Multiple electronic devices within a single carrier structure

Claim 2

Packaged semiconductor devices within one carrier structure, comprising: a leadframe having a plurality of semiconductor die receiving areas, each having a plurality of leads on at least two sides of said receiving areas and extending therefrom, each lead having a proximal end near said receiving area and a distal end away from said receiving area, said receiving areas collectively occupying a bounded spatial area; a semiconductor die located in each of said plurality of receiving areas and electrically coupled to said proximal ends of said plurality of leads; package bodies encapsulating each of said semiconductor die and said coupled, proximal ends of said plurality of leads; and a single carrier structure spaced apart from and encircling said bounded spatial area and all of said semiconductor die, and encapsulating portions of said distal ends of said plurality of leads, leaving the tips of said distal ends of said plurality of leads exposed along a perimeter of said carrier structure for electrical access to each of said semiconductor die in each of said receiving areas.

Claim 3

The packaged semiconductor devices of claim 1 wherein each of said package bodies have two sides of a given length and two sides with a length which is greater then said given length.

Claim 4

The packaged semiconductor devices of claim 2 wherein said leads extend away from said sides of a given length.

Claim 5

The packaged semiconductor devices of claim 2 wherein said leads extend away from said sides with a length which is greater then said given length.

Claim 6

The packaged semiconductor devices of claim 1 wherein said semiconductor die are memory devices.

Claim 7

Packaged semiconductor devices within a carrier structure comprising: a leadframe having a plurality of semiconductor die receiving areas, each having a plurality of leads on at least two sides of said receiving areas and extending therefrom, each lead having a proximal end near one of said receiving areas and a distal end away from said one receiving area, said receiving areas collectively occupying a bounded spatial area; a semiconductor die located in each of said plurality of receiving areas and electrically coupled to said proximal ends of said plurality of leads; molded package bodies encapsulating each of said semiconductor die and said coupled, proximal ends of said plurality of leads; a single molded carrier structure having an outer periphery, spaced apart from and encircling said bounded spatial area and all of said semiconductor die and encapsulating portions of said distal ends of said plurality of leads, leaving the tips of said distal ends of said plurality of leads exposed along said periphery of said carrier structure for electrical access to each of said semiconductor die in each of said receiving areas; exposed contact points located along said outer periphery of said molded carrier structure formed from said exposed distal ends and substantially conforming to said carrier structure; and exposed intermediate portions of said plurality of leads located between said proximal and distal ends.

Claim 8

Packaged semiconductor devices within a carrier structure comprising: a leadframe having a plurality of semiconductor die receiving areas, each having a plurality of leads on at least two sides of said receiving areas and extending therefrom, each lead having a proximal end near one of said receiving areas and a distal end away from said one receiving area, said receiving areas collectively occupying a bounded spatial area; a semiconductor die located in each of said plurality of receiving areas and electrically coupled to said proximal ends of said plurality of leads; molded package bodies encapsulating each of said semiconductor die and said coupled, proximal ends of said plurality of leads; a single molded carrier structure having an outer periphery, spaced apart from and encircling said bounded spatial area and all of said semiconductor die and encapsulating portions of said distal ends of said plurality of leads, leaving the tips of said distal ends of said plurality of leads exposed along said periphery of said carrier structure for electrical access to each of said semiconductor die in each of said receiving areas; exposed contact points located along said outer periphery of said molded carrier structure formed from said exposed distal ends and substantially conforming to said carrier structure; and exposed intermediate portions of said plurality of leads located between said proximal and distal ends.

Claim 9

The packaged semiconductor devices of claim 6 wherein said semiconductor die are memory devices.

Claim 10

The packaged semiconductor devices of claim 6 wherein said leadframe further comprises tie bars which extend between said plurality of semiconductor die receiving areas.

Claim 11

Packaged semiconductor devices with a carrier ring structure comprising: a plurality of semiconductor devices encapsulated in protective package bodies and having leads extending outwardly from said protective bodies; and a single carrier ring structure having two sides and two ends and surrounding all of said plurality of semiconductor devices and encapsulating distal portions of said leads of all of said semiconductor devices to form electrical contact to each of said semiconductor devices via contacts along said two sides of said single carrier ring structure.

Claim 12

Packaged semiconductor devices with a carrier ring structure comprising: a plurality of semiconductor devices encapsulated in protective package bodies and having leads extending outwardly from said protective bodies; and a single carrier ring structure having two sides and two ends and surrounding all of said plurality of semiconductor devices and encapsulating distal portions of said leads of all of said semiconductor devices to form electrical contact to each of said semiconductor devices via contacts along said two sides of said single carrier ring structure.

Claim 13

The packaged semiconductor devices of claim 9 wherein said protective package bodies are made from a plastic molding compound.

Claim 14

The packaged semiconductor devices of claim 9 wherein said carrier ring structure is made from a plastic molding compound.

Claim 15

The packaged semiconductor devices of claim 9 wherein said protective package bodies and said carrier ring structure are made of the same material.

Claim 16

The packaged semiconductor devices of claim 9 wherein said protective package bodies and said carrier ring structure are made of different materials.