Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink

Claim 1

A molded resin package for a semiconductor device wherein all of the electrical connection pins of the device project from a first side of said package, said package having a second planar side forming substantially a dihedral angle with said first side and being destined to be thermally coupled to a flat coupling surface of a heat sink and means for mechanically fastening the packaged device to said heat sink, characterized by the fact that said fastening means comprise two spaced apart open ended slots, parallel to each other and perpendicularly to a third side of the package which is opposite to said first side, said open ended slots being capable of accommodating through the open end thereof through said opposite side of the package the stems of fastening screws partially pre-screwed in threaded holes pre-arranged on the coupling surface of said heat sink for mounting the latter on a plurality of said packaged devices, mounted in alignment on a printed circuit card, in an essentially sliding manner.