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US5041897A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device

Assignee: SEIKOSHA Co Ltd A CORP OF JAPAN
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Filing: 1990-10-17
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Granted: 1991-08-20
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Expires: 2010-10-17
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Abstract

Abstract A semiconductor device has a fuse element formed on an insulating substrate, and a first insulating layer formed on the substrate and covering the fuse element. Further insulation on the first insulating layer nitride has an opening exposing the region of the first insulating layer above said fuse.

Inventors

  • 👤 Koji Machida
  • 👤 Hideyuki Nakamura
  • 👤 Hiroshi Tonegi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 12:58
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 77 words
In a semiconductor device comprising a thin film fuse on a first insulating layer, a second insulating layer on said first insulating layer and covering said thin film fuse, and a further insulating layer on said second insulating layer, the improvement wherein said further insulating layer has a hole extending therethrough above said fuse and of the shape of said fuse, thereby exposing said second insulating layer above said fuse, said second insulating layer being silicon nitride.
Claim 2
Dependent Claim 77 words
In a semiconductor device comprising a thin film fuse on a first insulating layer, a second insulating layer on said first insulating layer and covering said thin film fuse, and a further insulating layer on said second insulating layer, the improvement wherein said further insulating layer has a hole extending therethrough above said fuse and of the shape of said fuse, thereby exposing said second insulating layer above said fuse, said second insulating layer being silicon nitride.
Claim 3
Dependent Claim 107 words
In a semiconductor device comprising a thin film fuse on a first insulating layer, a second insulating layer on said first insulating layer and covering said thin film fuse, and a further insulating layer on said second insulating layer, the improvement wherein said further insulating layer has a hole extending therethrough above said fuse and of the shape of said fuse, thereby exposing said second insulating layer above said fuse, said further insulating layer being comprised of third and fourth insulating layers, said third insulating layer being a silicon oxide layer on said second insulating layer, and said fourth insulating layer being a doped silicon oxide layer.
Claim 4
Dependent Claim 107 words
In a semiconductor device comprising a thin film fuse on a first insulating layer, a second insulating layer on said first insulating layer and covering said thin film fuse, and a further insulating layer on said second insulating layer, the improvement wherein said further insulating layer has a hole extending therethrough above said fuse and of the shape of said fuse, thereby exposing said second insulating layer above said fuse, said further insulating layer being comprised of third and fourth insulating layers, said third insulating layer being a silicon oxide layer on said second insulating layer, and said fourth insulating layer being a doped silicon oxide layer.

References Cited (Backward Citations)

US4428066A Cited
US4536949A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-08-19 1995-02-18 1995-08-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-08-19 1999-02-18 1999-08-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-08-19 2003-02-18 2003-08-20 $7700.00 Window Closed / Lapsed

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