US4997355A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for producing semiconductor devices
Assignee: Mitsubishi Electric Corp
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Filing: 1990-06-01
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Granted: 1991-03-05
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Expires: 2010-06-01
Abstract
Abstract An apparatus for producing semiconductor devices includes a resin molding section for resin-molding semiconductor chips, a loading section for supplying a lead frame, to which the semiconductor chips are bonded, to the resin molding section, a tablet supplying device which supplies a resin tablet to the resin molding section, an unloading section which takes out the resin-molded semiconductor chips with the lead frame from the resin molding section, and a dust cover which covers the resin molding section, the tablet supplying device and the unloading section.
Inventors
- 👤 Shunji Yamauchi
- 👤 Hiroki Mieda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 02:38
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; B29C45/1468; B29C45/17; B29C45/1701; H10P72/0478; B29C45/02; B29C45/18; B29C45/1808; B29C45/40; B29C45/42
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
120 words
An apparatus for producing semi-conductor devices comprising: resin-molding means for resin-molding semiconductor chips; loading means for supplying a lead frame, to which a semiconductor chip is bonded, to said resin-molding means; tablet supplying means for supplying a resin tablet to said resin-molding means; unloading means for unloading a resin-molded semi-conductor chip and lead frame from said resin-molding means; and dust cover means for shielding a space around said resin-molding means, said tablet supplying means, and said loading means, wherein said loading means and the space around said tablet supplying means are shielded from each other by said dust cover means to prevent dust from a resin tablet for reaching a lead frame prior to resin molding of the lead frame.
Claim 2
Independent Claim
120 words
An apparatus for producing semi-conductor devices comprising: resin-molding means for resin-molding semiconductor chips; loading means for supplying a lead frame, to which a semiconductor chip is bonded, to said resin-molding means; tablet supplying means for supplying a resin tablet to said resin-molding means; unloading means for unloading a resin-molded semi-conductor chip and lead frame from said resin-molding means; and dust cover means for shielding a space around said resin-molding means, said tablet supplying means, and said loading means, wherein said loading means and the space around said tablet supplying means are shielded from each other by said dust cover means to prevent dust from a resin tablet for reaching a lead frame prior to resin molding of the lead frame.
Claim 3
Dependent Claim
28 words
An apparatus according to claim 1, wherein said dust cover means comprises a common dust cover covering said resin-molding means, said tablet supplying means and said unloading means.
Claim 4
Dependent Claim
39 words
An apparatus according to claim 2, wherein said common dust cover has a first opening formed on one side wall thereof facing said loading means for passing said lead frame supplied from said loading means to said resin-molding means.
Claim 5
Dependent Claim
19 words
An apparatus according to claim 3, further comprising a first shutter which selectively opens and closes said first opening.
Claim 6
Dependent Claim
22 words
An apparatus according to claim 1, wherein said tablet supplying means and said unloading means comprise a unitary tablet-supplying and unloading means.
Claim 7
Dependent Claim
32 words
An apparatus according to claim 5, wherein said dust cover means comprises a first dust cover covering said resin-molding means and a second dust cover covering said unitary tablet-supplying and unloading means.
Claim 8
Dependent Claim
39 words
An apparatus according to claim 6, wherein said first dust cover has a first opening formed on one side wall thereof facing said loading means for passing said lead frame supplied from said loading means to said resin-molding means.
Claim 9
Dependent Claim
19 words
An apparatus according to claim 7, further comprising a first shutter which selectively opens and closes said first opening.
Claim 10
Dependent Claim
65 words
An apparatus according to claim 6, wherein said first dust cover has a second opening formed on another side wall thereof facing said single tablet-supplying and unloading means for passing said resin tablet supplied from said single tablet-supplying and unloading means to said resin-molding means and for passing said resin-molded lead frame taken out from said resin-molding means to said unitary tablet-supplying and unloading means.
Claim 11
Dependent Claim
19 words
An apparatus according to claim 9, further comprising a second shutter which selectively opens and closes said second opening.
References Cited (Backward Citations)
US3793714A
Cited
US4173821A
Cited
JPS5596642A
Cited
US4323415A
Cited
JPS60132716A
Cited
US4534921A
Cited
US4748050A
Cited
US4812114A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-04 | 1994-09-03 | 1995-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-04 | 1998-09-03 | 1999-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-04 | 2002-09-03 | 2003-03-05 | $7700.00 | Window Closed / Lapsed |