Bonding structure of an electronic device and a method for manufacturing the same

Claim 2

A bonding structure of an electronic device, comprising: an insulating sheet having a central portion, a side portion and a connecting opening defined by said central portion and side portion; an electronic device having a plurality of electrodes arranged at a side edge thereof; a plurality of electrically conductive metal leads carried on at least one surface of said insulating sheet, said electrically conductive metal leads having ends electrically connected to said electrodes of said electronic device at said central portion of said insulating sheet and having in the vicinity of other ends thereof connecting portions which are received in said connecting opening, said other ends being carried by said side portion of said insulating sheet, said connecting portions being deformed so as to have a level part facing to the other surface of said insulating sheet and two inclined parts adjacent to said level part, said inclined parts rising up towards the upper edge of a wall of said central portion and side portion of said insulating sheet; a plurality of connecting terminals facing said connecting portions of said metal leads, respectively; and soldering layers for bonding said connecting portions of said metal leads and said connecting terminals to each other, each of said soldering layers including two pools which increase a thickness of a layer along said inclined parts of said metal leads.

Claim 3

A bonding structure according to claim 1, further comprising insulating adhesive means for covering said connecting portions of said metal leads.

Claim 4

A bonding structure according to claim 1, wherein each of said connecting terminals has a width broader than that of said connecting portions of said metal leads.

Claim 5

A bonding structure according to claim 3, wherein the width of each of said connecting portions of said metal leads is 0.5 to 0.8 times as wide as that of said connecting terminals.

Claim 6

A bonding structure according to claim 3, wherein the width of each of said connecting terminals is larger than 0.5 times their pitch and the width of each of said connecting portions of said metal leads is smaller than 0.5 times their pitch.

Claim 7

A bonding structure according to claim 1, wherein said connecting terminals include a gold layer, a nickel layer and an indium-tin oxide layer.

Claim 8

The bonding structure according to claim 4, further comprising solder pools at both side walls of said connecting portions of said metal leads.

Claim 9

The bonding structure according to claim 1, wherein; an overall outer surface of said metal leads exposed out of said insulating sheet are covered with solder layers; and each of said solder layers covering said connecting portion is thinner than that of a solder layer covering said end of said metal lead to be connected with said electrode of said electronic device.

Claim 10

The bonding structure according to claim 1, wherein said insulating layer further includes a second side portion and a second connecting opening defined by said central portion and said side portion.

Claim 11

The bonding structure according to claim 8, wherein said metal leads are extended to and carried on said second side portion and cross over said second connecting opening.

Claim 12

The bonding structure according to claim 10, wherein said second side portion is disposed at an opposite side of said first mentioned side portion.

Claim 13

The bonding structure according to claim 10, wherein said metal lead further includes: second connecting portions which are received in said second connecting opening, said connecting portions being deformed so as to have a level part facing to the other surface of said insulating sheet; and two inclined parts adjacent to said level part, said inclined parts rising up towards the upper edge of a wall of said central portion and said second side portion of said insulating sheet.

Claim 14

The bonding structure according to claims 12, further comprising: a plurality of second connecting terminals facing said second connecting portions of said metal leads, respectively; and second soldering layers for bonding said second connecting portions of said metal leads and said second connecting terminals to each other; each of said second soldering layers including two pools which increase a thickness of layer along said inclined parts of said metal leads.

Claim 15

A bonding structure of an electronic device comprising: first and second substrates each substrate having a plurality of first and second connecting terminals; an integrated circuit unit interposed between said first and second substrates for electrically connecting electrodes of an integrated circuit chip to said first and second connecting terminals, and including: an insulating sheet having a central portion a first and second side portions, and a connecting opening located at least between said central portion and one of said first and second side portions; and a plurality of first and second electric conductive metal leads carried on one surface of said insulating sheet; each of said first and second metal leads having ends electrically connected to said electrodes of said integrated circuit chip at said central portion of said insulating sheet and the other ends at said first and second side portion; one of said first and second metal leads having in the vicinity of said the other ends deformed portions which are received in said connecting opening; said deformed portions being deformed so as to have a level part facing to the other surface of said insulating sheet and two inclined parts adjacent to said level parts, which inclined parts rise up towards the upper edge of wall of said central portion and one of said first and second side portion of said insulating sheet; and the bonding structure further comprising soldering layers for bonding said deformed portions of said metal leads and one of said first terminals, each of said soldering layers including two pools which increase the thickness of a layer along said inclined parts of said metal leads.

Claim 16

A bonding structure of an electronic device comprising: first and second substrates each substrate having a plurality of first and second connecting terminals; an integrated circuit unit interposed between said first and second substrates for electrically connecting electrodes of an integrated circuit chip to said first and second connecting terminals, and including: an insulating sheet having a central portion a first and second side portions, and a connecting opening located at least between said central portion and one of said first and second side portions; and a plurality of first and second electric conductive metal leads carried on one surface of said insulating sheet; each of said first and second metal leads having ends electrically connected to said electrodes of said integrated circuit chip at said central portion of said insulating sheet and the other ends at said first and second side portion; one of said first and second metal leads having in the vicinity of said the other ends deformed portions which are received in said connecting opening; said deformed portions being deformed so as to have a level part facing to the other surface of said insulating sheet and two inclined parts adjacent to said level parts, which inclined parts rise up towards the upper edge of wall of said central portion and one of said first and second side portion of said insulating sheet; and the bonding structure further comprising soldering layers for bonding said deformed portions of said metal leads and one of said first terminals, each of said soldering layers including two pools which increase the thickness of a layer along said inclined parts of said metal leads.

Claim 17

The bonding structure according to claim 14, wherein said first substrate comprises a panel of a liquid crystal display panel; and said second substrate comprises a printed circuit board.

Claim 18

The bonding structure according to claim 15, wherein said deformed portions of said metal leads are bonded to said connecting terminals of the panel of said liquid crystal display panel.

Claim 19

The bonding structure according to claim 15, wherein said deformed portions of said metal leads are bonded to said connecting terminals of said printed circuit board.

Claim 20

The bonding structure according to claim 14, wherein: said insulating sheet has two connecting openings respectively located between said central portion and said first side portion and between said central portion and said second side portion; and said first and second metal leads are respectively formed with deformed portions which are received in said first and second connecting openings so as to be bonded to said first and second connecting terminals of said first and second substrates at the other surface of said insulating sheet.