US5039627A
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Method of producing a quasi-flat semiconductor device capable of a multi-wavelength laser effect and the corresponding device
Assignee: France Telecom R&D SA
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Filing: 1990-01-17
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Granted: 1991-08-13
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Expires: 2010-01-17
Abstract
Abstract A method of producing a quasi-flat semiconductor device capable of a multi-wavelength laser effect and the device thus produced. On the basis of a double heterostructure stack supported by a substrate comprising steps, following levelling of the stack and diffusion through a flat surface, a semiconductor device is obtained which is capable of a multi-wavelength laser effect, of which the different junctions are situated in a plane parallel with the base of the substrate.
Inventors
- 👤 Louis Menigaux
- 👤 Louis Dugrand
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 06:09
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/40; H01S5/4025; H01S5/4031; H01S5/4043; H10; H10H; H10H20/00; H10H20/01; H10H20/011; H10H20/013; H01S5/4087; Y; Y10; Y10S; Y10S148/00; Y10S148/072; Y10S148/095
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
242 words
A method of producing a semiconductor device, in particular a device capable of a laser effect, comprising the steps of: a) forming a substrate in stair-step configuration having elongated treads which are parallel with one another and separated from one another by transitions; b) disposing on said substrate a mono-crystalline double heterostructure stack comprising alternating confinement layers and active layers, wherein said active layers have compositions different from one another, each said confinement and active layer being assigned a numerical rank in order of said disposing on said substrate, all said layers having the same type of conductivity, producing thereby parallel stages parallel with said treads; c) levelling said stack to obtain a block having a substantially flat free upper surface; d) forming a substantially flat upper layer on at least a part of said substantially flat free upper surface of said stack; e) introducing impurities of a conductivity opposite to that of the confinement layers through said substantially flat upper layer which has the same type of conductivity as said impurities or a low but opposite conductivity, into the stack of said block, said impurities forming parallel and elongated strips and producing P-N junctions within the stack which are electrically and individually operable and insulated from one another, the P-N junctions of at least two adjacent strips being formed in the vicinity of active layers of different rank and composition; and f) optically preparing the small opposite ends of said strips.
Claim 2
Independent Claim
242 words
A method of producing a semiconductor device, in particular a device capable of a laser effect, comprising the steps of: a) forming a substrate in stair-step configuration having elongated treads which are parallel with one another and separated from one another by transitions; b) disposing on said substrate a mono-crystalline double heterostructure stack comprising alternating confinement layers and active layers, wherein said active layers have compositions different from one another, each said confinement and active layer being assigned a numerical rank in order of said disposing on said substrate, all said layers having the same type of conductivity, producing thereby parallel stages parallel with said treads; c) levelling said stack to obtain a block having a substantially flat free upper surface; d) forming a substantially flat upper layer on at least a part of said substantially flat free upper surface of said stack; e) introducing impurities of a conductivity opposite to that of the confinement layers through said substantially flat upper layer which has the same type of conductivity as said impurities or a low but opposite conductivity, into the stack of said block, said impurities forming parallel and elongated strips and producing P-N junctions within the stack which are electrically and individually operable and insulated from one another, the P-N junctions of at least two adjacent strips being formed in the vicinity of active layers of different rank and composition; and f) optically preparing the small opposite ends of said strips.
Claim 3
Dependent Claim
15 words
A method according to claim 1, wherein said comprises erosion by a photo etching process.
Claim 4
Dependent Claim
14 words
A method according to claim 1, wherein the double heterostructure comprises group III-V alloys.
Claim 5
Dependent Claim
40 words
A method according to claim 3, wherein the double heterostructure comprises at least one material selected from the group consisting of aluminum, gallium and indium and at least one material selected from the group consisting of phosphorous, arsenic and antimony.
Claim 6
Dependent Claim
53 words
A method according to claim 4, wherein the active layers are of type N, and comprise Ga 1-x Al x As, x differing each time, and being less than approximately 10%, while the confining layers comprise Ga l-y Al y As, y being substantially the same for all and equal to approximately 30%.
Claim 7
Dependent Claim
17 words
A method according to claim 1, wherein the layers of the double heterostructure are deposited by epitaxy.
Claim 8
Dependent Claim
33 words
A method according to claim 1, wherein the thickness of the active layers is about one-tenth of a micron while the thickness of the confining layers is on the order of 1 micron.
Claim 9
Dependent Claim
13 words
A method according to claim 1, wherein said upper layer deposited by epitaxy.
Claim 10
Dependent Claim
19 words
A method according to claim 8, wherein the thickness of the upper layer is about one-tenth of a micron.
Claim 11
Dependent Claim
15 words
A method according to claim 1, wherein the upper layer is a group III-V alloy.
Claim 12
Dependent Claim
15 words
A method according to claim 5, wherein the upper layer is type P gallium arsenide.
Claim 13
Dependent Claim
49 words
A method according to claim 1, wherein said levelling comprises an erosion operation applied to the upper surface of the block, laying bare at least over the major part of the eroded surface of the stack, the upper portion of an active layer which serves as an upper layer.
Claim 14
Dependent Claim
44 words
A method according to claim 1, wherein regions of an inverted type are formed by the introduction of impurities, said regions extending from the upper layer as far as the active layer of the desired rank in order respectively to form said P-N junctions.
Claim 15
Dependent Claim
21 words
A method according to claim 13, wherein said impurities are selected from the group consisting of zinc, cadmium, magnesium and beryllium.
Claim 16
Dependent Claim
12 words
A method according to claim 13, wherein the said regions are localized.
Claim 17
Dependent Claim
18 words
A method according to claim 13, wherein said regions form one single continuous zone of an inverted type.
Claim 18
Dependent Claim
13 words
A method according to claim 13, wherein said regions are formed by diffusion.
Claim 19
Dependent Claim
17 words
A method according to claim 13, wherein said regions are formed by ionic implantation followed by annealing.
Claim 20
Dependent Claim
66 words
A method according to claim 13, wherein the P-N junctions are electrically insulated from one another by localized eroding between said inverted type regions by a dry or wet process, in order to engrave or etch grooves extending from said upper layer as far as at least beyond each P-N junction situated on either side of the groove, which makes it possible to accommodate said strips.
Claim 21
Dependent Claim
27 words
A method according to claim 13, wherein said P-N junctions are insulated electrically by proton implantation between said inverted type regions in order to accommodate said strips.
Claim 22
Dependent Claim
26 words
A method according to claim 13, additionally comprising depositing an individual metallic contact on each inverted type region and a common metallic contact on the substrate.
Claim 23
Dependent Claim
14 words
A method according to claim 1, wherein said optically preparing comprises a splitting process.
Claim 24
Dependent Claim
17 words
A method according to claim 1, wherein said optically preparing comprises a wet or dry machining stage.
Claim 25
Dependent Claim
40 words
A method according to claim 1, wherein the substrate comprises a group III-V alloy which is heavily doped with the same type of conductivity as the layers in the stack, in contact with the bottom confinement layer in the stack.
Claim 26
Dependent Claim
17 words
A method according to claim 24, wherein the substrate further comprises a group III-V alloy or silicon.
Claim 27
Dependent Claim
79 words
A method according to claim 1, wherein said step of forming the substrate also comprises forming a transverse riser extending in a plane substantially at right-angles to each transition and defining on said substrate lower and upper bottoms for said stack, and wherein said disposing step comprises an additional step to produce within the stack at least in the sector supported by the upper bottoms, a transparent layer forming a light guide for light emissions from the P-N junctions.
Claim 28
Dependent Claim
29 words
A method according to claim 6, wherein said layers of the double heterostructure are deposited by liquid phase epitaxy, molecular beam epitaxy, or vapor phase deposition of organometallic compounds.
Claim 29
Independent Claim
211 words
A method of producing a semiconductor device, in particular a device capable of a laser effect, comprising the steps of: a) forming a substantially flat substrate and disposing thereon a mono-crystalline double heterostructure stack comprising alternate confinement layers and active layers, wherein said active layers have compositions different from one another, each said confinement and active layer being assigned a numerical rank in order of said disposing on said substrate, all said layers having the same type of conductivity, said stack having a substantially flat free upper surface; b) forming a substantially flat upper layer on at least a part of said substantially flat free upper surface of said stack; c) introducing impurities of a type of conductivity opposite to that of the confinement layers through said substantially flat upper layer which has the same type of conductivity as said impurities or a low but opposite conductivity, into the stack of said block, said impurities forming parallel and elongated strips and producing P-N junctions within the stack which are electrically and individually operable and insulated from one another, the P-N junctions of at least two adjacent strips being formed in the vicinity of active layers of different rack and composition; and d) optically preparing the small opposite ends of said strips.
Claim 30
Independent Claim
211 words
A method of producing a semiconductor device, in particular a device capable of a laser effect, comprising the steps of: a) forming a substantially flat substrate and disposing thereon a mono-crystalline double heterostructure stack comprising alternate confinement layers and active layers, wherein said active layers have compositions different from one another, each said confinement and active layer being assigned a numerical rank in order of said disposing on said substrate, all said layers having the same type of conductivity, said stack having a substantially flat free upper surface; b) forming a substantially flat upper layer on at least a part of said substantially flat free upper surface of said stack; c) introducing impurities of a type of conductivity opposite to that of the confinement layers through said substantially flat upper layer which has the same type of conductivity as said impurities or a low but opposite conductivity, into the stack of said block, said impurities forming parallel and elongated strips and producing P-N junctions within the stack which are electrically and individually operable and insulated from one another, the P-N junctions of at least two adjacent strips being formed in the vicinity of active layers of different rack and composition; and d) optically preparing the small opposite ends of said strips.
Claim 31
Dependent Claim
14 words
A method according to claim 28, wherein the double heterostructure comprises group III-V alloys.
Claim 32
Dependent Claim
42 words
A method according to claim 29, wherein the double heterostructure comprises alloys of at least one material selected from the group consisting of aluminum, gallium and indium and at least one material selected from the group consisting of phosphorous, arsenic and antimony.
Claim 33
Dependent Claim
53 words
A method according to claim 30, wherein the active layers are of type N, and comprises Ga 1-x Al x As, x differing each time and being less than approximately 10%, while the confinement layers comprise Ga 1-y Al y As, y being substantially the same for all and equal to approximately 30%.
Claim 34
Dependent Claim
17 words
A method according to claim 28, wherein the layers of the double heterostructure are deposited by epitaxy.
Claim 35
Dependent Claim
29 words
A method according to claim 32, wherein the layers of the double heterostructure are deposited by liquid phase epitaxy, molecular beam epitaxy or vapor phase deposition of organometallic compounds.
Claim 36
Dependent Claim
33 words
A method according to claim 28, wherein the thickness of the active layers is about one-tenth of a micron while the thickness of the confinement layers is on the order of 1 micron.
Claim 37
Dependent Claim
26 words
A method according to claim 28, comprising depositing said upper layer on at least a part of said free upper surface of said stack by epitaxy.
Claim 38
Dependent Claim
19 words
A method according to claim 35, wherein the thickness of the upper layer is about one-tenth of a micron.
Claim 39
Dependent Claim
14 words
A method according to claim 28, wherein the upper layer is group III-V alloy.
Claim 40
Dependent Claim
16 words
A method according to claim 31, wherein the upper layer is a type P gallium arsenide.
Claim 41
Dependent Claim
45 words
A method according to claim 28, comprising formation of regions of an inverted type by the introduction of said impurities, said regions extending from the upper layer as far as the active layer of the desired rank in order respectively to form said P-N junctions.
Claim 42
Dependent Claim
24 words
A method according to claim 39, wherein said regions are formed by impurities selected from the group consisting of zinc, cadmium, magnesium and beryllium.
Claim 43
Dependent Claim
11 words
A method according to claim 39, wherein said regions are localized.
Claim 44
Dependent Claim
18 words
A method according to claim 39, wherein said regions form one single continuous zone of an inverted type.
Claim 45
Dependent Claim
13 words
A method according to claim 39, wherein said regions are formed by diffusion.
Claim 46
Dependent Claim
17 words
A method according to claim 39, wherein said regions are formed by ionic implantation followed by annealing.
Claim 47
Dependent Claim
67 words
A method according to claim 39, wherein the P-N junctions are electrically insulated from one another by localized eroding between said inverted type regions by a dry or wet process, in order to engrave or etch grooves extending from the said upper layer as far as at least beyond each P-N junction situated on either side of the groove, which makes it possible to accommodate said strips.
Claim 48
Dependent Claim
27 words
A method according to claim 39, wherein said P-N junctions are insulated electrically by proton implantation between said inverted type regions in order to accommodate said strips.
Claim 49
Dependent Claim
25 words
A method according to claim 39, comprising depositing an individual metallic contact on each inverted type region and a common metallic contact on the substrate.
Claim 50
Dependent Claim
14 words
A method according to claim 28, wherein said optically preparing comprises a splitting process.
Claim 51
Dependent Claim
17 words
A method according to claim 28, wherein said optically preparing comprises a wet or dry machining stage.
Claim 52
Dependent Claim
40 words
A method according to claim 28, wherein the substrate comprises a group III-V alloy which is heavily doped with the same type of conductivity as the layers in the stack, in contact with the bottom confinement layer in the stack.
Claim 53
Dependent Claim
17 words
A method according to claim 50, wherein the substrate further comprises a group III-V alloy or silicon.
Claim 54
Dependent Claim
42 words
A method according to claim 28, additionally comprising eroding said free upper surface of the stack to lay bare at least over a major part of the eroded surface, an upper portion of an active layer which serves as said upper layer.
References Cited (Backward Citations)
JPS5832482A
Cited
US4547956A
Cited
JPS5914691A
Cited
US4720468A
Cited
GB2187330A
Cited
EP0267839A1
Cited
US4925811A
Cited
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