor photodetector mounted on said first surface of said heatsink; first and second conductive blocks mounted on said first surface of said heatsink, said conductive blocks being electrically isolated from each other and said first photodetector, each of said conductive blocks having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, each of said first and second surfaces of said first and second conductive blocks being wire bonding pads, said conductive blocks being formed by mounting a conductive chip to the heatsink and saw cutting the chip; a semiconductor chip mounted on said second surface of said heatsink, including a second semiconductor photodetector and a conductive region having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, said first surface of said conducting region being of sufficient size to act as a wire bonding pad; and a semiconductor laser coupled to said second surface of said conductive region.

Claim 8

A semiconductor laser assembly comprising: a heatsink having first and second orthogonal surfaces; a first semiconductor photodetector mounted on said first surface of said heatsink; first and second conductive blocks mounted on said first surface of said heatsink, said conductive blocks being electrically isolated from each other and said first photodetector, each of said conductive blocks having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, each of said first and second surfaces of said first and second conductive blocks being wire bonding pads, said conductive blocks being formed by mounting a conductive chip to the heatsink and saw cutting the chip; a semiconductor chip mounted on said second surface of said heatsink, including a second semiconductor photodetector and a conductive region having first and second surfaces parallel to said first and second surfaces of said heatsink, respectively, said first surface of said conducting region being of sufficient size to act as a wire bonding pad; and a semiconductor laser coupled to said second surface of said conductive region.

Claim 9

A semiconductor laser assembly for generating and detecting a laser beam, the laser assembly comprising: (a) a laser module for generating said laser beam, the laser module including (i) first and second orthogonal laser module surfaces, (ii) a laser module photodetector (106) on the second surface of the laser module having first and second electrodes, (iii) a laser source (102) on the second surface of the laser module having first and second electrodes, (iv) a first laser module wire bond area (110) on the second surface electrically coupled to the first electrode of the laser module photodetector, (v) a second laser module wire bond area (114) on the first surface of the laser module electrically coupled to the second electrode of the laser module photodetector, and (vi) a third laser module wire bond area (108) on the second surface electrically coupled to the second electrode of the laser source; (b) a photodetector module (120) for detecting said laser beam, the photodetector module having first and second orthogonal photodetector module surfaces and the laser module being attached to the photodetector module with the first and second laser module surfaces being parallel to the first and second photodetector module surfaces, respectively, the photodetector module including (i) a photodetector module photodetector located on the first photodetector module surface having first and second electrodes, (ii) a first photodetector module wire bond area (132a) located on the first photodetector module surface, (iii) a second photodetector module wire bond area (132b) located on the second photodetector module surface electrically coupled to the first photodetector module wire bond area (132a); (iv) a third photodetector module wire bond area (134a) located on the first photodetector module surface, and (v) a fourth photodetector module wire bond area (134b) located on the second photodetector module surface electrically coupled to the third photodetector module wire bond area (134a); (c) a first wire (144) connected between the first laser module wire bond area (110) and the second photodetector module wire bond area; (d) a second wire connected between the third laser module wire bond area (118) and the fourth photodetector wire bond area (134b); (e) a header having at least five output pins for external electrical connections, each pin having a pin wire bond area, each pin wire bond area being parallel to the other pin wire bond areas, the photodetector module being attached to the header with the second photodetector module surface and the second laser module surface being parallel to the pin wire bond areas; (f) a third wire (166a) connected between the second laser module wire bond area and one of the pin wire bond areas; (g) a fourth wire (166c) connected between the first photodetector module wire bond area and one of the pin wire bond areas; and (h) a fifth wire (166i) connected between the third photodetector module wire bond area and one of the pin wire bond areas.

Claim 10

A semiconductor laser assembly for generating and detecting a laser beam, the laser assembly comprising: (a) a laser module for generating said laser beam, the laser module including (i) first and second orthogonal laser module surfaces, (ii) a laser module photodetector (106) on the second surface of the laser module having first and second electrodes, (iii) a laser source (102) on the second surface of the laser module having first and second electrodes, (iv) a first laser module wire bond area (110) on the second surface electrically coupled to the first electrode of the laser module photodetector, (v) a second laser module wire bond area (114) on the first surface of the laser module electrically coupled to the second electrode of the laser module photodetector, and (vi) a third laser module wire bond area (108) on the second surface electrically coupled to the second electrode of the laser source; (b) a photodetector module (120) for detecting said laser beam, the photodetector module having first and second orthogonal photodetector module surfaces and the laser module being attached to the photodetector module with the first and second laser module surfaces being parallel to the first and second photodetector module surfaces, respectively, the photodetector module including (i) a photodetector module photodetector located on the first photodetector module surface having first and second electrodes, (ii) a first photodetector module wire bond area (132a) located on the first photodetector module surface, (iii) a second photodetector module wire bond area (132b) located on the second photodetector module surface electrically coupled to the first photodetector module wire bond area (132a); (iv) a third photodetector module wire bond area (134a) located on the first photodetector module surface, and (v) a fourth photodetector module wire bond area (134b) located on the second photodetector module surface electrically coupled to the third photodetector module wire bond area (134a); (c) a first wire (144) connected between the first laser module wire bond area (110) and the second photodetector module wire bond area; (d) a second wire connected between the third laser module wire bond area (118) and the fourth photodetector wire bond area (134b); (e) a header having at least five output pins for external electrical connections, each pin having a pin wire bond area, each pin wire bond area being parallel to the other pin wire bond areas, the photodetector module being attached to the header with the second photodetector module surface and the second laser module surface being parallel to the pin wire bond areas; (f) a third wire (166a) connected between the second laser module wire bond area and one of the pin wire bond areas; (g) a fourth wire (166c) connected between the first photodetector module wire bond area and one of the pin wire bond areas; and (h) a fifth wire (166i) connected between the third photodetector module wire bond area and one of the pin wire bond areas.

Claim 11

The laser assembly of claim 6 wherein the laser source comprises a semiconductor laser diode.

Claim 12

The laser assembly of claim 7 wherein the laser module further comprises a reverse surge current diode for preventing reverse surge voltage, the reverse surge current diode having a first electrode and a second electrode, the first electrode of the reverse surge current diode being electrically coupled to a second electrode of the laser source and the second electrode of the reverse surge current diode being electrically coupled to the first electrode of the laser source.

Claim 13

The laser assembly of claim 8 wherein the reverse surge current diode is a photosensitive diode located on the second surface of the laser module, the reverse surge current diode being coated with metal to prevent the diode from being photosensitive.