Facing targets sputtering device

Claim 1

A facing targets sputtering device for depositing an alloyed thin film which comprises: an air-tight container in which an inert gas is admittable and exhaustible; a pair of target plates made of materials different from each other and placed at opposite ends of said air-tight container respectively so as to face each other and form a plasma region therebetween; a pair of magnets respectively disposed adjacent to said target plates such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field of said plasma region between said target plates; and a substrate holder disposed adjacent to said plasma region, said substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited, and which further comprises a first variable power supply means for supplying a first electric power across a first one of said target plates and said container, and a second variable power supply means for supplying a second electric power across the second of said target plates and said container, wherein the first and second variable power supply means vary the first and second electric powers independently of each other during the operation of the device so that the composition of a resultant alloyed thin film is changed in the direction of thickness thereof.