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US5014162A Expired / Lapsed US ⏱️ 0.0 years remaining

Solder assembly of components

Assignee: Nokia Bell Labs
•
Filing: 1989-06-27
•
Granted: 1991-05-07
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Expires: 2009-06-27
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Abstract

Abstract Disclosed is an apparatus involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.

Inventors

  • 👤 William A. Clark
  • 👤 Michael A. Oien
  • 👤 Walter Pelosi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 14:52
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K3/36; H05K3/361; H05K3/363; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/0195; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/043; H05K3/22; H05K3/28; H05K3/281; H05K3/3452

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 100 words
A device comprising: first and second components with pad areas on facing surfaces which are soldered together, at least one of said components including metalized holes in the pad areas which are soldered and the pad areas of the other of said components being essentially flat and not extending into said holes; and solder fillets formed between pad areas on said facing surfaces and extending through said holes to associated pad areas on the surface of said one component opposite to the facing surface of said one component so that the fillets on said associated pad areas can be inspected.
Claim 2
Independent Claim 100 words
A device comprising: first and second components with pad areas on facing surfaces which are soldered together, at least one of said components including metalized holes in the pad areas which are soldered and the pad areas of the other of said components being essentially flat and not extending into said holes; and solder fillets formed between pad areas on said facing surfaces and extending through said holes to associated pad areas on the surface of said one component opposite to the facing surface of said one component so that the fillets on said associated pad areas can be inspected.
Claim 3
Dependent Claim 18 words
The device according to claim 1 wherein the components are a flexible circuit and a printed circuit board.
Claim 4
Dependent Claim 34 words
The device according to claim 2 wherein the metalization of the holes extends from the pad areas of the facing surface to the associated pad areas of the opposite surface of said one component.
Claim 5
Dependent Claim 61 words
The device according to claim 2 wherein the printed circuit board includes a mask material surrounding the pad areas on a facing surface, and the flexible circuit includes a cover layer surrounding the holes formed in the pad areas on a facing surface, the mask material and cover layer leaving exposed areas of the two components which are wettable by solder.
Claim 6
Dependent Claim 67 words
The device according to claim 1 wherein the pad areas and holes are essentially circular, the diameter of the pad areas of the said one component are at least two times larger than the diameter of the holes, and the separation of the pad areas on the facing surfaces is no more than one-tenth of the diameter of the pad areas of the other of said components.

References Cited (Backward Citations)

US3676746A Cited
US3953664A Cited
US4064357A Cited
DE2657313A1 Cited
US4437141A Cited
US4806107A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-05-06 1994-11-05 1995-05-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-05-06 1998-11-05 1999-05-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-05-06 2002-11-05 2003-05-07 $7700.00 Window Closed / Lapsed

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