Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides

Claim 2

A resin composition resulting from heating, at a temperature sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine groups, but insufficient to cause a significant reaction between the amide groups for a time sufficient to complete the reaction between the aromatic amine groups and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy group per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide at least about 0.2 1,2-epoxy group for each primary aromatic amine group.

Claim 3

A composition of claim 1 wherein (1) the temperature employed is not greater than about 130° C. and (2) components (A) and (B) are employed in quantities which provides from about 0.5 to about 20 1,2-epoxy groups for each primary aromatic amine group.

Claim 4

A composition of claim 2 wherein the temperature employed is not greater than about 120° C.

Claim 5

A composition of claims 1, 2 or 3 wherein component (A) is at least one epoxy resin represented by the formulas I, II, III or IV as set forth in the specification or a mixture thereof wherein each A is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms ##STR4## each A' is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms; R is hydrogen or a hydrocarbyl group having from 1 to about 10 carbon atoms; each R' is independently hydrogen or a hydrocarbyl group having from 1 to about 4 carbon atoms; each X is independently hydrogen, a monovalent hydrocarbyl group having from 1 to about 10 carbon atoms or a halogen; n has a value of zero or 1; n' has a value of from about 1.01 to about 7; n" has a value of from about one to about 4; x has a value of from one to about 4 and x' has a value of from one to about 3 and wherein component (B) is an amine substituted aromatic sulfonamide represented by formula V as set forth in the specification wherein X and x are as defined above.

Claim 6

A composition of claim 4 wherein component (A) is (2) an epoxy resin represented by formula III; (2) a mixture of epoxy resins represented by formulas II and III; or (3) a mixture of epoxy resins represented by formulas III and IV; and component (B) is sulfanilamide.

Claim 7

A composition of claim 5 wherein A is an isopropylidene group, A' is a methylene group, R is hydrogen, R' and X are hydrogen, and n, x and x' have a value of 1.

Claim 8

A resin composition containing excess epoxy groups with respect to amine hydrogen atoms resulting from heating, at a temperature which is sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine group, but insufficient to cause a significant reaction between the epoxy groups and the amide groups, for a time sufficient to complete the reaction between the aromatic amine groups and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy groups per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from greater than about 4 to about 20 1,2-epoxy groups for each primary aromatic amine group.

Claim 9

A resin composition containing excess epoxy groups with respect to amine hydrogen atoms resulting from heating, at a temperature which is sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine group, but insufficient to cause a significant reaction between the epoxy groups and the amide groups, for a time sufficient to complete the reaction between the aromatic amine groups and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy groups per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from greater than about 4 to about 20 1,2-epoxy groups for each primary aromatic amine group.

Claim 10

A composition of claim 7 wherein (1) the temperature employed is not greater than about 130° C. and (2) components (A) and (B) are employed in quantities which provides from about 6 to about 16 1,2-epoxy groups for each primary aromatic amine group.

Claim 11

A composition of claim 8 wherein (1) the temperature employed is not greater than about 120° C. and (2) components (A) and (B) are employed in quantities which provides fron about 8 to about 16 1,2-epoxy groups for each primary aromatic amine group.

Claim 12

A composition of claims 7, 8 or 9 wherein component (A) is at least one epoxy resin represented by the formulas I, II, III or IV as set forth in the specification or a mixture thereof wherein each A is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms, ##STR5## each A' is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms; R is hydrogen or a hydrocarbyl group having from 1 to about 10 carbon atoms; each R' is independently hydrogen or a hydrocarbyl group having from 1 to about 4 carbon atoms; each X is independently hydrogen, a monovalent hydrocarbyl group having from 1 to about 10 carbon atoms or a halogen; n has a value of zero or 1; n' has a value of from about 1.01 to about 7; n" has a value of from about one to about 4; x has a value of from one to about 4 and x' has a value of from one to about 3 and wherein component (B) is an amine substituted aromatic sulfonamide represented by formula V as set forth in the specification wherein X and x are as defined above.

Claim 13

A composition of claim 10 wherein component (A) is (1) an epoxy resin represented by formula III; (2) a mixture of epoxy resins represented by formulas II and III; or (3) a mixture of epoxy resins represented by formulas III and IV; and wherein component (B) is sulfanilamide.

Claim 14

A composition of claim 11 wherein A is an isopropylidene group, A' is a methylene group, R is hydrogen, R' and X are hydrogen, n, x and x' have a value of 1.

Claim 15

An article resulting from subjecting a composition comprising (A) a resin of claims 7, 8 or 9 and (B) a curing quantity of at least one curing agent therefor selected from carboxylic acids, carboxylic acid anhydrides and Lewis acids to conditions sufficient to cure the composition.

Claim 16

An article of claim 13 which is a structural or electrical laminate or composite.

Claim 17

An article resulting from subjecting a composition comprising (A) a resin of claim 10 and (B) a curing quantity of at least one curing agent therefor to conditions sufficient to cure the composition.

Claim 18

An article of claim 15 which is a structural or electrical laminate or composite.

Claim 19

An article resulting from subjecting a composition comprising (A) a resin of claim 11 and (B) a curing quantity of at least one curing agent therefor to conditions sufficient to cure the composition.

Claim 20

An article of claim 17 which is a structural or electrical laminate or composite.

Claim 21

An article resulting from subjecting a composition comprising (A) a resin of claim 12 and (B) a curing quantity of at least one curing agent therefor to conditions sufficient to cure the composition.

Claim 22

An article of claim 19 which is a structural or electrical laminate or composite.

Claim 23

A latent self-curing epoxy resin composition resulting from heating, at a temperature sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine groups, but insufficient to cause a significant reaction between the amide groups for a time sufficient to complete the reaction between the aromatic amine groups and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy group per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from about 2.5 to about 6 1,2-epoxy group for each primary aromatic amine group.

Claim 24

A latent self-curing epoxy resin composition resulting from heating, at a temperature sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine groups, but insufficient to cause a significant reaction between the amide groups for a time sufficient to complete the reaction between the aromatic amine groups and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy group per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from about 2.5 to about 6 1,2-epoxy group for each primary aromatic amine group.

Claim 25

A composition of claim 21 wherein (1) the temperature employed is not greater than about 130° C. and (2) components (A) and (B) are employed in quantities which provides from about 3 to about 5 1,2-epoxy groups for each primary aromatic amine group.

Claim 26

A composition of claim 22 wherein the temperature employed is not greater than about 120° C.

Claim 27

A composition of claims 21, 22 or 23 wherein component (A) is at least one epoxy resin represented by the formulas I, II, III or IV as set forth in the specification or a mixture thereof wherein each A is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms, ##STR6## each A' is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms; R is hydrogen or a hydrocarbyl group having from 1 to about 10 carbon atoms; each R' is independently hydrogen or a hydrocarbyl group having from 1 to about 4 carbon atoms; each X is independently hydrogen, a monovalent hydrocarbyl group having from 1 to about 10 carbon atoms or a halogen; n has a value of zero or 1; n' has a value of from about 1.01 to about 7; n" has a value of from about one to about 4; x has a value of from one to about 4 and x' has a value of from one to about 3 and wherein component (B) is an amine substituted aromatic sulfonamide represented by formula V as set forth in the specification wherein X and x are as defined above.

Claim 28

A composition of claim 24 wherein component (A) is (1) an epoxy resin represented by formula III; (2) a mixture of epoxy resins represented by formulas II and III; or (3) a mixture of epoxy resins represented by formulas III and IV; and wherein component (B) is sulfanilamide.

Claim 29

A composition of claim 25 wherein A is an isopropylidene group, A' is a methylene group, R is hydrogen, R' and X are hydrogen, and n, x and x' have a value of 1.

Claim 30

A resin composition containing excess hydrogen atoms attached to a nitrogen atom with respect to epoxy groups resulting from heating, at a temperature which is sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine group, but insufficient to cause a significant reaction between the epoxy groups and the amide groups, for a time sufficient to complete the reaction between the aromatic amine group and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy groups per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from about 0.2 to less than about 4 1,2-epoxy groups for each primary aromatic amine group.

Claim 31

A resin composition containing excess hydrogen atoms attached to a nitrogen atom with respect to epoxy groups resulting from heating, at a temperature which is sufficient to cause primarily a reaction between the epoxy groups and the primary aromatic amine group, but insufficient to cause a significant reaction between the epoxy groups and the amide groups, for a time sufficient to complete the reaction between the aromatic amine group and the epoxy groups, a composition comprising (A) at least one epoxy resin having an average of more than one 1,2-epoxy groups per molecule and (B) at least one amine substituted aromatic sulfonic acid amide; wherein components (A) and (B) are employed in quantities which provide from about 0.2 to less than about 4 1,2-epoxy groups for each primary aromatic amine group.

Claim 32

A composition of claim 27 wherein (1) the temperature employed is not greater than about 130° C. and (2) components (A) and (B) are employed in quantities which provides from about 0.3 to about 1.9 or from about 2.1 to about 3.5 1,2-epoxy groups for each primary aromatic amine group.

Claim 33

A composition of claim 28 wherein the temperature employed is not greater than about 120° C.

Claim 34

A composition of claims 27, 28 or 29 wherein component (A) is an epoxy resin represented by the formulas I, II, III or IV as set forth in the specification or a mixture thereof wherein each A is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms, ##STR7## each A' is independently a divalent hydrocarbyl group having from 1 to about 10 carbon atoms; R is hydrogen or a hydrocarbyl group having from 1 to about 10 carbon atoms; each R' is independently hydrogen or a hydrocarbyl group having from 1 to about 4 carbon atoms; each X is independently hydrogen, a monovalent hydrocarbyl group having from 1 to about 10 carbon atoms or a halogen; n has a value of zero or 1; n' has a value of from about 1.01 to about 7; n" has a value of from about one to about 4; x has a value of from zero to about 4 and x' has a value of from zero to about 3 and wherein component (B) is sulfanilamide.

Claim 35

A composition of claim 30 wherein component (A) is (1) an epoxy resin represented by formula III; (2) a mixture of epoxy resins represented by formulas II and III; or (3) a mixture of epoxy resins represented by formulas III and IV; and wherein component (B) is sulfanilamide.

Claim 36

A composition of claim 31 wherein A is an isopropylidene group, A' is a methylene group, R is hydrogen, R' and X are hydrogen, and n, x and x' have a value of 1.