US5016089A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate for hybrid IC, hybrid IC using the substrate and its applications
Assignee: Hitachi Ltd
•
Filing: 1989-01-04
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Granted: 1991-05-14
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Expires: 2009-01-04
Abstract
Abstract A substrate for hybrid IC which comprises a substrate, a thick film resistor containing glass, formed on the substrate, and a thick film conductor at the terminal of the thick film resistor, where a means for preventing diffusion of the glass from the thick film resistor into the thick film conductor is provided between the thick film resistor and the thick film conductor has a stable resistance as a thick film microresistor and is applied to various uses such as cellular radio communication system.
Inventors
- 👤 Mituru Fujii
- 👤 Tadamichi Asai
- 👤 Toshio Ogawa
- 👤 Osamu Ito
- 👤 Akira Ikegami
- 👤 Mitsuru Hasegawa
- 👤 Takao Kobayashi
- 👤 Teizo Tamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:28
CPC Classifications
H; H01; H01C; H01C7/00; H01C7/003; H01C1/00; H01C1/14; H01C1/142; H01C17/00; H01C17/06; H01C17/065; H01C17/28; H01C17/281; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S257/00; Y10S257/903; Y10S257/904
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
65 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base, a thick film resistor containing glass, formed on the ceramic base, a thick film conductor containing glass, formed at the terminals of the thick film resistor, and an electrically conductive means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor.
Claim 2
Dependent Claim
65 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base, a thick film resistor containing glass, formed on the ceramic base, a thick film conductor containing glass, formed at the terminals of the thick film resistor, and an electrically conductive means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor.
Claim 3
Dependent Claim
19 words
A resistor-carrying substrate according to claim 1, wherein the glass of the thick film conductor is a lead-aluminum-borosilicate glass.
Claim 4
Dependent Claim
19 words
A resistor-carrying substrate according to claim 2, wherein the glass of the thick film resistor is a lead-aluminum-borosilicate glass.
Claim 5
Dependent Claim
34 words
A resistor-carrying substrate according to claim 1, wherein the thick film resistor includes an electroconductive intermetallic compound selected from the group consisting of TiB 2 , ZrB 2 and H 2 B 2 .
Claim 6
Dependent Claim
31 words
A resistor-carrying substrate according to claim 1, wherein the ceramic base is made of a material selected from the group consisting of alumina, SiC, AlN, Si 3 N 4 and mullite.
Claim 7
Dependent Claim
18 words
A resistor-carrying substrate according to claim 1, wherein the thick film conductor includes copper as an electroconductive material.
Claim 8
Dependent Claim
70 words
A hybrid IC, which comprises a ceramic substrate having a semiconductor device mounted thereon, a glass-containing thick film resistor, a glass-containing thick film conductor formed at the terminal of the thick film resistor, both the resistor and conductor being provided on the ceramic substrate, an electrically conductive means, provided between the resistor and the conductor, for preventing diffusion of glass of the thick film resistor into the thick film conductor.
Claim 9
Dependent Claim
70 words
A hybrid IC, which comprises a ceramic substrate having a semiconductor device mounted thereon, a glass-containing thick film resistor, a glass-containing thick film conductor formed at the terminal of the thick film resistor, both the resistor and conductor being provided on the ceramic substrate, an electrically conductive means, provided between the resistor and the conductor, for preventing diffusion of glass of the thick film resistor into the thick film conductor.
Claim 10
Dependent Claim
27 words
A hybrid IC according to claim 7, wherein the ceramic substrate is made from sintered ceramics and is mounted on and joined with a metallic base plate.
Claim 11
Dependent Claim
17 words
A power source module for mobile radio communication provided with a hybrid IC according to claim 8.
Claim 12
Dependent Claim
19 words
A cellular radio communication system provided with a power source module for mobile radio communication according to claim 9.
Claim 13
Dependent Claim
92 words
A resistor-carrying substrate for hybrid IC, which comprises a base, a thick film resistor containing glass, formed on the base, a thick film conductor containing glass, formed at the terminal of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, the thick film conductor being in a plan-view shape structure wider than the width of the thick film resistor where the thick film conductor is connected to the thick film resistor.
Claim 14
Dependent Claim
92 words
A resistor-carrying substrate for hybrid IC, which comprises a base, a thick film resistor containing glass, formed on the base, a thick film conductor containing glass, formed at the terminal of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, the thick film conductor being in a plan-view shape structure wider than the width of the thick film resistor where the thick film conductor is connected to the thick film resistor.
Claim 15
Dependent Claim
91 words
A resistor-carrying substrate for hybrid IC, which comprises a base, a thick film resistor containing glass, formed on the base, a thick film conductor containing glass, formed at the terminal of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, the plan-viewed shape of the thick film conductor being long and narrow and the thick film resistor being perpendicular, in the plan-viewed shape, to the longer side of the conductor.
Claim 16
Dependent Claim
91 words
A resistor-carrying substrate for hybrid IC, which comprises a base, a thick film resistor containing glass, formed on the base, a thick film conductor containing glass, formed at the terminal of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, the plan-viewed shape of the thick film conductor being long and narrow and the thick film resistor being perpendicular, in the plan-viewed shape, to the longer side of the conductor.
Claim 17
Dependent Claim
96 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base; a thick film resistor containing glass, formed on the ceramic base; and a thick film conductor containing glass, formed at the terminals of the thick film resistor; wherein the glass for the conductor is one of a crystalline glass or an amorphous glass, and the glass for the resistor is the other of a crystalline glass or an amorphous glass, so that diffusion of the glass of the conductor and the glass of the resistor respectively into the resistor and into the conductor is prevented.
Claim 18
Dependent Claim
96 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base; a thick film resistor containing glass, formed on the ceramic base; and a thick film conductor containing glass, formed at the terminals of the thick film resistor; wherein the glass for the conductor is one of a crystalline glass or an amorphous glass, and the glass for the resistor is the other of a crystalline glass or an amorphous glass, so that diffusion of the glass of the conductor and the glass of the resistor respectively into the resistor and into the conductor is prevented.
Claim 19
Dependent Claim
96 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base, a thick film resistor containing glass, formed on the ceramic base, a thick film conductor containing glass, formed at the terminals of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, said means for preventing diffusion being a pure metal layer having a higher melting point than the firing temperature of the resistor, provided on the boundary surface between the resistor and the conductor.
Claim 20
Dependent Claim
96 words
A resistor-carrying substrate for hybrid IC, which comprises a ceramic base, a thick film resistor containing glass, formed on the ceramic base, a thick film conductor containing glass, formed at the terminals of the thick film resistor, and a means, provided between the conductor and the resistor, for preventing diffusion of the glass of the thick film resistor into the thick film conductor, said means for preventing diffusion being a pure metal layer having a higher melting point than the firing temperature of the resistor, provided on the boundary surface between the resistor and the conductor.
Claim 21
Dependent Claim
40 words
A resistor-carrying substrate according to claim 14, wherein the means for preventing diffusion of the glass is metallic copper precipitated, on the boundary surface between the resistor and the conductor, from copper oxide of the glass contained in the resistor.
Claim 22
Dependent Claim
27 words
A resistor-carrying substrate according to claim 15, wherein the metallic copper is a layer of metallic copper preventing diffusion of glass from the resistor to the conductor.
Claim 23
Dependent Claim
38 words
A resistor-carrying substrate according to claim 15, wherein the copper oxide is contained in the glass of the resistor, prior to precipitation of the metallic copper, in an amount of 1% to 20% by weight of the glass.
Claim 24
Dependent Claim
91 words
A hybrid IC, which comprises a ceramic substrate having a semiconductor device mounted thereon, a glass-containing thick film resistor, a glass-containing thick film conductor formed at the terminal of the thick film resistor, both the resistor and conductor being provided on the ceramic substrate, a means, provided between the resistor and the conductor, for preventing diffusion of glass of the thick film resistor into the thick film conductor, the entire surfaces of the semiconductor device, the thick film resistor and the thick film conductor being covered with a resin or glass.
Claim 25
Dependent Claim
91 words
A hybrid IC, which comprises a ceramic substrate having a semiconductor device mounted thereon, a glass-containing thick film resistor, a glass-containing thick film conductor formed at the terminal of the thick film resistor, both the resistor and conductor being provided on the ceramic substrate, a means, provided between the resistor and the conductor, for preventing diffusion of glass of the thick film resistor into the thick film conductor, the entire surfaces of the semiconductor device, the thick film resistor and the thick film conductor being covered with a resin or glass.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-13 | 1994-11-12 | 1995-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-13 | 1998-11-12 | 1999-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-13 | 2002-11-12 | 2003-05-14 | $7700.00 | Window Closed / Lapsed |