US5039338A
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US
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Electroless copper plating solution and process for formation of copper film
Assignee: Denso Corp
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Filing: 1989-12-29
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Granted: 1991-08-13
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Expires: 2009-12-29
Abstract
Abstract Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2×10 -4 to 1.2×10 -3 mole/l of an iron ion compound as a reaction initiator and/or 1.92×10 -4 to 1.92×10 -3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, α,α,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.
Inventors
- 👤 Koji Kondo
- 👤 Seiji Amakusa
- 👤 Katuhiko Murakawa
- 👤 Katsuaki Kojima
- 👤 Nobumasa Ishida
- 👤 Junji Ishikawa
- 👤 Futoshi Ishikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 06:10
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
101 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivatives or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the rialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.2×10' mole/l of an iron ion compound as a reaction initiator.
Claim 2
Dependent Claim
101 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivatives or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the rialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.2×10' mole/l of an iron ion compound as a reaction initiator.
Claim 3
Dependent Claim
28 words
An electroless copper plating solution as set forth in claim 1, wherein the iron ion compound is contained in an amount of 1.2×10 -4 to 1.2×10 -3 mole/l.
Claim 4
Dependent Claim
34 words
An electroless copper plating solution as set forth in claim 1, wherein the trialkanolmonoamine or the salt thereof is contained in an amount of 1.2 to 30 moles per mole of the copper ion.
Claim 5
Dependent Claim
138 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivatives or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.92×10 -4 mole/l of at least one compound selected from the group consisting of pyridazine, methyliperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bypyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, napthalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, α,α,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film.
Claim 6
Dependent Claim
138 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivatives or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.92×10 -4 mole/l of at least one compound selected from the group consisting of pyridazine, methyliperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bypyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, napthalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, α,α,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film.
Claim 7
Dependent Claim
34 words
An electroless copper plating solution as set forth in claim 4, wherein the agent for improving the physical properties of the film is contained in an amount of 1.92×10 -4 to 1.92×10 -3 mole/l.
Claim 8
Dependent Claim
34 words
An electroless copper plating solution as set forth in claim 4, wherein the trialkanolmonoamine or the salt thereof is contained in an amount of 1.2 to 30 moles per mole of the copper ion.
Claim 9
Dependent Claim
155 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivative or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.2×10 -4 mole/l of an iron ion compound as a reaction initiator and at least 1.92×10 -4 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'- bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, α,60 ,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzonic acid as an agent for improving the physical properties of a plating film.
Claim 10
Dependent Claim
155 words
An electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, said reducing agent being formaldehyde, or derivative or polymers thereof, and said plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and at least 1.2×10 -4 mole/l of an iron ion compound as a reaction initiator and at least 1.92×10 -4 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'- bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, α,60 ,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzonic acid as an agent for improving the physical properties of a plating film.
Claim 11
Dependent Claim
51 words
An electroless copper plating solution as set forth in claim 7, wherein the iron ion compound is contained in an amount of 1.2×10 -4 to 1.2×10 -3 mole/l and the agent for improving the physical properties of the film is contained in an amount of 1.92×10 -4 to 1.92×10 -3 mole/l.
Claim 12
Dependent Claim
25 words
An electroless copper plating solution as set forth in claim 7, wherein the iron ion compound is at least one metal ferrocyanide or metal ferricyanide.
Claim 13
Dependent Claim
28 words
An electroless copper plating solution as set forth in claim 7, wherein the iron ion compound is contained in an amount of 1.2×10 -4 to 1.2×10 -3 mole/l.
Claim 14
Dependent Claim
38 words
An electroless copper plating solution as set forth in claim 7, wherein the agent for improving the physical properties of the film is at least one member selected from the group consisting of 1,2'-di-(2pyridyl)ethylene, 2,2'-bipyridyl, 2,2'-bipyrimidine and 1,8-naphthyridine.
Claim 15
Dependent Claim
34 words
An electroless copper plating solution as set forth in claim 7, wherein the agent for improving the physical properties of the film is contained in an amount of 1.92×10 -4 to 1.92×10 -3 mole/l.
Claim 16
Dependent Claim
34 words
An electroless copper plating solution as set forth in claim 7, wherein the trialkanolmonoamine or the salt thereof is contained in an amount of 1.2 to 30 moles per mole of the copper ion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-12 | 1995-02-11 | 1995-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-12 | 1999-02-11 | 1999-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-12 | 2003-02-11 | 2003-08-13 | $7700.00 | Window Closed / Lapsed |