Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
298 words
A method of manufacturing a semiconductor structure, in particular a structure suitable for producing a laser effect, the method being characterized in that it comprises the following steps: (a) a monocrystaline double heterostructure stack is deposited on a substrate (S), said stack begin constituted by active layers (CA) having different compositions and having light radiating properties, each of said layers being sandwiched between two confinement layers (CC) having a microcrystal lattice size adjacent to that of the active layers, with all of said layers having the same conductivity type; (b) the top of the stack is selectively etched in parallel strips which are adjacent to one another in order to lay bare confinement layers (CC) at different depths, at least on two adjacent strips, with the confinement layers (CC) thus laid bare defining parallel terraces (T1, T2, T3) separated from one another by transitions (M12, M23); (c) a contact layer (CP) is formed on said terraces; (d) an opposite conductivity type region (R1, R2, R3) is formed in the strip included in each terrace by inserting impurities through the contact layer, said impurities corresponding to the same conductivity type as the contact layer and said region extending through the top confinement layer (CC2, CC3, CC4) to the vicinity of the active layer therebeneath (CA1, CA2, CA3) in order to constitute a P-N junction therewith (J1, J2, J3); (e) individual metal contacts (DM1, Dm2, Dm3) are deposited on each opposite conductivity type region; (f) a common metal contact (DMS) is deposited on the substrate; (g) the opposite conductivity type regions are electrically isolated from one another (V10, V21, V32) at the transitions therebetween, in order to form semiconductor structure stripes; and (h) the opposite ends of said stripes are optically prepared transversely to the long dimension of the terraces.
Claim 2
Independent Claim
298 words
A method of manufacturing a semiconductor structure, in particular a structure suitable for producing a laser effect, the method being characterized in that it comprises the following steps: (a) a monocrystaline double heterostructure stack is deposited on a substrate (S), said stack begin constituted by active layers (CA) having different compositions and having light radiating properties, each of said layers being sandwiched between two confinement layers (CC) having a microcrystal lattice size adjacent to that of the active layers, with all of said layers having the same conductivity type; (b) the top of the stack is selectively etched in parallel strips which are adjacent to one another in order to lay bare confinement layers (CC) at different depths, at least on two adjacent strips, with the confinement layers (CC) thus laid bare defining parallel terraces (T1, T2, T3) separated from one another by transitions (M12, M23); (c) a contact layer (CP) is formed on said terraces; (d) an opposite conductivity type region (R1, R2, R3) is formed in the strip included in each terrace by inserting impurities through the contact layer, said impurities corresponding to the same conductivity type as the contact layer and said region extending through the top confinement layer (CC2, CC3, CC4) to the vicinity of the active layer therebeneath (CA1, CA2, CA3) in order to constitute a P-N junction therewith (J1, J2, J3); (e) individual metal contacts (DM1, Dm2, Dm3) are deposited on each opposite conductivity type region; (f) a common metal contact (DMS) is deposited on the substrate; (g) the opposite conductivity type regions are electrically isolated from one another (V10, V21, V32) at the transitions therebetween, in order to form semiconductor structure stripes; and (h) the opposite ends of said stripes are optically prepared transversely to the long dimension of the terraces.
Claim 3
Dependent Claim
18 words
A method according to claim 1, characterized in that the materials constituting the double heterostructure are III-V alloys.
Claim 4
Dependent Claim
41 words
A method according to claim 2, characterized in that the materials constituting the double heterostructure are alloys of at least one material from the group: aluminum, gallium, and indium; and at least one material from the group: phosphorous, arsenic, and antimony.
Claim 5
Dependent Claim
60 words
A method according to claim 3, characterized in that the N-type active layers have the composition Ga 1-x Al x As, where x is different each time and is less than about 10%, whereas the confinement layers have the composition Ga 1-y Al y As, where y is substantially the same for all of them and equal to about 30%.
Claim 6
Dependent Claim
39 words
A method according to claim 1, 2, 3, or 4, characterized in that the double heterostructure layers are deposited by epitaxy, in particular by liquid phase epitaxy, or by molecular beam epitaxy, or by metalo organic chemical vapor deposition.
Claim 7
Dependent Claim
37 words
A method according to claim 1, 2, 3, or 4, characterized in that the thickness of the active layers is about one tenth of a micrometer, whereas the thickness of the confinement layers is about 1 micrometer.
Claim 8
Dependent Claim
50 words
A method according to claim 1, 2, 3, or 4, characterized in that etching operation (b) is performed by photoetching, and serves to remove a portion of the thickness of the confinement layer at which it stops, and in that operation (c) consists in depositing a contact layer by epitaxy.
Claim 9
Dependent Claim
20 words
A method according to claim 7, characterized in that the residual thickness of said confinement layer is about 1 μm.
Claim 10
Dependent Claim
21 words
A method according to claim 1, 2, 3, or 4, characterized in that the contact layer is also a III-V alloy.
Claim 11
Dependent Claim
22 words
A method according to claim 9, taken in combination with claim 4, characterized in that the contact layer is P-type gallium arsenide.
Claim 12
Dependent Claim
33 words
A method according to claim 1, 2, 3, or 4, characterized in that the etching step the top of each of the active layers, with the active layers then serving as contact layers.
Claim 13
Dependent Claim
31 words
A method according to claim 1, 2, 3, or 4, characterized in that said region is formed by means of impurities selected from the group comprising: zinc, cadmium, magnesium, and beryllium.
Claim 14
Dependent Claim
23 words
A method according to claim 1, 2, 3, or 4, characterized in that said region is formed by ion implantation followed by annealing.
Claim 15
Dependent Claim
19 words
A method according to claim 1, 2, 3, or 4, characterized in that said region is formed by diffusion.
Claim 16
Dependent Claim
29 words
A method according to claim 1, 2, 3, or 4 characterized in that said region is localized, and affects only a small portion of the area of the terrace.
Claim 17
Dependent Claim
39 words
A method according to claim 1, 2, 3, or 4, characterized in that operation (g) of isolating the terraces is performed by localized etching grooves down to the substrate by means of a dry method or a wet method.
Claim 18
Dependent Claim
26 words
A method according to any claim 1, 2, 3, or 4, characterized in that the operation (g) of isolating the terraces is performed by proton implantation.
Claim 19
Dependent Claim
21 words
A method according to claim 1, 2, 3, or 4, characterized in that the operation (h) of optical preparation includes cleaving.
Claim 20
Dependent Claim
29 words
A method according to claim 1, 2, 3, or 4, characterized in that the operation h) of optical preparation includes shaping by a wet method or a dry method.
Claim 21
Dependent Claim
23 words
A method according to claim 1, 2, 3, or 4, characterized in that the substrate is silicon or a highly N-doped III-V alloy.
Claim 22
Dependent Claim
34 words
A method according to claim 1, 2, 3, or 4, characterized in that it includes the following additional operation: (i) separating the semiconductor structure into individual chips each comprising at least two adjacent stripes.