US4998159A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic laminated circuit substrate
Assignee: Hitachi Ltd
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Filing: 1989-06-08
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Granted: 1991-03-05
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Expires: 2009-06-08
Abstract
Abstract The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer and a plurality of ceramic insulating layers wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer. The present invention further provides a method for making this substrate which comprises preparing fiber-containing composite green sheets by adding to a green sheet raw material at least one of whiskers, glass filaments and chopped strands as fibers, laminating these fiber-containing composite green sheets in such direction that their casting directions are different together with green sheets containing no fibers to form a laminate and firing this laminate.
Inventors
- 👤 Hiroichi Shinohara
- 👤 Hideo Suzuki
- 👤 Satoru Ogihara
- 👤 Hideo Arakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; B; B32; B32B; B32B18/00; C; C03; C03C; C03C13/00; C03C13/06; C03C14/00; C03C14/006; C03C25/00; C03C25/10; C03C25/465; C03C25/47; C03C3/00; C03C3/04; C03C3/06; C03C3/062; C03C3/064; C03C3/076; C03C3/083; C03C3/089; C03C3/091; C03C8/00; C03C8/02; C03C8/14; C03C8/18; C04; C04B; C04B35/00; C04B35/01; C04B35/16; C04B35/18; C04B35/185; C04B35/515; C04B35/58; C04B35/581; C04B35/622; C04B35/626; C04B35/62605; C04B35/62625; C04B35/6264; C04B35/64; C04B35/645; C04B35/71; C04B35/78; C04B35/80; C04B35/82; C04B37/00; C04B37/003; C04B37/005; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/66; H10W70/67; H10W70/69; H10W70/692; H10W90/00; H10W90/401; H10W99/00; C03C2214/00; C03C2214/20; C04B2235/00; C04B2235/02; C04B2235/30; C04B2235/32; C04B2235/3205; C04B2235/3206; C04B2235/3217; C04B2235/3224; C04B2235/3225; C04B2235/34; C04B2235/3418; C04B2235/50; C04B2235/52; C04B2235/5208; C04B2235/5216; C04B2235/522; C04B2235/524; C04B2235/526; C04B2235/5264; C04B2235/5276; C04B2235/65; C04B2235/656; C04B2235/6567; C04B2235/658; C04B2235/6582; C04B2235/66; C04B2235/70; C04B2235/74; C04B2235/77; C04B2235/78; C04B2235/785; C04B2235/96; C04B2235/9607; C04B2235/9615; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/06; C04B2237/062; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/341; C04B2237/345; C04B2237/346; C04B2237/36; C04B2237/366; C04B2237/38; C04B2237/50; C04B2237/56; C04B2237/565; C04B2237/58; C04B2237/582; C04B2237/584; C04B2237/59; C04B2237/592; C04B2237/62; C04B2237/66; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/63416; C04B35/63436; C04B35/63448; C04B35/63468; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/02; H05K2201/0275; H05K2201/029; H05K3/4688; H10W70/63; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
112 words
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include at least two fiber-containing composite ceramic insulating layers and at least one fiber-free ceramic insulating layer, and wherein said fiber-containing ceramic insulating layers are placed at a distance from each other by means of said fiber-free ceramic insulating layer and in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction); said conductor layers, said composite ceramic insulating layers and said fiber-free ceramic insulating layer being integrally laminated by firing.
Claim 2
Dependent Claim
112 words
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include at least two fiber-containing composite ceramic insulating layers and at least one fiber-free ceramic insulating layer, and wherein said fiber-containing ceramic insulating layers are placed at a distance from each other by means of said fiber-free ceramic insulating layer and in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction); said conductor layers, said composite ceramic insulating layers and said fiber-free ceramic insulating layer being integrally laminated by firing.
Claim 3
Dependent Claim
44 words
A ceramic laminated circuit substrate according to claim 1 wherein the fiber-containing composite ceramic insulating layers are laminated nearly symmetrically with respect to a centerplane of the thickness of the substrate or the lengthwise directions of the fibers in these layers cross each other.
Claim 4
Dependent Claim
39 words
A ceramic laminated circuit substrate according to claim 1 wherein a fiber-containing composite ceramic insulating layer which contains fibers crossing each other in the lengthwise direction thereof is laminated nearly at the center of the thickness of the substrate.
Claim 5
Dependent Claim
59 words
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between ceramic insulating layers, wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer and at least one fiber-free ceramic insulating layer and the circuit substrate has a void content of 10 vol% or less.
Claim 6
Dependent Claim
59 words
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between ceramic insulating layers, wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer and at least one fiber-free ceramic insulating layer and the circuit substrate has a void content of 10 vol% or less.
Claim 7
Dependent Claim
49 words
A ceramic laminated circuit substrate according to claim 1, wherein the conductor layer comprises Cu, Au, Ag, Ag-Pd, W, or an alloy of at least two of them and ceramic material of the ceramic insulating layers softens at a temperature lower than the melting point of the conductor layer.
Claim 8
Dependent Claim
29 words
A ceramic laminated circuit substrate according to claim 1, wherein softening point of the fibers is higher than softening point of a matrix of ceramic molded product before firing.
Claim 9
Dependent Claim
22 words
A ceramic laminated circuit substrate according to claim 1, which has at least one of a through-hole conductor and a via-hole conductor.
Claim 10
Dependent Claim
18 words
A ceramic laminated circuit substrate according to claim 1, on which a thin film multi-layer wiring is formed.
Claim 11
Dependent Claim
16 words
A ceramic laminated circuit substrate according to claim 1, which contains a capacitor or a resistor.
Claim 12
Dependent Claim
22 words
A semiconductor module which comprises a ceramic laminated circuit substrate according to claim 1, and a semiconductor device mounted on the substrate.
Claim 13
Dependent Claim
19 words
A semiconductor module according to claim 10, wherein the semiconductor device is mounted on the substrate through CCB bonding.
Claim 14
Dependent Claim
49 words
A ceramic laminated circuit substrate comprising a pre-fired substrate, at least one fiber-free ceramic insulating layer formed on said pre-fired ceramic substrate, and carrying a conductor layer; and a fiber-containing composite insulating layer formed on said fiber-free ceramic insulating layer; said conductor layer being disposed between said insulating layers.
Claim 15
Dependent Claim
49 words
A ceramic laminated circuit substrate comprising a pre-fired substrate, at least one fiber-free ceramic insulating layer formed on said pre-fired ceramic substrate, and carrying a conductor layer; and a fiber-containing composite insulating layer formed on said fiber-free ceramic insulating layer; said conductor layer being disposed between said insulating layers.
Claim 16
Dependent Claim
96 words
A ceramic laminated circuit substrate comprising conductor layers and ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include two fiber-containing composite ceramic insulating layers and three fiber-free ceramic insulating layers, said fiber-containing composite ceramic insulating layers and said fiber-free ceramic insulating layers being alternately laminated in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction); said conductor layers, said composite ceramic insulating layers and said fiber-free ceramic insulating layers being integrally laminated by firing.
Claim 17
Dependent Claim
96 words
A ceramic laminated circuit substrate comprising conductor layers and ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include two fiber-containing composite ceramic insulating layers and three fiber-free ceramic insulating layers, said fiber-containing composite ceramic insulating layers and said fiber-free ceramic insulating layers being alternately laminated in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction); said conductor layers, said composite ceramic insulating layers and said fiber-free ceramic insulating layers being integrally laminated by firing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-04 | 1994-09-03 | 1995-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-04 | 1998-09-03 | 1999-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-04 | 2002-09-03 | 2003-03-05 | $7700.00 | Window Closed / Lapsed |