US5036167A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Board for hybrid integrated circuit
Assignee: Toshiba Lighting and Technology Corp
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Filing: 1989-09-06
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Granted: 1991-07-30
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Expires: 2009-09-06
Abstract
Abstract A hybrid integrated circuit comprising a ceramic substrate, a copper plate having a thickness of 1 to 100 μm formed by adhering a copper material to the ceramic substrate, an insulating layer having a thickness of 10 to 100 μm formed on said copper plate by means of screen printing, and a wiring layer having a thickness of 5 to 80 μm formed on said insulating layer by means of screen printing, and a method for manufacturing the same.
Inventors
- 👤 Norio Kasai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H10W70/04; H10W70/047; H10W99/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
83 words
A board for a hybrid integrated circuit, comprising: a ceramic substrate; a copper plate having a thickness of between 1 to 100 μm directly bonded to said ceramic substrate by a heat treatment in a non-oxide atmosphere; an insulating layer having a thickness of between 10 to 100 μm and formed on the copper plate by a screen printing method; and a wiring layer having thickness of between 5 to 80 μm and formed on the insulating layer by a screen printing method.
Claim 2
Dependent Claim
83 words
A board for a hybrid integrated circuit, comprising: a ceramic substrate; a copper plate having a thickness of between 1 to 100 μm directly bonded to said ceramic substrate by a heat treatment in a non-oxide atmosphere; an insulating layer having a thickness of between 10 to 100 μm and formed on the copper plate by a screen printing method; and a wiring layer having thickness of between 5 to 80 μm and formed on the insulating layer by a screen printing method.
Claim 3
Dependent Claim
35 words
The board for a hybrid integrated circuit according to claim 1, wherein said ceramic substrate is formed of a material selected from the group consisting of alumina, aluminum nitride silicon nitride, magnesia and boron nitride.
Claim 4
Dependent Claim
20 words
The board for a hybrid integrated circuit according to claim 1, wherein said copper plate has thickness of 20 μm.
Claim 5
Dependent Claim
26 words
The board for a hybrid integrated circuit according to claim 1, wherein said insulating layer is formed of an insulating paste of ZnO series glass powder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-29 | 1995-01-28 | 1995-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-29 | 1999-01-28 | 1999-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-29 | 2003-01-28 | 2003-07-30 | $7700.00 | Window Closed / Lapsed |