Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
112 words
An apparatus for assembling semiconductor devices comprising: working means for processing partially fabricated articles from which semiconductor devices are being made; a transportation line for transporting the partially fabricated articles from said working means; checking means disposed outside said transportation line for checking articles processed by said working means for defects; and delivery means for selectively extracting from and returning to said transportation line a sample comprising less than one hundred percent of the articles processed by said working means, said delivery means moving the articles extracted from said transportation line to said checking means and returning the extracted articles to said transportation line from said checking means after checking for defects.
Claim 2
Independent Claim
112 words
An apparatus for assembling semiconductor devices comprising: working means for processing partially fabricated articles from which semiconductor devices are being made; a transportation line for transporting the partially fabricated articles from said working means; checking means disposed outside said transportation line for checking articles processed by said working means for defects; and delivery means for selectively extracting from and returning to said transportation line a sample comprising less than one hundred percent of the articles processed by said working means, said delivery means moving the articles extracted from said transportation line to said checking means and returning the extracted articles to said transportation line from said checking means after checking for defects.
Claim 3
Dependent Claim
48 words
An apparatus according to claim 1, wherein said working means is a wire bonding unit, each of the worked articles being a lead frame on which a semiconductor chip is mounted and which is connected to the semiconductor chip by wire bonding effected by said wire bonding unit.
Claim 4
Dependent Claim
36 words
An apparatus according to claim 1, wherein said working means is a die bonding unit, each of the processed articles being a lead frame on which a semiconductor chip is mounted by said die bonding unit.
Claim 5
Dependent Claim
21 words
An apparatus according to claim 1, comprising stock means disposed in said transportation line for receiving and stocking the processed articles.
Claim 6
Dependent Claim
20 words
An apparatus according to claim 4, wherein said delivery means is disposed between said working means and said stock means.
Claim 7
Dependent Claim
34 words
An apparatus according to claim 1, wherein said checking means includes an inspection support for supporting at least one processed article, and a microscope for observing the processed article supported on said inspection support.
Claim 8
Dependent Claim
33 words
An apparatus according to claim 6, wherein said microscope is movable in a longitudinal direction of a processed article supported on said inspection support in order to observe all of the processed article.
Claim 9
Dependent Claim
35 words
An assembly apparatus according to claim 6, wherein said inspection support is movable in a longitudinal direction of a processed article supported on said inspection support in order to observe all of the processed article.