Apparatus for solder coating printed circuit panels

Claim 1

In apparatus for soldering printed circuit panels comprising a plurality of stations through which the printed circuit panels are conveyed in line, through a horizontal path, the stations including a preheat station having heating means and means for conveying the panels through the preheat station to elevate the temperature of the panels, a flux station for coating the panels with a flux and including means for conveying the panels through the flux station, a soldering station including at least one solder immersion chamber through which said printed circuit panels may be horizontally conveyed for coating the panels with molten solder, the improvement wherein the solder station comprises a solder manifold below the travel path of the panels through the soldering station, and means for pumping molten solder into the manifold whereby to form a standing wave of molten solder, the crest of which extends above the travel path of the panels, said standing wave of molten solder having sufficient volume flow so as to flood at least in part the top side of the panels as they are conveyed through the standing solder wave, said soldering station also comprising a solder immersion chamber defined by upper and lower retainer guide means and two pairs of rolls, the rolls functioning to convey printed circuit panels horizontally through the chamber, each roll pair including an upper roll and a lower roll, the guide means being parallel to the rolls and the lower guide means positioned close to the lower rolls to minimize solder leakage, an opening in the lower guide means parallel to the rolls, the manifold parallel to and below the solder chamber communicating with the opening in the lower guide means, the manifold including side plates terminating below the travel path of said panels for draining excess solder from said manifold.