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Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Assignee: General Electric Co
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Filing: 1989-07-31
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Granted: 1991-05-14
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Expires: 2009-07-31
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Abstract

Abstract A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Inventors

  • 👤 Erik W. Walles
  • 👤 John H. Lupinski
  • 👤 James V. Crivello

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 14:12
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/68; C08G59/686; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C08K; C08K3/00; C08K3/34; C08K3/36; C08L; C08L63/00; H10; H10W; H10W74/00; H10W74/40; H10W74/47

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 61 words
A heat curable composition comprising by weight, (a) 100 parts of an epoxy resin having less than 100 parts per million of hydrolyzable chloride, (b) 10 to 1000 parts of fused silica filler, (c) a catalytic amount of a compatible monomeric, or polymeric diaryliodoniumhexafluoroantimonate salt, and (d) an effective amount of a free-radical generating aromatic compound as a cocatalyst for (c).
Claim 2
Dependent Claim 61 words
A heat curable composition comprising by weight, (a) 100 parts of an epoxy resin having less than 100 parts per million of hydrolyzable chloride, (b) 10 to 1000 parts of fused silica filler, (c) a catalytic amount of a compatible monomeric, or polymeric diaryliodoniumhexafluoroantimonate salt, and (d) an effective amount of a free-radical generating aromatic compound as a cocatalyst for (c).
Claim 3
Dependent Claim 20 words
A heat curable composition in accordance with claim 1, where the epoxy resin is a stable meta brominated epoxy novolac.
Claim 4
Dependent Claim 17 words
A heat curable composition in accordance with claim 1, where the polymeric diaryliodonium hexafluoroantimonate salt is diphenyliodoniumhexafluoroantimonate.
Claim 5
Dependent Claim 17 words
A heat curable composition in accordance with claim 1, where the free-radical generating aromatic compound is benzopinacol.
Claim 6
Dependent Claim 20 words
A heat curable composition in accordance with claim 3, where the diphenyliodoniumhexafluoroantimonate salt is an octyloxy substituted diphenyliodonium hexafluoroantimonate salt.
Claim 7
Dependent Claim 10 words
A semiconductor device encapsulated with the composition of claim 1.

References Cited (Backward Citations)

US4173551A Cited
US4845159A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-05-13 1994-11-12 1995-05-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-05-13 1998-11-12 1999-05-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-05-13 2002-11-12 2003-05-14 $7700.00 Window Closed / Lapsed

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