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US5000819A Expired / Lapsed US ⏱️ 0.0 years remaining

Metal surface cleaning processes

Assignee: GEC-MARONI Ltd
•
Filing: 1989-11-29
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Granted: 1991-03-19
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Expires: 2009-11-29
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Abstract

Abstract A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.

Inventors

  • 👤 David J. Pedder
  • 👤 Christopher J. Wort
  • 👤 Kim L. Pickering

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 23:55
CPC Classifications
C; C23; C23G; C23G5/00; B; B23; B23K; B23K1/00; B23K1/20; B23K1/206; B23K2101/00; B23K2101/36; B23K2101/40; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3489

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 73 words
A cleaning process for the removal of surface metal oxides from metal surfaces of articles, comprising the steps of: positioning at least one article to be cleaned within a reaction chamber; introducing a gas mixture containing hydrogen into a plasma generating microwave device to produce atomic hydrogen and causing the atomic hydrogen so produced to flow into the reaction chamber for the abstraction of oxygen from the surface metal oxides of said article.
Claim 2
Dependent Claim 73 words
A cleaning process for the removal of surface metal oxides from metal surfaces of articles, comprising the steps of: positioning at least one article to be cleaned within a reaction chamber; introducing a gas mixture containing hydrogen into a plasma generating microwave device to produce atomic hydrogen and causing the atomic hydrogen so produced to flow into the reaction chamber for the abstraction of oxygen from the surface metal oxides of said article.
Claim 3
Dependent Claim 105 words
A dry solder reflow process including a cleaning operation for the removal of surface metal oxides from solder surfaces of articles to be bonded by soldering, comprising the steps of: positioning at least one article to be cleaned and dry soldered within a reaction chamber and heating said article; introducing a gas mixture containing hydrogen into a plasma generating microwave cavity to produced atomic hydrogen and causing the atomic hydrogen so produced to flow into the reaction chamber for the abstraction of oxygen from said surface metal oxides as the temperature of the article within the reaction chamber is raised to the solder reflow temperature.
Claim 4
Dependent Claim 105 words
A dry solder reflow process including a cleaning operation for the removal of surface metal oxides from solder surfaces of articles to be bonded by soldering, comprising the steps of: positioning at least one article to be cleaned and dry soldered within a reaction chamber and heating said article; introducing a gas mixture containing hydrogen into a plasma generating microwave cavity to produced atomic hydrogen and causing the atomic hydrogen so produced to flow into the reaction chamber for the abstraction of oxygen from said surface metal oxides as the temperature of the article within the reaction chamber is raised to the solder reflow temperature.
Claim 5
Dependent Claim 20 words
A process as claimed in claim 2, in which the gas comprises a mixture of an inert gas and hydrogen.
Claim 6
Dependent Claim 14 words
A process as claimed in claim 3, in which the inert gas is argon.
Claim 7
Dependent Claim 19 words
A dry solder reflow process as claimed in claim 2, in which the process is applied to flip-chip bonding.

References Cited (Backward Citations)

GB2120278A Cited
US4698130A Cited
US4711698A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-03-18 1994-09-17 1995-03-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-03-18 1998-09-17 1999-03-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-03-18 2002-09-17 2003-03-19 $7700.00 Window Closed / Lapsed

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