US4403243A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semi-conductor laser apparatus with support and soldering means for light-transmitting member
Assignee: Canon Inc
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Filing: 1981-04-30
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Granted: 1983-09-06
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Expires: 2001-04-30
Abstract
Abstract The present invention extends the service life of a semi-conductor laser element by bonding a light transmitting member for transmitting the output light from said laser element to a support member for said transmitting member with soft metal solder to improve hermetic sealing therebetween. The beam diameter of the output light generated by said semi-conductor laser element is not substantially changed when passing through the transmitting member since said bonding is conducted at a temperature not causing deformation by softening of said light transmitting member that could cause formation of a distortion therein. The surfacial precision of said light transmitting member also is improved by selecting the thermal expansion coefficient of the material constituting said light transmitting member to be approximately equal to that of said support member. Therefore, the invention provides a semi-conductor laser apparatus applicable in equipment requiring a high resolution.
Inventors
- 👤 Isao Hakamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 23:09
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/02208; H01S5/02212; H01S5/024; H01S5/02407; H01S5/02415; H01S5/0225; H01S5/02257; H01S5/0235; H01S5/02355; H01S5/0237; H01S5/02438; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/8506
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
94 words
A semi-conductor laser apparatus, comprising a semi-conductor laser element for generating a laser light; a light-transmitting member of an oxide for transmitting therethrough the laser light generated by said semi-conductor laser element; a metallic support member for supporting said light-transmitting member; and a soft metal solder for fixing said light-transmitting member to said metallic support member and joining the two together by being chemically bonded with oxygen in said light-transmitting member to thereby be directly bonded to said light-transmitting member when said metal solder, in a molten state, is subjected to ultrasonic wave vibration.
Claim 2
Dependent Claim
94 words
A semi-conductor laser apparatus, comprising a semi-conductor laser element for generating a laser light; a light-transmitting member of an oxide for transmitting therethrough the laser light generated by said semi-conductor laser element; a metallic support member for supporting said light-transmitting member; and a soft metal solder for fixing said light-transmitting member to said metallic support member and joining the two together by being chemically bonded with oxygen in said light-transmitting member to thereby be directly bonded to said light-transmitting member when said metal solder, in a molten state, is subjected to ultrasonic wave vibration.
Claim 3
Dependent Claim
16 words
A semi-conductor laser apparatus according to claim 1, wherein said light-transmitting member comprises a glass member.
Claim 4
Dependent Claim
39 words
A semi-conductor laser apparatus according to claim 1, wherein said soft metal solder contains an additive metal element which participates, as an oxide, in the oxygenic bonding at the junction between said soft metal solder and said light-transmitting member.
Claim 5
Dependent Claim
27 words
A semi-conductor laser apparatus according to claim 3, wherein said soft metal solder contains at least one of Pb--Sn alloys, In--Sn alloys, Bi--Sn alloys and Sn--Zn alloys.
Claim 6
Dependent Claim
39 words
A semi-conductor laser apparatus according to claim 2, wherein said soft metal solder contains an additive metal element which participates, as an oxide, in the oxygenic bonding at the junction between said soft metal solder and said light-transmitting member.
Claim 7
Dependent Claim
27 words
A semi-conductor laser apparatus according to claim 5, wherein said soft metal solder contains at least one of Pb--Sn alloys, In--Sn alloys, Bi--Sn alloys and Sn--Zn alloys.
Claim 8
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 1, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 9
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 2, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 10
Dependent Claim
34 words
A semi-conductor laser apparatus according to claim 1, wherein said light-transmitting member has an area bonded with said metallic support member through said soft metal solder, and an oxide is formed on said area.
Claim 11
Dependent Claim
34 words
A semi-conductor laser apparatus according to claim 2, wherein said light-transmitting member has an area bonded with said metallic support member through said soft metal solder, and an oxide is formed on said area.
Claim 12
Dependent Claim
119 words
A semi-conductor laser apparatus, comprising: a semi-conductor laser element for generating a laser light; a light-transmitting member for transmitting the laser light generated by said semi-conductor laser element; a metallic support member for supporting said light-transmitting member; a soft metal solder for fixing said light-transmitting member to said metallic support member and joining the two together by being chemically bonded with oxygen in said light-transmitting member to thereby be directly bonded to said light-transmitting member when said metal solder, in a molten state, is subjected to ultrasonic wave vibration; and a case member defining with said metallic support member, said light-transmitting member and said soft metal solder, a hermetically sealed chamber within which is enclosed said semi-conductor laser element.
Claim 13
Dependent Claim
119 words
A semi-conductor laser apparatus, comprising: a semi-conductor laser element for generating a laser light; a light-transmitting member for transmitting the laser light generated by said semi-conductor laser element; a metallic support member for supporting said light-transmitting member; a soft metal solder for fixing said light-transmitting member to said metallic support member and joining the two together by being chemically bonded with oxygen in said light-transmitting member to thereby be directly bonded to said light-transmitting member when said metal solder, in a molten state, is subjected to ultrasonic wave vibration; and a case member defining with said metallic support member, said light-transmitting member and said soft metal solder, a hermetically sealed chamber within which is enclosed said semi-conductor laser element.
Claim 14
Dependent Claim
26 words
A semi-conductor laser apparatus according to claim 11, wherein said hermetically sealed chamber is filled with a dry air or nitrogen gas, or maintained at vacuum.
Claim 15
Dependent Claim
63 words
A semi-conductor laser apparatus according to claim 11, wherein said case member further includes a metallic cylindrical support integrated with said metallic support member for said light-transmitting member and a metallic base closing an end of said cylindrical support opposite said metallic support member for said light-transmitting member, and said semi-conductor laser element is held in a stationary position in said case member.
Claim 16
Dependent Claim
63 words
A semi-conductor laser apparatus according to claim 12, wherein said case member further includes a metallic cylindrical support integrated with said metallic support member for said light-transmitting member and a metallic base closing an end of said cylindrical support opposite said metallic support member for said light-transmitting member, and said semi-conductor laser element is held in a stationary position in said case member.
Claim 17
Dependent Claim
39 words
A semi-conductor laser apparatus according to claim 11, wherein said soft metal solder contains an additive metal element which participates, as an oxide, in the oxygenic bonding at the junction between said soft metal solder and said light-transmitting member.
Claim 18
Dependent Claim
39 words
A semi-conductor laser apparatus according to claim 12, wherein said soft metal solder contains an additive metal element which participates, as an oxide, in the oxygenic bonding at the junction between said soft metal solder and said light-transmitting member.
Claim 19
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 11, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 20
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 12, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 21
Dependent Claim
34 words
A semi-conductor laser apparatus according to claim 11, wherein said light-transmitting member has an area bonded with said metallic support member through said soft metal solder, and an oxide is formed on said area.
Claim 22
Dependent Claim
34 words
A semi-conductor laser apparatus according to claim 12, wherein said light-transmitting member has an area bonded with said metallic support member through said soft metal solder, and an oxide is formed on said area.
Claim 23
Dependent Claim
45 words
A semi-conductor laser apparatus according to claim 1, wherein said soft metal solder is sandwiched under a pressure between said light-transmitting member and said metallic support member when it is subjected to ultrasonic wave vibration, and uniform surface precision is maintained at the junction therebetween.
Claim 24
Dependent Claim
18 words
A semi-conductor laser apparatus according to claim 21, wherein said soft metal solder contains an additive metal element.
Claim 25
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 21, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 26
Dependent Claim
45 words
A semi-conductor laser apparatus according to claim 2, wherein said soft metal solder is sandwiched under a pressure between said light-transmitting member and said metallic support member when it is subjected to ultrasonic wave vibration, and uniform surface precision is maintained at the junction therebetween.
Claim 27
Dependent Claim
18 words
A semi-conductor laser apparatus according to claim 24, wherein said soft metal solder contains an additive metal element.
Claim 28
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 25, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 29
Dependent Claim
45 words
A semi-conductor laser apparatus according to claim 11, wherein said soft metal solder is sandwiched under a pressure between said light-transmitting member and said metallic support member when it is subjected to ultrasonic wave vibration, and uniform surface precision is maintained at the junction therebetween.
Claim 30
Dependent Claim
18 words
A semi-conductor laser apparatus according to claim 27, wherein said soft metal solder contains an additive metal element.
Claim 31
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 28, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
Claim 32
Dependent Claim
45 words
A semi-conductor laser apparatus according to claim 12, wherein said soft metal solder is sandwiched under a pressure between said light-transmitting member and said metallic support member when it is subjected to ultrasonic wave vibration, and uniform surface precision is maintained at the junction therebetween.
Claim 33
Dependent Claim
18 words
A semi-conductor laser apparatus according to claim 30, wherein said soft metal solder contains an additive metal element.
Claim 34
Dependent Claim
28 words
A semi-conductor laser apparatus according to claim 31, wherein said light-transmitting member and said metallic support member are composed of materials having substantially the same thermal expansion coefficient.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-09-05 | 1987-03-07 | 1987-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-09-05 | 1991-03-07 | 1991-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-09-05 | 1995-03-07 | 1995-09-06 | $7700.00 | Window Closed / Lapsed |