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US5036209A Expired / Lapsed US ⏱️ 0.0 years remaining

Fabrication method for semiconductor devices and transparent mask for charged particle beam

Assignee: Fujitsu Semiconductor Ltd
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Filing: 1989-10-20
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Granted: 1991-07-30
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Expires: 2009-10-20
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Abstract

Abstract A charged particle beam exposure apparatus includes a charged particle beam generator, a deflector device for deflecting the charged particle beam electromagnetically to individually illuminate small areas of a pattern forming region formed on a transparent mask, apparatus for moving the transparent mask mechanically, and the various components required for reducing the charged particle beam pattern through the mask and projecting the same onto a semiconductor device substrate to be exposed. A semiconductor device is fabricated using such apparatus by moving the mask mechanically to position a pattern forming region at a predetermined exposure position. The pattern forming region includes a plurality of small areas which can be individually selected by deflecting the charged particle beam when the pattern forming region is positioned at the exposure position. Each individual area is of a size such that the entirety thereof is exposed when the beam is deflected onto such area.

Inventors

  • 👤 Toyotaka Kataoka
  • 👤 Kiichi Sakamoto

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 12:39
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/20; B; B82; B82Y; B82Y10/00; B82Y40/00; H; H01; H01J; H01J37/00; H01J37/02; H01J37/04; H01J37/09; H01J37/30; H01J37/317; H01J37/3174; H01J2237/00; H01J2237/02; H01J2237/024; H01J2237/15; H01J2237/30; H01J2237/317; H01J2237/3175; H01J2237/31776

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 118 words
A method for fabricating a semiconductor device comprising: generating a charged particle beam; providing a mask having a multiplicity of individual discrete areas, each having at least one transparent aperture, said individual areas being arranged on said mask in a number of pattern forming regions, with each region comprising a plurality of said individual areas; moving said mask mechanically to place a selected one of said regions at an electron beam illumination position; deflecting the charged particle beam to illuminate a single individual area of the selected region whereby the beam is patterned by the apertures of said single individual area; and reducing the patterned beam and projecting the reduced, patterned beam onto an object to be exposed.
Claim 2
Independent Claim 118 words
A method for fabricating a semiconductor device comprising: generating a charged particle beam; providing a mask having a multiplicity of individual discrete areas, each having at least one transparent aperture, said individual areas being arranged on said mask in a number of pattern forming regions, with each region comprising a plurality of said individual areas; moving said mask mechanically to place a selected one of said regions at an electron beam illumination position; deflecting the charged particle beam to illuminate a single individual area of the selected region whereby the beam is patterned by the apertures of said single individual area; and reducing the patterned beam and projecting the reduced, patterned beam onto an object to be exposed.
Claim 3
Dependent Claim 103 words
A method as set forth in claim 1, wherein the areas of each region are arranged and located such that each of the areas of a selected region may be selectively and singly illuminated by deflection of said beam when the selected region is at said position, the areas of each region including at least one basic pattern group representing at least a portion of a figure that is a repeat unit to be printed on said object, said mask being moved mechanically and said beam being deflected in accordance with print pattern information to sequentially expose the object to differently patterned beams.
Claim 4
Dependent Claim 95 words
A transparent mask for patterning a charged particle beam comprising a multiplicity of individual discrete areas, each having at least one transparent aperture, said areas being arranged in a number of pattern forming regions with each region comprising a plurality of said areas, the size of each pattern forming region being such that a charged particle beam may be deflected to illuminate each area thereof individually, and the size and arrangement of the areas of each pattern forming regions being such that each individual area may be selectively and singly illuminated by the deflected beam.
Claim 5
Dependent Claim 95 words
A transparent mask for patterning a charged particle beam comprising a multiplicity of individual discrete areas, each having at least one transparent aperture, said areas being arranged in a number of pattern forming regions with each region comprising a plurality of said areas, the size of each pattern forming region being such that a charged particle beam may be deflected to illuminate each area thereof individually, and the size and arrangement of the areas of each pattern forming regions being such that each individual area may be selectively and singly illuminated by the deflected beam.
Claim 6
Dependent Claim 36 words
A transparent mask as set forth in claim 3, wherein each region contains a first area having apertures patterned for variable rectangular shapes and a second area having apertures patterned for shapes that are repeatedly used.
Claim 7
Dependent Claim 169 words
A transparent mask for patterning a charged particle beam comprising: a plurality of pattern forming regions, each pattern forming region comprising a multiplicity of individual discrete areas having at least one transparent aperture; and isolation regions separating each pattern forming region from neighboring pattern forming regions, the areas of at least one pattern forming region being arranged in first and second sets of areas, each of the areas of the first set having an aperture pattern that is an independent pattern used for a non-repeated pattern, and each of the areas of the second set having an aperture pattern for a repeated basic pattern representing at least a portion of a figure that is a repeat unit, the size of each pattern forming region being such that a charged particle beam may be deflected to illuminate each area thereof individually, and the size and arrangement of the areas of each pattern forming region being such that each individual area may be selectively and singly illuminated by the deflected beam.
Claim 8
Dependent Claim 169 words
A transparent mask for patterning a charged particle beam comprising: a plurality of pattern forming regions, each pattern forming region comprising a multiplicity of individual discrete areas having at least one transparent aperture; and isolation regions separating each pattern forming region from neighboring pattern forming regions, the areas of at least one pattern forming region being arranged in first and second sets of areas, each of the areas of the first set having an aperture pattern that is an independent pattern used for a non-repeated pattern, and each of the areas of the second set having an aperture pattern for a repeated basic pattern representing at least a portion of a figure that is a repeat unit, the size of each pattern forming region being such that a charged particle beam may be deflected to illuminate each area thereof individually, and the size and arrangement of the areas of each pattern forming region being such that each individual area may be selectively and singly illuminated by the deflected beam.
Claim 9
Dependent Claim 119 words
A charged beam exposure apparatus comprising a transparent beam shaping mask formed with a multiplicity of small discrete areas having transparent apertures corresponding to components of circuit patterns of an integrated circuit, said areas being arranged on said mask in a number of pattern forming regions with each region comprising a plurality of said individual areas, the layout of said regions being such that regions which are close in time in accordance with a predetermined exposure sequence of an object to be exposed are close in location, and the layout of the individual areas within each region being such that individual areas which are close in time in accordance with said predetermined exposure sequence are also close in location.
Claim 10
Dependent Claim 119 words
A charged beam exposure apparatus comprising a transparent beam shaping mask formed with a multiplicity of small discrete areas having transparent apertures corresponding to components of circuit patterns of an integrated circuit, said areas being arranged on said mask in a number of pattern forming regions with each region comprising a plurality of said individual areas, the layout of said regions being such that regions which are close in time in accordance with a predetermined exposure sequence of an object to be exposed are close in location, and the layout of the individual areas within each region being such that individual areas which are close in time in accordance with said predetermined exposure sequence are also close in location.
Claim 11
Dependent Claim 51 words
A charged beam exposure apparatus as set forth in claim 6, wherein said transparent mask has formed thereon all of the individual areas required for exposure of a given integrated circuit, whereby the pattern exposure required for fabrication of the given integrated circuit may be performed without changing the transparent mask.

References Cited (Backward Citations)

US4140913A Cited
US4169230A Cited
US4213053A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-07-29 1995-01-28 1995-07-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-07-29 1999-01-28 1999-07-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-07-29 2003-01-28 2003-07-30 $7700.00 Window Closed / Lapsed

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