Patent US3733777A successfully refreshed from Google Patents.
Patent US4985600A successfully refreshed from Google Patents.
US4985600A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board having an injection molded substrate
Assignee: Siemens AG
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Filing: 1989-09-13
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Granted: 1991-01-15
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Expires: 2009-09-13
Abstract
Abstract A printed circuit board includes an injection molded substrate having a pattern recessed in the substrate surface of interconnect traces, through-connections and contact rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the width of each trench-shaped depression is dimensioned narrowly in comparison of the width of each planar depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied, such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.
Inventors
- 👤 Marcel Heerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:02
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H05K1/116; H05K3/00; H05K3/10; H05K3/107; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K2201/09818; H05K2201/09827; H05K2201/09845; H05K2201/09981; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0574; H05K2203/14; H05K2203/1415; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K3/40; H05K3/42; H05K3/425; H05K3/426; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/4916; Y10T29/49165
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
122 words
A printed circuit board comprising: an injection molded substrate having a surface; a pattern of interconnect traces, through-connections and connecting pads recessed in said substrate surface formed by trench-shaped depressions in the region of each interconnect trace and by planar depressions in at least one of (a) the region of each through-connection or (b) the region of each connecting pad; and said planar and trench-shaped depressions having a conductive metal coat, the width of each trench-shaped depression being dimensioned narrowly in comparison to the width of each planar depression so that said metal coat fills each trench-shaped depression to the surface of the substrate, and in each planar depression a distance remains between the metal coat and the surface of the substrate.
Claim 2
Dependent Claim
122 words
A printed circuit board comprising: an injection molded substrate having a surface; a pattern of interconnect traces, through-connections and connecting pads recessed in said substrate surface formed by trench-shaped depressions in the region of each interconnect trace and by planar depressions in at least one of (a) the region of each through-connection or (b) the region of each connecting pad; and said planar and trench-shaped depressions having a conductive metal coat, the width of each trench-shaped depression being dimensioned narrowly in comparison to the width of each planar depression so that said metal coat fills each trench-shaped depression to the surface of the substrate, and in each planar depression a distance remains between the metal coat and the surface of the substrate.
Claim 3
Dependent Claim
21 words
A printed circuit board as claimed in claim 1 further comprising a tin layer applied by hot-tinning covering said metal coat.
Claim 4
Dependent Claim
21 words
A printed circuit board as claimed in claim 1 wherein said metal coat consists of copper chemically applied to said substrate.
Claim 5
Dependent Claim
17 words
A printed circuit board as claimed in claim 1 wherein each trench-shaped depression has a V-shaped cross-section.
Claim 6
Independent Claim
109 words
A method for manufacturing a circuit board comprising: generating a pattern of recesses in a surface of a substrate by forming a trench-shaped depression in the region of each interconnect trace and by forming a planar depression in at least one of (a) the region of each through-connection or (b) the region of each connecting pad, with each trench-shaped depression being narrow in comparison to each planar depression; and applying a metal coat to said substrate so that said metal coat fills each trench-shaped depression to the surface of the substrate and in each planar depression a distance remains between said metal coat and said surface of said substrate.
Claim 7
Independent Claim
109 words
A method for manufacturing a circuit board comprising: generating a pattern of recesses in a surface of a substrate by forming a trench-shaped depression in the region of each interconnect trace and by forming a planar depression in at least one of (a) the region of each through-connection or (b) the region of each connecting pad, with each trench-shaped depression being narrow in comparison to each planar depression; and applying a metal coat to said substrate so that said metal coat fills each trench-shaped depression to the surface of the substrate and in each planar depression a distance remains between said metal coat and said surface of said substrate.
Claim 8
Dependent Claim
22 words
A method as claimed in claim 5 comprising the additional step of: covering said metal coat with a tin layer by hot-tinning.
Claim 9
Dependent Claim
27 words
A method is claimed in claim 5 wherein the step of applying said metal coat is further defined by chemically applying a copper coat to said substrate.
Claim 10
Dependent Claim
125 words
A printed circuit board comprising: an injection molded substrate having a surface, the surface having a planar depression and a trench-shaped depression disposed therein, the trench-shaped depression having a metal coat to form an interconnect trace, the planar depression having a metal coat to form one of (a) a through-connection or (b) a connecting pad; the trench-shaped depression and the planar depression each having a width, the width of the planar depression being wider than the width of the trench-shaped depression so that when the metal coat is applied to the printed circuit board the metal coat fills the trench-shaped depression to the surface of the substrate while a distance remains between the metal coat and the surface of the substrate at the planar depression.
Claim 11
Dependent Claim
125 words
A printed circuit board comprising: an injection molded substrate having a surface, the surface having a planar depression and a trench-shaped depression disposed therein, the trench-shaped depression having a metal coat to form an interconnect trace, the planar depression having a metal coat to form one of (a) a through-connection or (b) a connecting pad; the trench-shaped depression and the planar depression each having a width, the width of the planar depression being wider than the width of the trench-shaped depression so that when the metal coat is applied to the printed circuit board the metal coat fills the trench-shaped depression to the surface of the substrate while a distance remains between the metal coat and the surface of the substrate at the planar depression.
Claim 12
Dependent Claim
21 words
A printed circuit board as claimed in claim 8, further comprising a tin layer applied by hot-tinning covering the metal coat.
Claim 13
Dependent Claim
20 words
A printed circuit board as claimed in claim 8, wherein the metal coat comprises copper chemically applied to the substrate.
Claim 14
Dependent Claim
17 words
A printed circuit board as claimed in claim 8, where the trench-shaped depression has a V-shaved cross-section.
Claim 15
Independent Claim
138 words
A method for manufacturing a circuit board from a substrate having a surface, the method comprising the steps of: forming a trench-shaped depression in the substrate in the region of an interconnect trace that is to be placed on the circuit board; forming a planar depression in the substrate in at least one of (a) the region of a through-connection that is to be disposed through the circuit board of (b) the region of a connecting pad that is to be placed on the circuit board, the trench-shaped depression being narrow in comparison to the planar depression; and applying a metal coat to the substrate so that the metal coat fills the trench-shaped depression to the surface of the substrate and in the planar depression a distance remains between the metal coat and the surface of the substrate.
Claim 16
Independent Claim
138 words
A method for manufacturing a circuit board from a substrate having a surface, the method comprising the steps of: forming a trench-shaped depression in the substrate in the region of an interconnect trace that is to be placed on the circuit board; forming a planar depression in the substrate in at least one of (a) the region of a through-connection that is to be disposed through the circuit board of (b) the region of a connecting pad that is to be placed on the circuit board, the trench-shaped depression being narrow in comparison to the planar depression; and applying a metal coat to the substrate so that the metal coat fills the trench-shaped depression to the surface of the substrate and in the planar depression a distance remains between the metal coat and the surface of the substrate.
Claim 17
Dependent Claim
22 words
A method as claimed in claim 12, further comprising the step of covering the metal coat with a tin layer by hot-tinning.
Claim 18
Dependent Claim
32 words
A method as claimed in claim 12, wherein the step of applying the metal coat is further defined by chemically applying a copper coat to the substrate to form the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-14 | 1994-07-16 | 1995-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-14 | 1998-07-16 | 1999-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-14 | 2002-07-16 | 2003-01-15 | $7700.00 | Window Closed / Lapsed |