Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide

Claim 2

A devitrifying glass frit comprising, on a weight basis: from about 15 to about 25 percent of zinc oxide, from about 10 to about 25 percent of magnesium oxide, from about 3 to about 12 percent of an oxide selected from the group consisting of barium oxide and strontium oxide, from about 5 to about 20 percent of aluminum oxide, from about 35 to about 50 percent of silicon dioxide, from 0 to about 3 percent of phosphorus pentoxide; from 0 to about 5 percent of zirconium silicate, from 0.01 to about 1 percent lead oxide, and from 0.01 to about 1 percent iron oxide.

Claim 3

A devitrifying glass frit according to claim 1 comprising barium oxide, from b 0 to about 1.0 percent of phosphorus pentoxide, and from 0 to about 1 percent of zirconium silicate.

Claim 4

A glass frit according to claim 1, comprising from about 17 to about 23.5 percent of zinc oxide; from about 17 to about 23.5 percent of magnesium oxide; from about 5 to about 10 percent of barium oxide; from about 8 to about 11 percent of aluminum oxide; and from about 39 to about 43 percent of silicon dioxide.

Claim 5

A devitrifying glass frit according to claim 1 comprising from about 17 to about 23.5 percent of zinc oxide; from about 17 to about 23.5 percent of magnesium oxide; from about 3 to about 10 percent of strontium oxide; from about 7 to about 11 percent of aluminum oxide; from about 38 to about 43 percent of silicon dioxide; from 0 to about 2 percent of phosphorus pentoxide; and from 0 to about 2 percent of zirconium silicate.

Claim 6

A devitrifying glass composition according to claim 1 comprising about 22.3 weight percent zinc oxide, about 19.7 weight percent magnesium oxide, about 6 weight percent barium oxide, about 40.5 weight percent silica, about 9.6 weight percent alumina, about 1 weight percent phosphorous pentoxide, about 0.4 weight percent lead oxide and about 0.6 weight percent iron oxide.

Claim 7

A dielectric composition for multilayer integrated circuit fabrication comprising: a) from about 50 to about 75 percent by weight of a devitrifying glass frit comprising, on a weight basis: from about 15 to about 25 percent zinc oxide; from about 10 to about 25 percent magnesium oxide, from about 3 to about 12 percent of an oxide selected from the group consisting of barium oxide and strontium oxide, from about 5 to about 20 percent aluminum oxide, from about 35 to about 50 percent silicon dioxide, from 0 to about 3 percent phosphorus pentoxide, from 0 to about 5 percent zirconium silicate, from about 0.01 to about 1 percent iron oxide, and from about 0.01 to about 1 weight percent lead oxide; b) up to about 30 percent by weight of a suitable ceramic filler; and c) from about 15 to about 30 percent by weight of a suitable organic vehicle.

Claim 8

A dielectric composition for multilayer integrated circuit fabrication comprising: a) from about 50 to about 75 percent by weight of a devitrifying glass frit comprising, on a weight basis: from about 15 to about 25 percent zinc oxide; from about 10 to about 25 percent magnesium oxide, from about 3 to about 12 percent of an oxide selected from the group consisting of barium oxide and strontium oxide, from about 5 to about 20 percent aluminum oxide, from about 35 to about 50 percent silicon dioxide, from 0 to about 3 percent phosphorus pentoxide, from 0 to about 5 percent zirconium silicate, from about 0.01 to about 1 percent iron oxide, and from about 0.01 to about 1 weight percent lead oxide; b) up to about 30 percent by weight of a suitable ceramic filler; and c) from about 15 to about 30 percent by weight of a suitable organic vehicle.

Claim 9

A dielectric ink according to claim 6 comprising barium oxide, from 0 to about 1 percent phosphorus pentoxide, and from 0 to about 1 percent zirconium silicate.

Claim 10

A dielectric ink according to claim 6 comprising from about 17 to about 23.5 percent zinc oxide, from about 17 to about 23.5 percent magnesium oxide, from about 5 to about 10 percent barium oxide, from about 8 to about 11 percent aluminum oxide, and from about 39 to about 43 percent silicon dioxide.

Claim 11

A dielectric ink in accordance with claim 6 wherein the glass frit comprises, on a weight basis: from about 17 to about 23.5 percent of zinc oxide; from about 17 to about 23.5 percent of magnesium oxide; from about 3 to about 10 percent of strontium oxide; from about 7 to about 11 percent of aluminum oxide; from about 38 to about 43 percent of silicon dioxide; from 0 to about 2 percent of phosphorus pentoxide and from 0 to about 2 percent of zirconium silicate.

Claim 12

A dielectric ink in accordance with claim 6 wherein the ink contains from about 5 to about 15 percent by weight of the filler.

Claim 13

A dielectric ink in accordance with claim 10 wherein the filler is selected from the group consisting of alumina, barium dimagnesium disilicate, dimagnesium borate, zirconium silicate, dimagnesia silicate, dimagnesia dialumina pentasilicate, magnesium aluminate and mixtures thereof.

Claim 14

A dielectric ink in accordance with claim 11 wherein the filler material is a mixture of alumina and barium dimagnesium disilicate.

Claim 15

In a multilayer, integrated circuit structure comprising a suitable substrate having thereon at least two patterned layers of a conductor, said layers being separated by a dielectric layer having vias therein, the vias being filled with a conductor to contact said conductor layers, the improvement wherein said dielectric layer comprises: a) from about 65 to 100 percent by weight of a devitrifying glass comprising, on a weight basis: from about 15 to about 25 percent zinc oxide, from about 10 to about 25 percent magnesium oxide, from about 3 to about 12 percent of an oxide selected from the group consisting of barium oxide and strontium oxide, from about 5 to about 20 percent aluminum oxide, from about 35 to about 50 percent silicon dioxide, from 0 to about 3 percent phosphorus pentoxide, from 0 to about 5 percent of zirconium silicate, and from 0.01 to about 1 percent lead oxide, and from 0.01 to about b 1 percent iron oxide; and b) up to about 35 percent by weight of a suitable ceramic filler.

Claim 16

In a multilayer, integrated circuit structure comprising a suitable substrate having thereon at least two patterned layers of a conductor, said layers being separated by a dielectric layer having vias therein, the vias being filled with a conductor to contact said conductor layers, the improvement wherein said dielectric layer comprises: a) from about 65 to 100 percent by weight of a devitrifying glass comprising, on a weight basis: from about 15 to about 25 percent zinc oxide, from about 10 to about 25 percent magnesium oxide, from about 3 to about 12 percent of an oxide selected from the group consisting of barium oxide and strontium oxide, from about 5 to about 20 percent aluminum oxide, from about 35 to about 50 percent silicon dioxide, from 0 to about 3 percent phosphorus pentoxide, from 0 to about 5 percent of zirconium silicate, and from 0.01 to about 1 percent lead oxide, and from 0.01 to about b 1 percent iron oxide; and b) up to about 35 percent by weight of a suitable ceramic filler.

Claim 17

A circuit structure in accordance with claim 13, wherein the devitrifying glass consists essentially of, on a weight basis: from about 17 to about 23.5 percent zinc oxide, from about 17 to about 23.5 percent magnesium oxide, from about 5 to about 10 percent barium oxide, from about 8 to about 11 percent aluminum oxide, and from about 398 to about 43 percent silicon dioxide.

Claim 18

A circuit structure in accordance with claim 13 wherein the devitrifying glass comprises, on a weight basis: from about 17 to about 23.5 percent zinc oxide, from about 17 to about 23.5 percent magnesium oxide, from about 3 to about 10 percent strontium oxide, from about 7 to about 11 percent aluminum oxide, from about 38 to about 43 percent silicon dioxide, from 0 to about 2 percent zirconium silicate.

Claim 19

A circuit structure in accordance with claim 13 wherein the dielectric layer contains from about 5 to about 26 percent by weight of the filler.

Claim 20

A circuit structure in accordance with claim 13 wherein said conductor is copper.