Patent US4984466A successfully refreshed from Google Patents.
US4984466A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor pressure sensor
Assignee: Mitsubishi Electric Corp
•
Filing: 1990-05-31
•
Granted: 1991-01-15
•
Expires: 2010-05-31
Abstract
Abstract A semiconductor pressure sensor comprising two pressure sensing diaphragms attached to a support frame embedded within a bonding agent joining two parts of a housing which defines therein fluid passages in communication with two pressure sensing diaphragms. The support frame includes a support plate portion and terminal portions having the inner ends embedded within the bonding agent and the outer ends projecting outwardly of the bonding agent for external connections. The support frame is formed by cutting a lead frame, which has a support frame portion, terminal portions and a surrounding frame integrally connected together, substantially along the outer contour of the housing except for the terminals. A method for manufacturing the pressure sensor is also disclosed.
Inventors
- 👤 Katsuaki Yasui
- 👤 Yasuo Tada
- 👤 Akira Takashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:57
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/02; G01L9/04; G01L19/00; G01L19/0061; G01L19/0084; G01L19/14; G01L19/147; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49103
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
140 words
A semiconductor pressure sensor comprising: first and second identical pressure sensing diaphragms each having first and second pressure receiving surfaces and supported to align in a common plane in the same orientation; a housing including at least two parts connected by a bonding agent to define therein fluid passages in communication with said pressure sensing diaphragms; and an electrically conductive support frame supporting said pressure sensing diaphragms and embedded within said bonding agent between two parts of said housing, said support frame including a support plate portion and terminal portions having inner ends embedded within the bonding agent and outer ends projecting outwardly of the bonding agent for external connections, said support frame being formed by cutting a lead frame having a support frame portion and terminal portions substantially along an outer contour of the housing except for the terminals.
Claim 2
Dependent Claim
140 words
A semiconductor pressure sensor comprising: first and second identical pressure sensing diaphragms each having first and second pressure receiving surfaces and supported to align in a common plane in the same orientation; a housing including at least two parts connected by a bonding agent to define therein fluid passages in communication with said pressure sensing diaphragms; and an electrically conductive support frame supporting said pressure sensing diaphragms and embedded within said bonding agent between two parts of said housing, said support frame including a support plate portion and terminal portions having inner ends embedded within the bonding agent and outer ends projecting outwardly of the bonding agent for external connections, said support frame being formed by cutting a lead frame having a support frame portion and terminal portions substantially along an outer contour of the housing except for the terminals.
Claim 3
Dependent Claim
133 words
A method for manufacturing a semiconductor pressure sensor as claimed in claim 1, comprising the steps of: preparing an electrically conductive lead frame having a support plate for supporting a semiconductor pressure sensing diaphragm, n electrical terminal for external connection and a holding frame integrally connected and holding said support pate and said terminal; attaching a pressure sensing diaphragm to said support plate; electrically connecting said pressure sensing diaphragm to said terminals; bonding said lead frame between at least two parts of a housing which defines therein fluid passages in communication with said pressure sensing diaphragms with a bonding agent therebetween with said terminal of said lead frame partly extended outwardly of said housing; and cutting said lead frame substantially along the outer contour of said housing except for the outwardly extending terminals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-14 | 1994-07-16 | 1995-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-14 | 1998-07-16 | 1999-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-14 | 2002-07-16 | 2003-01-15 | $7700.00 | Window Closed / Lapsed |