Capacitive card module

Claim 1

In a capacitive card module of the type wherein a plurality of capacitive switch elements are arranged side-by-side on an insulating carrier layer and connected to one another and are respectively composed of conductor surfaces allocated to one another and fashioned into capacitor surfaces, the improvement comprising: an electrically conductive first shielding surface including a plurality of interconnects constructed as an interconnect grid on the side of the insulating carrier layer facing away from the capacitive switch elements and defining mesh regions bounded by said interconnects, said first shielding surface including a terminal for connection to a voltage potential; said first shielding surface comprising second shielding surfaces in said mesh regions, said second shielding surfaces electrically connected to said first shielding surface; and said first shielding surface comprising a conductor material that is electrically more conductive than the conductor material of said second shielding surfaces.