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Polyimide and copper metal laminates

Assignee: Dow Chemical Co
•
Filing: 1989-05-15
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Granted: 1991-08-27
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Expires: 2009-05-15
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Abstract

Abstract A laminated structure comprising a copper metal substrate adhered to a polyimide polymer by the use of first and second adhesive resin layers.

Inventors

  • 👤 William O. Perry
  • 👤 W. Frank Richey

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 15:18
CPC Classifications
B; B32; B32B; B32B7/00; B32B7/04; B32B7/12; B32B15/00; B32B15/04; B32B15/08; B32B15/20; B32B27/00; B32B27/28; B32B27/281; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; B32B2311/00; B32B2311/12; B32B2379/00; B32B2379/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/12; H05K2203/121; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31692; Y10T428/31699; Y10T428/31721; Y10T428/31855; Y10T428/31909; Y10T428/31928

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 130 words
A laminated structure comprising: a) a copper metal substrate layer; b) a first adhesive resin layer comprising a first metal ion containing ionomer; c) a second adhesive resin layer comprising a second metal ion containing ionomer, said second metal ion being different from the first metal ion; and d) a polyimide polymer layer, said layers each comprising two major surfaces, the laminated structure being arranged such that one major surface of the copper metal substrate layer is in contact with the first major surface of the first adhesive resin layer, the remaining surface of which is in contact with the first major surface of the second adhesive resin layer, and the remaining surface of the second adhesive resin layer is in contact with a major surface of polyimide polymer layer.
Claim 2
Dependent Claim 130 words
A laminated structure comprising: a) a copper metal substrate layer; b) a first adhesive resin layer comprising a first metal ion containing ionomer; c) a second adhesive resin layer comprising a second metal ion containing ionomer, said second metal ion being different from the first metal ion; and d) a polyimide polymer layer, said layers each comprising two major surfaces, the laminated structure being arranged such that one major surface of the copper metal substrate layer is in contact with the first major surface of the first adhesive resin layer, the remaining surface of which is in contact with the first major surface of the second adhesive resin layer, and the remaining surface of the second adhesive resin layer is in contact with a major surface of polyimide polymer layer.
Claim 3
Dependent Claim 27 words
A laminated structure according to claim 1 wherein the first adhesive resin comprises an ionomeric derivative of a copolymer of ethylene and acrylic acid or methacrylic acid.
Claim 4
Dependent Claim 21 words
A laminated structure according to claim 1 wherein the first adhesive resin comprises a Cu +2 or Zn +2 metal ionomer.
Claim 5
Dependent Claim 28 words
A laminated structure according to claim 1 wherein the second adhesive resin layer comprises an ionomeric derivative of a copolymer of ethylene and acrylic acid or methacrylic acid.
Claim 6
Dependent Claim 21 words
A laminated structure according to claim 1 wherein the second adhesive resin layer comprises a Mg +2 or Al +3 ionomer.
Claim 7
Dependent Claim 86 words
A process for preparing a laminated structure comprising: (1) forming a first laminate of a copper metal substrate and a first adhesive resin layer comprising a first metal ion containing ionomer, (2) forming a second laminated structure comprising a polyimide polymer layer and a second adhesive resin layer comprising a second metal ion containing ionomer; and (3) contacting the first adhesive resin layer of the first laminated structure with the second adhesive resin layer of the second adhesive structure under conditions to provide a laminated structure.
Claim 8
Dependent Claim 86 words
A process for preparing a laminated structure comprising: (1) forming a first laminate of a copper metal substrate and a first adhesive resin layer comprising a first metal ion containing ionomer, (2) forming a second laminated structure comprising a polyimide polymer layer and a second adhesive resin layer comprising a second metal ion containing ionomer; and (3) contacting the first adhesive resin layer of the first laminated structure with the second adhesive resin layer of the second adhesive structure under conditions to provide a laminated structure.
Claim 9
Dependent Claim 27 words
A process according to claim 6 wherein the first adhesive resin layer comprises an ionomeric derivative of a copolymer of ethylene and acrylic acid or methacrylic acid.
Claim 10
Dependent Claim 19 words
A process according to claim 6 wherein the first adhesive resin comprises a Cu +2 or Zn +2 ionomer.
Claim 11
Dependent Claim 26 words
A process according to claim 6 wherein the second adhesive resin comprises an ionomeric derivative of a copolymer of ethylene and acrylic acid or methacrylic acid.
Claim 12
Dependent Claim 19 words
A process according to claim 6 wherein the second adhesive resin comprises a Mg +2 or Al +3 ionomer.

References Cited (Backward Citations)

US4092452A Cited
US4132857A Cited
US3998990A Cited
US4656068A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-08-26 1995-02-25 1995-08-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-08-26 1999-02-25 1999-08-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-08-26 2003-02-25 2003-08-27 $7700.00 Window Closed / Lapsed

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