US4987673A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for packaging semiconductor devices
Assignee: Mitsubishi Electric Corp
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Filing: 1988-06-16
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Granted: 1991-01-29
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Expires: 2008-06-16
Abstract
Abstract An apparatus for packaging semiconductor devices includes a die bonder, a wire bonder, and a molding unit wherein the die bonder, the wire bonder, and the molding unit are sequentially arranged for operation in an uninterrupted continuous sequence. To prevent semiconductor dies from being contaminated by the dust generated by the molding unit, the die bonder and wire bonder are covered by an air cleaner chamber including an air filter and air ventilator. Alternatively, the molding unit is covered by an air draft chamber including an air supply nozzle and an exhaust pipe which exhausts the dust generated by the molding unit.
Inventors
- 👤 Masahisa Kogura
- 👤 Haruo Yoshida
- 👤 Minoru Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:49
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0451; H10P72/0468; F; F24; F24F; F24F3/00; F24F3/12; F24F3/16; F24F3/163; H10P72/0402; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/51; Y10T29/5136; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
188 words
An apparatus for attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads formed therein, said die bonder being disposed on and supported by said supporting bench; a wire bonder for connecting electrodes of a semiconductor die to said leads of the pattern of the respective lead frame with metallic wires, said wire bonder being disposed directly subsequent and adjacent to said die bonder and disposed on and supported by said supporting bench; molding means for molding and sealing each of said semiconductor dies with a predetermined portion of the respective lead frame into a resinous package, said molding means being disposed directly subsequent and adjacent to said wire bonder for performance of die bonding, wire bonding, and molding in an uninterrupted continuous sequence; and an air cleaner separating said die bonder and wire bonder from said molding means and supplying clean air to said die bonder and wire bonder but not to said molding means.
Claim 2
Independent Claim
188 words
An apparatus for attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads formed therein, said die bonder being disposed on and supported by said supporting bench; a wire bonder for connecting electrodes of a semiconductor die to said leads of the pattern of the respective lead frame with metallic wires, said wire bonder being disposed directly subsequent and adjacent to said die bonder and disposed on and supported by said supporting bench; molding means for molding and sealing each of said semiconductor dies with a predetermined portion of the respective lead frame into a resinous package, said molding means being disposed directly subsequent and adjacent to said wire bonder for performance of die bonding, wire bonding, and molding in an uninterrupted continuous sequence; and an air cleaner separating said die bonder and wire bonder from said molding means and supplying clean air to said die bonder and wire bonder but not to said molding means.
Claim 3
Independent Claim
194 words
An apparatus for providing attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads formed therein, said die bonder being disposed on and supported by said supporting bench; a wire bonder for connecting electrodes of a semiconductor die to said leads of the pattern of the respective lead frame with metallic wires, said wire bonder being disposed directly subsequent and adjacent to said die bonder and disposed on and supported by said supporting bench; molding means for molding and sealing each of said semiconductor dies with a predetermined portion of said lead frame into a resinous package, said molding means being disposed directly subsequent and adjacent to said wire bonder for performance of die bonding, wire bonding, and molding in an uninterrupted continuous sequence; and dust dispersion preventing means enclosing said molding means and separating said molding means from said die bonder and said wire bonder for preventing dust generated during molding from being dispersed to said die bonder and wire bonder.
Claim 4
Independent Claim
194 words
An apparatus for providing attaching leads to and encapsulating semiconductor dies comprising: a supporting bench; a die bonder for positioning and bonding semiconductor dies to respective predetermined locations on a respective one of a plurality of lead frames, each lead frame having a pattern of leads formed therein, said die bonder being disposed on and supported by said supporting bench; a wire bonder for connecting electrodes of a semiconductor die to said leads of the pattern of the respective lead frame with metallic wires, said wire bonder being disposed directly subsequent and adjacent to said die bonder and disposed on and supported by said supporting bench; molding means for molding and sealing each of said semiconductor dies with a predetermined portion of said lead frame into a resinous package, said molding means being disposed directly subsequent and adjacent to said wire bonder for performance of die bonding, wire bonding, and molding in an uninterrupted continuous sequence; and dust dispersion preventing means enclosing said molding means and separating said molding means from said die bonder and said wire bonder for preventing dust generated during molding from being dispersed to said die bonder and wire bonder.
Claim 5
Dependent Claim
93 words
An apparatus as claimed in claim 1 wherein said air cleaner comprises partitioning means defining an interior volume containing said die bonder and wire bonder and an exterior volume outside the interior volume and containing an air filter for removing dust from a flow of air passing through said air cleaner into the interior volume and air ventilation means for causing air to pass through said air filter into the interior volume, over and around said die bonder and wire bonder, and to be exhausted from the interior volume to the exterior volume.
Claim 6
Dependent Claim
62 words
An apparatus as claimed in claim 3 wherein said partitioning means comprises side partitions enclosing said die bonder and wire bonder within side walls, and said air filter is disposed on top of said side walls, said air ventilation means causing air to flow through said air cleaner in a vertical laminar flow over said die bonder and wire bonder from above.
Claim 7
Dependent Claim
57 words
An apparatus as claimed in claim 2 wherein said dust dispersion preventing means comprises a partitioning chamber enclosing said molding means, air supplying means for supplying a flow of air into said partitioning chamber, and air exhausting means for exhausting air which has passed through said partitioning chamber to remove dust therein generated by said molding means.
Claim 8
Dependent Claim
20 words
An apparatus as claimed in claim 5, wherein said air supplying means comprises a nozzle directed toward said molding means.
Claim 9
Dependent Claim
18 words
An apparatus as claimed in claim 5, wherein said air supplying means comprises means for supplying dry air.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-28 | 1994-07-30 | 1995-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-28 | 1998-07-30 | 1999-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-28 | 2002-07-30 | 2003-01-29 | $7700.00 | Window Closed / Lapsed |