chemical copper plating liquid

Abstract

Abstract PURPOSE:To obtain a plated film having superior physical properties by adding an alkali-soluble inorg. silicon compound and a selected org. compound to a prescribed chemical copper plating soln. so as to stabilize the plating soln. CONSTITUTION:To a chemical copper plating soln. contg. a copper salt, a complexing agent such as EDTA, a copper salt reducing agent and a pH adjusting agent are added proper amounts of an alkali-soluble inorg. silicon compound such as sodium silicate and one or more kinds of org. compounds which are effective in stabilizing the plating soln. The org. compounds are selected >=1 kind among nitrile compounds, oximes, amino acids, 2,2'-dipyridyl(derivs.), 1,10-phenanthroline(derivs.), alcohols and org. sulfur compounds. When the resulting plating soln. is used, a plated film having superior physical properties can be obtd. and the stability of the soln. can be well kept.

Inventors

• 👤 Kanji Murakami
• 👤 敢次 村上
• 👤 Haruo Akaboshi
• 👤 晴夫 赤星
• 👤 Mineo Kawamoto
• 👤 川本　峰雄
• 👤 Akio Tadokoro
• 👤 田所　昭夫
• 👤 Motoyo Wajima
• 👤 和嶋　元世
• 👤 Ritsuji Toba
• 👤 鳥羽　律司
• 👤 Tsunefumi Muto
• 👤 武藤　常文
• 👤 Shoji Kawakubo
• 👤 川窪　鐘治
• 👤 Toyofusa Yoshimura
• 👤 豊房 吉村

Bibliographic Details