Environmentally stable integrated optic chip mount

Claim 2

Apparatus, comprising: a block of integrated optic chip material having anisotropic thermal expansion coefficients along two different axes; a block of isotropic substrate material; and a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has anisotropic thermal expansion coefficients which match the magnitude and direction of the anisotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 3

The apparatus of claim 1, wherein said integrated optic chip material is lithium niobate.

Claim 4

The apparatus of claim 2, wherein said lithium niobate has a thermal expansion coefficient of 15.4×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 7.5×10 -6 / °C. in said second direction.

Claim 5

The apparatus of claim 1, wherein said integrated optic chip material is lithium tantalate.

Claim 6

The apparatus of claim 4, wherein said lithium tantalate has a thermal expansion coefficient of 16.1×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 4.1×10 -6 / °C. in said second direction.

Claim 7

The apparatus of claim 1, wherein said anisotropic material is pyrolytic graphite.

Claim 8

The apparatus of claim 6, wherein said pyrolytic graphite has a thermal expansion coefficient of 1×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 25×10 -6 / °C. in said second direction.

Claim 9

The apparatus of claim 1, wherein said anisotropic material is calcite.

Claim 10

The apparatus of claim 8, wherein said calcite has a thermal expansion coefficient of 25×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of -5.8×10 -6 / °C. in said second direction.

Claim 11

The apparatus of claim 1, wherein said anisotropic material is crystal quartz.

Claim 12

The apparatus of claim 1, wherein said anisotropic material is barium titanate.

Claim 13

Apparatus for interfacing a block of integrated optic chip material having anisotropic thermal expansion coefficients along two different axes to a block of substrate material having isotropic thermal expansion coefficients, comprising: a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has anisotropic thermal expansion coefficients which match the magnitude and direction of the anisotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 14

Apparatus for interfacing a block of integrated optic chip material having anisotropic thermal expansion coefficients along two different axes to a block of substrate material having isotropic thermal expansion coefficients, comprising: a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has anisotropic thermal expansion coefficients which match the magnitude and direction of the anisotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 15

The apparatus of claim 12, wherein said integrated optic chip material is lithium niobate.

Claim 16

The apparatus of claim 13, wherein said lithium niobate has a thermal expansion coefficient of 15.4×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 7.5×10 -6 / °C. in said second direction.

Claim 17

The apparatus of claim 12, wherein said integrated optic chip material is lithium tantalate.

Claim 18

The apparatus of claim 15, wherein said lithium tantalate has a thermal expansion coefficient of 16.1×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 4.1×10 -6 / °C. in said second direction.

Claim 19

The apparatus of claim 12 wherein said anisotropic material is pyrolytic graphite.

Claim 20

The apparatus of claim 17, wherein said pyrolytic graphite has a thermal expansion coefficient of 1×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 25×10 -6 / °C. in said second direction.

Claim 21

The apparatus of claim 12, wherein said anisotropic material is calcite.

Claim 22

The apparatus of claim 19, wherein said calcite has a thermal expansion coefficient of 25×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of -5.8×10 -6 / °C. in said second direction.

Claim 23

The apparatus of claim 12, wherein said anisotropic material is crystal quartz.

Claim 24

The apparatus of claim 12, wherein said anisotropic material is barium titanate.

Claim 25

Apparatus, comprising: a block of integrated optic chip material having isotropic thermal expansion coefficients along all axes; a block of isotropic substrate material; and a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 26

Apparatus, comprising: a block of integrated optic chip material having isotropic thermal expansion coefficients along all axes; a block of isotropic substrate material; and a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 27

The apparatus of claim 23, wherein said integrated optic chip material is silicon.

Claim 28

The apparatus of claim 24, wherein said silicon has a thermal expansion coefficient of 2.6×10 -6 / °C.

Claim 29

The apparatus of claim 23, wherein said anisotropic material is pyrolytic graphite.

Claim 30

The apparatus of claim 26, wherein said pyrolytic graphite has a thermal expansion coefficient of 1×10 -6 / °C. in said first direction, and has a thermal expansion coefficient of 25×10 -6 / °C. in said second direction.

Claim 31

The apparatus of claim 23, wherein said anisotropic material is calcite.

Claim 32

The apparatus of claim 28, wherein said calcite has a thermal expansion coefficient of 25×10 -6 / °C. in a first direction, and has a thermal expansion coefficient of -5.8×10 -6 / °C. in a second direction.

Claim 33

The apparatus of claim 23, wherein said anisotropic material is crystal quartz.

Claim 34

The apparatus of claim 30, wherein said anisotropic material is barium titanate.

Claim 35

Apparatus for interfacing a block of integrated optic chip material having isotropic thermal expansion coefficients along all axes to a block of substrate material having isotropic thermal expansion coefficients, comprising: a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 36

Apparatus for interfacing a block of integrated optic chip material having isotropic thermal expansion coefficients along all axes to a block of substrate material having isotropic thermal expansion coefficients, comprising: a wedge of anisotropic material having anisotropic thermal expansion coefficients along two different axes, said anisotropic material having a thermal expansion coefficient in a first direction which is greater than a value of the thermal expansion coefficient of said chip material in a corresponding first direction, and having a thermal expansion coefficient in a second direction which is lesser than a value of the thermal expansion coefficient of said chip material in a corresponding second direction, said wedge of anisotropic material having predetermined angular dimensions such that a first surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said chip material, and such that a second surface of said wedge of anisotropic material has isotropic thermal expansion coefficients which match the magnitude of the isotropic thermal expansion coefficients of said substrate material, said wedge of anisotropic material disposed between said block of chip material and said block of substrate material such that said first surface of said wedge of anisotropic material contacts said chip material and such that said second surface of said wedge of anisotropic material contacts said block of substrate material.

Claim 37

The apparatus of claim 32 wherein said integrated optic chip material is silicon.

Claim 38

The apparatus of claim 33, wherein said silicon has a thermal expansion coefficient of 2.6×10 -6 / °C.

Claim 39

The apparatus of claim 32 wherein said anisotropic material is pyrolytic graphite.

Claim 40

The apparatus of claim 35, wherein said pyrolytic graphite has a thermal expansion coefficient of 1×10 -6 / °C. in a first direction, and has a thermal expansion coefficient of 25×10 -6 / °C. in a second direction.

Claim 41

The apparatus of claim 32, wherein said anisotropic material is calcite.

Claim 42

The apparatus of claim 37, wherein said calcite has a thermal expansion coefficient of 25×10 -6 / °C. in a first direction, and has a thermal expansion coefficient of -5.8×10 -6 / °C. in a second direction.

Claim 43

The apparatus of claim 32, wherein said anisotropic material is crystal quartz.

Claim 44

The apparatus of claim 32, wherein said anisotropic material is barium titanate.