US5034349A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a connector assembly for a semiconductor device
Assignee: ITT Inc
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Filing: 1989-07-26
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Granted: 1991-07-23
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Expires: 2009-07-26
Abstract
Abstract A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.
Inventors
- 👤 Richard C. Landis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 22:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49139
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
60 words
A method of forming a single level interconnection, said method comprising the steps of: forming first and second windows in an electrically isolating film; and thereafter forming a plurality of electrically conductive strips on said film, said strips being formed with first end portions thereof cantilevered over said first windows and second end portions thereof cantilevered over said second windows.
Claim 2
Independent Claim
60 words
A method of forming a single level interconnection, said method comprising the steps of: forming first and second windows in an electrically isolating film; and thereafter forming a plurality of electrically conductive strips on said film, said strips being formed with first end portions thereof cantilevered over said first windows and second end portions thereof cantilevered over said second windows.
Claim 3
Dependent Claim
30 words
Method as claimed in claim 1 further comprising the step of: forming, along the edges of said film, a sprocket pattern, said sprocket pattern including rows of regularly spaced openings.
Claim 4
Dependent Claim
36 words
Method as claimed in claim 1 wherein said strip forming step includes: disposing a layer of conductive material on said film having said first and second windows therein; and thereafter defining said plurality of conductive strips.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-22 | 1995-01-21 | 1995-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-22 | 1999-01-21 | 1999-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-22 | 2003-01-21 | 2003-07-23 | $7700.00 | Window Closed / Lapsed |