US4809058A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device
Assignee: Hitachi Ltd
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Filing: 1986-12-15
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Granted: 1989-02-28
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Expires: 2006-12-15
Abstract
Abstract An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.
Inventors
- 👤 Takao Funamoto
- 👤 Ryoichi Kajiwara
- 👤 Mituo Katou
- 👤 Takeshi Matsuzaka
- 👤 Tomohiko Shida
- 👤 Hiroshi Wachi
- 👤 Kazuya Takahashi
- 👤 Masatoshi Watanabe
- 👤 Minoru Yamada
- 👤 Keiichirou Nakanishi
- 👤 Katuo Sugawara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:58
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K1/0272; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W90/00; H10W90/401; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0242; H05K2201/0251; H05K2201/06; H05K2201/064
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
196 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof, said heat radiating means being inserted in at least one of the layers of a heat and electrically conductive metal and the electrically insulating layers of the power source substrate closest to the wiring substrate.
Claim 2
Dependent Claim
196 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof, said heat radiating means being inserted in at least one of the layers of a heat and electrically conductive metal and the electrically insulating layers of the power source substrate closest to the wiring substrate.
Claim 3
Dependent Claim
32 words
An integrated circuit device according to claim 1, wherein the material for said layers of a heat and electrically conductive metal is one of copper, a copper-silver alloy and a copper-titanium alloy.
Claim 4
Dependent Claim
20 words
An integrated circuit device according to claim 1, wherein the material for said electrically insulating layers is an organic resin.
Claim 5
Dependent Claim
31 words
An integrated circuit device according to claim 3, wherein said organic resin consists of one resin selected from the group composed of epoxy resin, addition-polymerized polyimide, polyvinylidene fluoride and phenol formaldehyde.
Claim 6
Dependent Claim
42 words
An integrated circuit device according to claim 1, wherein said material for the electrically insulating layers is an inorganic material, and wherein the inorganic material consists of one material selected from the group composed of a SiC ceramic material, alumina and beryllium.
Claim 7
Dependent Claim
190 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips on one surface thereof and terminal pins on the other surface thereof; a power source substrate disposed in contact with the terminal pin-carrying surface of said wiring substrate, having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material to one another, and provided with through holes in which said terminal pins are inserted, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a heat radiating means provided in the interior of at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of the power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof; and a blowing and cooling means disposed sufficiently close to said power source substrate so as to send air to said power source substrate and thereby cool the same.
Claim 8
Dependent Claim
190 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips on one surface thereof and terminal pins on the other surface thereof; a power source substrate disposed in contact with the terminal pin-carrying surface of said wiring substrate, having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material to one another, and provided with through holes in which said terminal pins are inserted, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a heat radiating means provided in the interior of at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of the power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof; and a blowing and cooling means disposed sufficiently close to said power source substrate so as to send air to said power source substrate and thereby cool the same.
Claim 9
Dependent Claim
30 words
An integrated circuit device according to claim 1, wherein said heat radiating means is inserted in the electrically insulating layers of the power source substrate closest to the wiring substrate.
Claim 10
Dependent Claim
179 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, the material of the electrically insulating layers having a coefficient of electrostatic induction of not less than 4, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof.
Claim 11
Dependent Claim
179 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, the material of the electrically insulating layers having a coefficient of electrostatic induction of not less than 4, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof.
Claim 12
Dependent Claim
163 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips mounted on one surface thereof; a power source substrate disposed in contact with the other surface of said wiring substrate, and having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and layers of an electrically insulating material to one another, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; and a means for electrically connecting said wiring substrate and said power source substrate to each other, at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, having through bores extending in parallel with said layers and used to introduce a gaseous coolant from the outside of said layers thereinto, the bores having a radius of 80-120 μm.
Claim 13
Dependent Claim
163 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips mounted on one surface thereof; a power source substrate disposed in contact with the other surface of said wiring substrate, and having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and layers of an electrically insulating material to one another, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; and a means for electrically connecting said wiring substrate and said power source substrate to each other, at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, having through bores extending in parallel with said layers and used to introduce a gaseous coolant from the outside of said layers thereinto, the bores having a radius of 80-120 μm.
Claim 14
Dependent Claim
171 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips mounted on one surface thereof; a power source substrate disposed in contact with the other surface of said wiring substrate, and having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, to one another, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; and a means for electrically connecting said wiring substrate and said power source substrate to each other, at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, having holes into which a coolant is to be introduced from the outside of said layers, said holes being bores that extend through the laminated structure of the power source substrate, in a direction perpendicular to said layers.
Claim 15
Dependent Claim
171 words
An integrated circuit device comprising a wiring substrate having integrated circuit chips mounted on one surface thereof; a power source substrate disposed in contact with the other surface of said wiring substrate, and having a laminated structure formed by alternately bonding layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, to one another, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; and a means for electrically connecting said wiring substrate and said power source substrate to each other, at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, having holes into which a coolant is to be introduced from the outside of said layers, said holes being bores that extend through the laminated structure of the power source substrate, in a direction perpendicular to said layers.
Claim 16
Dependent Claim
191 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof, said heat radiating means being heat conductive metal wires in the electrically insulating layers and spot-contacted to one of the two adjacent layers of a heat and electrically conductive metal.
Claim 17
Dependent Claim
191 words
An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted; a power source substrate of a laminated structure provided in contact with the other surface of said wiring substrate, and formed by alternately laminating layers of a heat and electrically conductive metal, for supplying electrical current to the integrated circuit chips, and electrically insulating layers of an electrically insulating material, and bonding together said laminated layers, the laminated structure including a plurality of the layers of a heat and electrically conductive metal and a plurality of the electrically insulating layers; a means for electrically connecting said wiring substrate and said power source substrate to each other; and a heat radiating means inserted in at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, and adapted to radiate the heat, which occurs in said power source substrate, to the outside thereof, said heat radiating means being heat conductive metal wires in the electrically insulating layers and spot-contacted to one of the two adjacent layers of a heat and electrically conductive metal.
Claim 18
Dependent Claim
47 words
An integrated circuit device according to claim 6, wherein at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, has holes into which a coolant is to be introduced from the outside of said layers.
Claim 19
Dependent Claim
58 words
An integrated circuit device according to claim 6, wherein at least one of said layers of a heat and electrically conductive metal and said electrically insulating layers, of said power source substrate, has through bores extending in parallel with said layers, the through bores being used to introduce a gaseous coolant from the outside of said layers thereinto.
Claim 20
Dependent Claim
58 words
An integrated circuit device according to claim 6, wherein at least one of said layers of a heat and electrically conductive material and said electrically insulating layers, of said power source substrate, has through bores extending in parallel with said layers, the through bores being used to introduce a liquid coolant from the outside of said layers thereinto.
Claim 21
Dependent Claim
49 words
An integrated circuit device according to claim 6, wherein said heat radiating means includes a heat radiating filler in the form of powder or fibers contained in at least one of said layers of heat and electrically conductive metal and said electrically insulating layers, of the power source substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-28 | 1992-08-29 | 1993-02-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-28 | 1996-08-29 | 1997-02-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-28 | 2000-08-29 | 2001-02-28 | $7700.00 | Window Closed / Lapsed |