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US4996284A Expired / Lapsed US ⏱️ 0.0 years remaining

Novel epoxy sulfonamide-based resins, a process for their preparation and use of same

Assignee: Empak Inc
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Filing: 1989-04-24
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Granted: 1991-02-26
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Expires: 2009-04-24
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Abstract

Abstract A process for the preparation of a sulfonamide-based epoxy resinous composition, which includes the step of reacting a sulfonamide compound with a resinous composition containing a plurality of epoxide groups in the presence of a Lewis acid, is disclosed. The epoxy sulfonamide resins of the invention, which are being claimed, have applications in nail lacquer compositions and other cosmetics, adhesives, and in wood and paper coatings, as a plasticizer and as a modifier in injection molding applications for various resins.

Inventors

  • 👤 Leo X. Mallavarapu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 14:36
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/44; C08G59/444; A; A61; A61K; A61K8/00; A61K8/18; A61K8/72; A61K8/84; A61Q; A61Q3/00; A61Q3/02; C08L; C08L63/00

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 46 words
A process for the preparation of a thermoplastic sulfonamide-based epoxy resinous composition, comprising the step of: reacting a sulfonamide compound with a resinous composition, at a temperature of, at least, approximately 140° C. containing a plurality of epoxide groups in the presence of a Lewis acid.
Claim 2
Dependent Claim 46 words
A process for the preparation of a thermoplastic sulfonamide-based epoxy resinous composition, comprising the step of: reacting a sulfonamide compound with a resinous composition, at a temperature of, at least, approximately 140° C. containing a plurality of epoxide groups in the presence of a Lewis acid.
Claim 3
Dependent Claim 15 words
The process according to claim 1, wherein said sulfonamide compound is an aryl sulfonamide compound.
Claim 4
Dependent Claim 38 words
The process according to claim 1, wherein said sulfonamide compound is a member selected from the group consisting of benzene-sulfonamide, toluenesulfonamide, naphthalene sulfonamide, chlorobenzene sulfonamide, nitrobenzenesulfonamide, phenyl methane sulfonamide, benzene disulfonamide, naphthalene disulfonamide, methane sulfonamide and ethane sulfonamide.
Claim 5
Dependent Claim 32 words
The process according to claim 1, wherein said resinous composition containing a plurality of epoxide groups includes diglycidyl ether bis phenol A type with a molecular weight of up to approximately 20,000.
Claim 6
Dependent Claim 31 words
The process according to claim 1, wherein said resinous composition containing a plurality of epoxide groups includes diglycidyl bis phenol F type with a molecular weight of up to approximately 20,000.
Claim 7
Dependent Claim 30 words
The process according to claim 1, wherein said Lewis acid is a member selected from the group consisting of tetramethyl ammonium chloride, tetramethyl ammonium bromide, zinc chloride and aluminum chloride.

References Cited (Backward Citations)

US2712001A Cited
US3277050A Cited
US3819581A Cited
US3849375A Cited
US4528359A Cited
US4618526A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-02-25 1994-08-27 1995-02-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-02-25 1998-08-27 1999-02-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-02-25 2002-08-27 2003-02-26 $7700.00 Window Closed / Lapsed

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