Cooling arrangement for a semiconductor pump source

Claim 2

A cooling arrangement for a semiconductor pump source which develops heat during operation, the cooling arrangement comprising: a heat sink defining a seat for accommodating the pump source thereon; cooling channel means formed in said heat sink for conducting a coolant therethrough to remove a major portion of said heat; and, Peltier means connected to said heat sink for finely controlling the temperature of said heat sink so as to permit said semiconductor pump source to emit radiation having a predetermined optional wavelength.

Claim 3

The cooling arrangement of claim 1, said Peltier means including a Peltier element mounted on said heat sink; temperature sensor means mounted on said heat sink for detecting the temperature thereof; and, control means for controlling the supply of current to said Peltier element in dependence upon said temperature.

Claim 4

The cooling arrangement of claim 1, further comprising: a base plate connected to said Peltier means; and, ancillary cooling means for cooling said base plate.

Claim 5

A composite cooling arrangement for a plurality of semiconductor pump sources each developing heat during the operation thereof, the composite cooling arrangement comprising: a plurality of heat sinks for accommodating respective ones of said pump sources thereon; said heat sinks being mounted in a row one next to the other with each two mutually adjacent ones of said heat sinks conjointly defining a narrow space therebetween; each of said heat sinks having a cooling channel formed therein for conducting a coolant therethrough to remove a major portion of the heat developed by the heat source mounted thereon; a plurality of Peltier temperature control devices corresponding to respective ones of said heat sinks for finely controlling the temperature of the heat sink; and, each Peltier temperature control device including: temperature sensor means mounted on the heat sink corresponding thereto for detecting the temperature thereof; a Peltier element mounted on the heat sink; and, control means for controlling the supply of current to said Peltier element in dependence upon the temperature detected by the temperature sensor means corresponding thereto.

Claim 6

A composite cooling arrangement for a plurality of semiconductor pump sources each developing heat during the operation thereof, the composite cooling arrangement comprising: a plurality of heat sinks for accommodating respective ones of said pump sources thereon; said heat sinks being mounted in a row one next to the other with each two mutually adjacent ones of said heat sinks conjointly defining a narrow space therebetween; each of said heat sinks having a cooling channel formed therein for conducting a coolant therethrough to remove a major portion of the heat developed by the heat source mounted thereon; a plurality of Peltier temperature control devices corresponding to respective ones of said heat sinks for finely controlling the temperature of the heat sink; and, each Peltier temperature control device including: temperature sensor means mounted on the heat sink corresponding thereto for detecting the temperature thereof; a Peltier element mounted on the heat sink; and, control means for controlling the supply of current to said Peltier element in dependence upon the temperature detected by the temperature sensor means corresponding thereto.

Claim 7

The composite cooling arrangement of claim 4, said cooling channels being formed in said heat sinks so as to be aligned and conjointly define a composite continuous channel when said heat sinks are mounted one next to the other; and, a plurality of sealing discs disposed in corresponding ones of the spaces between each two mutually adjacent ones of said heat sinks.

Claim 8

The composite cooling arrangement of claim 5, further comprising a base plate connected to said Peltier elements; and, ancillary cooling means for cooling said base plate.